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公开(公告)号：US09147252B2
公开(公告)日：2015-09-29
申请号：US13330003
申请日：2011-12-19
Applicant: Jason Davis , Juha Koljonen
Inventor： Jason Davis , Juha Koljonen
CPC classification number: G06T7/0042 , G06K9/469 , G06T7/12 , G06T7/162 , G06T7/73
Abstract: A method is provided for dividing a pattern into a plurality of sub-patterns, each sub-pattern being adapted for use with an image search method that can provide a plurality of sub-pattern search results. The method represents the pattern as a plurality of feature points, generates candidate partitions of the plurality of feature points, and then scores the candidate partitions by examining characteristics of each potential sub-pattern of each candidate partition. The highest-scoring partition is selected, and then it is applied to the plurality of feature points, creating one or more sub-pluralities of features. The invention advantageously provides a plurality of sub-patterns where each sub-pattern contains enough information to be located with a feature-based search method, where that information has been pre-evaluated as being useful and particularly adapted for running feature-based searches.
Abstract translation: 提供了一种用于将图案划分成多个子图案的方法，每个子图案适于与能够提供多个子图案搜索结果的图像搜索方法一起使用。 该方法表示作为多个特征点的图案，生成多个特征点的候选分区，然后通过检查每个候选分区的每个潜在子模式的特征来对候选分区进行分数。 选择最高分数分区，然后将其应用于多个特征点，创建一个或多个子多个特征。 本发明有利地提供了多个子模式，其中每个子模式包含足够的信息以使用基于特征的搜索方法来定位，其中该信息已被预先评估为有用的并且特别适用于运行基于特征的搜索。
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公开(公告)号：US07242801B1
公开(公告)日：2007-07-10
申请号：US10443580
申请日：2003-05-22
Applicant: Aaron Wallack , Juha Koljonen , David Michael
Inventor： Aaron Wallack , Juha Koljonen , David Michael
IPC: G06K9/34
CPC classification number: G06T5/002 , G06T5/10 , G06T5/20 , G06T7/0004 , G06T2207/20056 , G06T2207/30148
Abstract: Digital image processing methods are applied to an image of a semiconductor interconnection pad to preprocess the image prior to an inspection or registration. An image of a semiconductor pads exhibiting spatial patterns from structure, texture or features are filtered without affecting features in the image not associated with structure or texture. The filtered image is inspected in a probe mark inspection operation.
Abstract translation: 数字图像处理方法应用于半导体互连焊盘的图像，以便在检查或注册之前对图像进行预处理。 在结构，纹理或特征上呈现空间图案的半导体焊盘的图像被过滤而不影响图像中与结构或纹理无关的特征。 在探针标记检查操作中检查过滤图像。
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公开(公告)号：US5912984A
公开(公告)日：1999-06-15
申请号：US769739
申请日：1996-12-19
Applicant: David J. Michael , Juha Koljonen , Sanjay Nichani , Peter Roberts
Inventor： David J. Michael , Juha Koljonen , Sanjay Nichani , Peter Roberts
CPC classification number: G06T7/001 , B23K3/08 , G06T7/0028 , G06T7/2053 , H05K3/3484 , B23K2201/40 , G06T2207/30152 , H05K1/0269 , H05K2203/163 , H05K3/1216
Abstract: Inspection of solder paste on a printed circuit board using a before printing image (pre-image) to normalize an after printing image (post-image) of the printed circuit board. Existing lighting and optics used for alignment of the screen printing stencil to the printed circuit board are used for the solder paste inspection. A stencil in the screen printing process is also inspected using a before printing image (pre) to normalize an after printing image (post) of the stencil.
Abstract translation: 使用之前打印的图像（预图像）检查印刷电路板上的焊膏以使印刷电路板的后打印图像（后图像）归一化。 用于将丝网印刷模板对准印刷电路板的现有照明和光学装置用于焊膏检查。 丝网印刷过程中的模板也使用之前的打印图像（预）进行检查，以对印版图像（后）进行归一化。
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公开(公告)号：US08189904B2
公开(公告)日：2012-05-29
申请号：US12948437
申请日：2010-11-17
Applicant: Aaron S. Wallack , Juha Koljonen , David J. Michael
Inventor： Aaron S. Wallack , Juha Koljonen , David J. Michael
IPC: G06K9/00
CPC classification number: G06K9/4619 , G06T5/002 , G06T5/10 , G06T7/0004 , G06T2207/30148 , G06T2207/30152
Abstract: Digital image processing methods are applied to an image of a semiconductor interconnection pad to preprocess the image prior to an inspection or registration. An image of a semiconductor pads exhibiting spatial patterns from structure, texture or features are filtered without affecting features in the image not associated with structure or texture. The filtered image is inspected in a probe mark inspection operation.
Abstract translation: 数字图像处理方法应用于半导体互连焊盘的图像，以便在检查或注册之前对图像进行预处理。 在结构，纹理或特征上呈现空间图案的半导体焊盘的图像被过滤而不影响图像中与结构或纹理无关的特征。 在探针标记检查操作中检查过滤图像。
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公开(公告)号：US07885453B1
公开(公告)日：2011-02-08
申请号：US11759590
申请日：2007-06-07
Applicant: Aaron S. Wallack , Juha Koljonen , David J. Michael
Inventor： Aaron S. Wallack , Juha Koljonen , David J. Michael
IPC: G06K9/00
CPC classification number: G06K9/4619 , G06T5/002 , G06T5/10 , G06T7/0004 , G06T2207/30148 , G06T2207/30152
Abstract: Digital image processing methods are applied to an image of a semiconductor interconnection pad to preprocess the image prior to an inspection or registration. An image of a semiconductor pads exhibiting spatial patterns from structure, texture or features are filtered without affecting features in the image not associated with structure or texture. The filtered image is inspected in a probe mark inspection operation.
