摘要:
A WiFi wireless rear view parking system comprises a main body, a camera sensor, a Wifi transmission module, a mobile personal electronic device, and a switch. The main body is installed at a license plate of an automobile. The camera sensor is provided in the main body for sensing images and video of rear regions of the automobile and generating images and video data. The Wifi transmission module transmits the image and video data from the camera. The mobile personal electronic device is for receiving image and video data transmitted by the Wifi transmission module and displaying them. The switch is provided in the display device or the mobile personal electronic device and configured for switching orientation of a view by flipping reverse and non-reverse, wherein the view is displayed on the mobile personal electronic device. The WiFi wireless rear view parking system provides rear view of the automobile to a driver. The mobile personal electronic device includes a smartphone.
摘要:
A method of fabricating a semiconductor device includes forming a lower interfacial layer on a semiconductor layer, the lower interfacial layer being a nitride layer, forming an intermediate interfacial layer on the lower interfacial layer, the intermediate interfacial layer being an oxide layer, and forming a high-k dielectric layer on the intermediate interfacial layer. The high-k dielectric layer has a dielectric constant that is higher than dielectric constants of the lower interfacial layer and the intermediate interfacial layer.
摘要:
Methods of manufacturing a semiconductor device include forming a gate insulation layer including a high-k dielectric material on a substrate that is divided into a first region and a second region; forming a diffusion barrier layer including a first metal on a second portion of the gate insulation layer in the second region; forming a diffusion layer on the gate insulation layer and the diffusion barrier layer; and diffusing an element of the diffusion layer into a first portion of the gate insulation layer in the first region.
摘要:
An insulation layer is formed on a substrate having an NMOS region and a PMOS region defined therein. A first conductive layer is formed on the insulation layer in the PMOS region, leaving a portion of the insulation layer in the NMOS region exposed. Nitriding is performed to produce a first nitrogen concentration in the insulation layer in the NMOS region and a second nitrogen concentration less than the first nitrogen concentration in the insulation layer in the PMOS region. A second conductive layer is formed on the insulation layer and the first conductive layer and the first and second conductive layers and the insulation layer are patterned to form a first gate structure and a second gate structure in the NMOS region and the PMOS region, respectively.
摘要:
A semiconductor device, including a device isolation layer arranged on a predetermined region of a semiconductor substrate to define an active region, the active region including a central top surface of a (100) crystal plane and an inclined edge surface extending from the central top surface to the device isolation layer, a semiconductor pattern covering the central top surface and the inclined edge surface of the active region, the semiconductor pattern including a flat top surface of a (100) crystal plane that is parallel with the central top surface of the active region and a sidewall that is substantially perpendicular to the flat top surface, and a gate pattern overlapping the semiconductor pattern.
摘要:
A motion transmitting remote control assembly (20) of the type for transmitting motion in a curved path by a flexible core element (22) in a conduit (24) is secured to a support structure (76) having a U-shaped slot. A coupling body (36) surrounds the core element (22) and is surrounded by a support body (66) for attachment to the support structure (76). A flange (42) extends radially about the coupling body (36) and is disposed axially between a first and second ends (38, 40) of the coupling body (36). First and second isolators (52, 54) surround the coupling body (36) on opposite sides of the flange (42) and include first and second ribs (63, 64) projecting radially from first and second head portions (61, 62) of the isolators (52, 54). The first and second ribs (63, 64) contact an inner radial surface (122) of the support body (66) thereby spacing the first and second head portions (61, 62) from the support body (66).
摘要:
Dual stress liners for CMOS applications are provided. The dual stress liners can be formed from silicon nitride having a first portion for inducing a first stress and a second portion for inducing a second stress. An interface between the first and second stress portions is self-aligned and co-planar. To produce a co-planar self-aligned interface, polishing, for example, mechanical chemical polishing is used.
摘要:
In a semiconductor device having a dual stress liner for improving electron mobility, the dual stress liner includes a first liner portion formed on a PMOSFET and a second liner portion formed on an NMOSFET. The first liner portion has a first compressive stress, and the second liner portion has a second compressive stress smaller than the first compressive stress. The dual stress liner may be formed by forming a stress liner on a semiconductor substrate on which the PMOSFET and the NMOSFET are formed and selectively exposing a portion of the stress liner on the NMOSFET.
摘要:
The present invention relates to an electric power saving apparatus wherein light energy is irradiated to a semiconductor device, with the light energy emitted when a voltage is supplied to a transmission line, such that the wavelengths of the electrons on the transmission line, along which a load-driving current flows are elongated, and the spin motions and vibration states of the electrons are stabilized, thereby reducing the collision of electrons in order to reduce the loss of energy, and wherein the light energy irradiated to the semiconductor device is continuously supplied thereto, by the use of an infrared ray emitting diode during operation, thereby maintaining the power saving effects with stability and continuity.
摘要:
A method of cleaning a silicon nitride layer on a substrate is provided to effectively remove negative-charged impurities such as polymer and particle from the silicon nitride layer. In the method, the zeta potential of the silicon nitride layer is changed from positive to negative, and then the silicon nitride layer is cleaned with a first solution selected from an alkali solution and an NC-2 solution. So the negatively-charged impurities can be easily removed due to a repulsion force. The substrate can be treated with spin scrubber or quick dump rinse before and/or after the changing of the zeta potential. To change the zeta potential, the substrate can be dipped into a second solution such as an SC-1 solution, an NC-2 solution, and an alkali solution.