Airline transmission structures in low temperature co-fired ceramic
    1.
    发明授权
    Airline transmission structures in low temperature co-fired ceramic 失效
    低温共烧陶瓷航空传输结构

    公开(公告)号:US5157364A

    公开(公告)日:1992-10-20

    申请号:US712176

    申请日:1991-05-22

    IPC分类号: H01P1/203

    CPC分类号: H01P1/20336 H01P1/20363

    摘要: An airline transmission structure in a low temperature co-fired ceramic ("LTCC"). A cavity is made within the LTCC structure. Ground planes surround the cavity. Electronic processing circuitry, such as an airline filter, is suspended within the cavity. Transmission lines are provided to connect the electronic circuitry to the electronic signals (typically microwave) which require processing. Full integration of the airline filter with other electronic circuitry in a single LTCC package is also shown.

    摘要翻译: 低温共烧陶瓷(“LTCC”)中的航空传输结构。 在LTCC结构内形成空腔。 地平面围绕着空腔。 诸如航空公司过滤器的电子处理电路悬挂在空腔内。 提供传输线以将电子电路连接到需要处理的电子信号(通常为微波)。 还显示了将Airline滤波器与单个LTCC封装中的其他电子电路完全集成。

    Multilayer electrical circuit structure including partially embedded
pins for external connection
    4.
    发明授权
    Multilayer electrical circuit structure including partially embedded pins for external connection 失效
    多层电路结构包括用于外部连接的部分嵌入式引脚

    公开(公告)号:US5386085A

    公开(公告)日:1995-01-31

    申请号:US88964

    申请日:1993-07-02

    摘要: An electrically conductive stripline (16) is formed on a thermally fusible sheet (10), with a portion (16a) of the stripline (16) extending adjacent to an edge (10a) of the sheet (10). A cavity (18) is formed in another thermally fusible sheet (12) having an end (18) at an edge (12a) thereof. The sheets (10,12) are laminated together with their edges (10a,12a) aligned, and the cavity (18) aligned with and facing the edge portion (16a) of the stripline (16). A retaining pin (20) may be temporarily inserted into the cavity (18) to prevent collapse thereof during the lamination step. The laminated sheets (10,12) are heated to thermally fuse them together. An electrically conductive pin (28) is partially inserted into the cavity (18) and ohmically bonded to the stripline (18) to provide an external connection.

    摘要翻译: 导电带状线(16)形成在热熔片(10)上,带状线(16)的一部分(16a)邻近片(10)的边缘(10a)延伸。 在另一个具有在其边缘(12a)处具有端部(18)的热熔片(12)中形成空腔(18)。 片材(10,12)以它们的边缘(10a,12a)对齐的方式层叠在一起,并且空腔(18)与带状线(16)的边缘部分(16a)对准并且面对着带状线(16)的边缘部分(16a)。 可以将保持销(20)临时插入空腔(18)中,以防止在层压步骤期间其折叠。 层叠片(10,12)被加热以将它们热熔合在一起。 导电销(28)部分地插入到空腔(18)中并且欧姆接合到带状线(18)以提供外部连接。

    Method of fabricating a multilayer electrical circuit structure
    6.
    发明授权
    Method of fabricating a multilayer electrical circuit structure 失效
    制造多层电路结构的方法

    公开(公告)号:US5249355A

    公开(公告)日:1993-10-05

    申请号:US785859

    申请日:1991-10-31

    摘要: An electrically conductive stripline (16) is formed on a thermally fusible sheet (10), with a portion (16a) of the stripline (16) extending adjacent to an edge (10a) of the sheet (10). A cavity (18) is formed in another thermally fusible sheet (12) having an end (18a) at an edge (12a) thereof. The sheets (10,12) are laminated together with their edges (10a,12a) aligned, and the cavity (18) aligned with and facing the edge portion (16a) of the stripline (16). A retaining pin (20) may be temporarily inserted into the cavity (18) to prevent collapse thereof during the lamination step. The laminated sheets (10,12) are heated to thermally fuse them together. An electrically conductive pin (28) is partially inserted into the cavity (18) and ohmically bonded to the stripline (18) to provide an external connection.

    摘要翻译: 导电带状线(16)形成在热熔片(10)上,带状线(16)的一部分(16a)邻近片(10)的边缘(10a)延伸。 在另一个热熔片(12)上形成有一个在其边缘(12a)具有一端(18a)的空腔(18)。 片材(10,12)以它们的边缘(10a,12a)对齐的方式层叠在一起,并且空腔(18)与带状线(16)的边缘部分(16a)对准并且面对着带状线(16)的边缘部分(16a)。 可以将保持销(20)临时插入空腔(18)中,以防止在层压步骤期间其折叠。 层叠片(10,12)被加热以将它们热熔合在一起。 导电销(28)部分地插入到空腔(18)中并且欧姆接合到带状线(18)以提供外部连接。

    Trimming passive components buried in multilayer structures
    7.
    发明授权
    Trimming passive components buried in multilayer structures 失效
    修剪埋在多层结构中的被动元件

    公开(公告)号:US4792779A

    公开(公告)日:1988-12-20

    申请号:US183521

    申请日:1988-04-18

    摘要: A technique is disclosed for trimming resistors and other passive circuit components buried in hybrid multilayer circuit structures. For example, resistors (13) are formed between two dielectric layers (11, 19) of a hybrid multilayer circuit structure (10). The multilayer circuit structure with the buried resistors is appropriately processed to provide a fired multilayer circuit structure. Trimming of the buried resistors is accomplished with a laser beam that cuts through dielectric material of the fired circuit structure to selectively remove part of the resistive material of the buried resistors. The values of the buried resistors may be tested with conductive elements (15, 17) that are conductively coupled to the buried resistors. The disclosed technique also contemplates the trimming of other buried passive circuit components such as capacitors, and further contemplates the use of other trimming methods such as abrasive, air jet, or water jet trimming.

    摘要翻译: 公开了一种用于微调电阻器和埋在混合多层电路结构中的其它无源电路元件的技术。 例如,电阻器(13)形成在混合多层电路结构(10)的两个电介质层(11,19)之间。 适当地处理具有埋入电阻器的多层电路结构以提供烧制的多层电路结构。 掩埋电阻器的修整通过切割烧结电路结构的介电材料的激光束来实现,以选择性地去除掩埋电阻器的电阻材料的一部分。 可以使用导电耦合到埋入式电阻器的导电元件(15,17)来测试掩埋电阻器的值。 所公开的技术还考虑了诸如电容器之类的其它被掩埋的无源电路部件的修整,并且进一步考虑使用其它修整方法,例如磨料,空气喷射或水射流修整。