Abstract translation: 数字图像处理方法应用于半导体互连焊盘的图像，以便在检查或注册之前对图像进行预处理。 在结构，纹理或特征上呈现空间图案的半导体焊盘的图像被过滤而不影响图像中与结构或纹理无关的特征。 在探针标记检查操作中检查过滤图像。
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Patent Agency Ranking
公开(公告)号：US06768812B1
公开(公告)日：2004-07-27
申请号：US09538939
申请日：2000-03-31
Applicant: Juha Koljonen
Inventor： Juha Koljonen
IPC: G06K900
CPC classification number: G01N21/95607 , G01N21/8806
Abstract: A method is provided for locating features of an object using varied lighting. An object is illuminated and a first digital image of the object is acquired. An illumination of the object is varied and a second digital image of the object is acquired while a camera and the object are in a same position as the camera and the object were during the acquiring of the first digital image. One of the first and the second digital image is subtracted from another of the first and the second digital image to produce a difference image. At least one feature of the object is located based on the difference image.
Abstract translation: 提供一种用于使用各种照明来定位物体的特征的方法。 对象被照亮并且获取对象的第一数字图像。 物体的照明是变化的，并且当相机和对象处于与照相机相同的位置并且在获取第一数字图像期间获取对象的第二数字图像时。 从第一和第二数字图像中的另一个中减去第一和第二数字图像中的一个以产生差分图像。 基于差异图像来定位对象的至少一个特征。
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公开(公告)号：US06636298B1
公开(公告)日：2003-10-21
申请号：US10024404
申请日：2001-12-18
Applicant: Ivan Bachelder , Yusuf Akgul , Prabhav Morje , Juha Koljonen
Inventor： Ivan Bachelder , Yusuf Akgul , Prabhav Morje , Juha Koljonen
IPC: G01N2100
CPC classification number: G01N21/8806
Abstract: A method is provided for obtaining a focused image of an object in an application of machine vision in an optical inspection system. A coarse focus setting is first obtained by maximizing a coarse feature sharpness measurement performed on an image of the object of inspection. Then, a fine focus setting is obtained by maximizing a fine feature sharpness measurement performed on a portion of an image of the object of inspection. Finally, the fine focused image can be further analyzed, inspected, or otherwise processed.
Abstract translation: 提供一种用于在光学检查系统中获得机器视觉应用中的对象的聚焦图像的方法。 首先通过最大化对检查对象的图像执行的粗糙特征锐度测量来获得粗略聚焦设置。 然后，通过最大化对检查对象的图像的一部分执行的精细特征锐度测量来获得精细聚焦设置。 最后，精细聚焦的图像可以进一步分析，检查或以其他方式处理。
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8.发明授权公开(公告)号：US06317513B2
公开(公告)日：2001-11-13
申请号：US09156918
申请日：1998-09-18
Applicant: David J. Michael , Juha Koljonen
Inventor： David J. Michael , Juha Koljonen
IPC: G06K900
CPC classification number: B23K3/08 , B23K2101/40 , G06T7/001 , G06T7/254 , G06T7/33 , G06T2207/30152 , H05K1/0269 , H05K3/1216 , H05K3/3484 , H05K2203/163
Abstract: Inspection of solder paste on a printed circuit board using a before printing image (pre-application image) to normalize an after printing image (post-application image) of the printed circuit board. Existing lighting and optics used for alignment of the screen-printing stencil to the printed circuit board are used for the solder paste inspection. An embodiment is described wherein pad regions of the printed circuit board are inspected for information about the solder paste applied on the pad regions of the printed circuit board. A stencil in the screen printing process is also inspected using a before printing image (pre-application) to normalize an after printing image (post-application) of the stencil.
Abstract translation: 使用之前的打印图像（预应用图像）检查印刷电路板上的焊膏以使印刷电路板的印后图像（后应用图像）归一化。 用于将丝网印刷模板对准印刷电路板的现有照明和光学器件用于焊膏检查。 描述了一种实施例，其中检查印刷电路板的焊盘区域以获得关于施加在印刷电路板的焊盘区域上的焊膏的信息。 丝网印刷过程中的模板也使用之前的打印图像（预先应用）进行检查，以对印版图像进行归一化（后应用）。
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公开(公告)号：US5901241A
公开(公告)日：1999-05-04
申请号：US759853
申请日：1996-12-02
Applicant: Juha Koljonen , David J. Michael
Inventor： Juha Koljonen , David J. Michael
CPC classification number: G06K9/4633 , G06T7/0004 , G06T7/004 , G06T7/602 , G06T7/606 , G06T2207/30152
Abstract: The invention automatically inspects the bond of a wire to a contact pad on a semiconductor chip. The apparatus includes a movable platform for holding semiconductor chips situated in lead frames; a video camera for sensing images; illumination means for illuminating a chip in a lead frame; an image processor to digitize and analyze the images; a bonding mechanism; and a host controller electronically connected to bonding mechanism, movable platform, video camera, and image processor. Image processor locates a bond on a pad in a digitized image and provides a first nominal center of ball bond image. The invention aligns the center of a polar coordinate transform image having one or more segments with the nominal center of ball bond image and evaluates ball bond image using the polar coordinate transform image to create a polar projection histogram array and store it. An edge filter is applied to histogram array to detect peaks and store their number and values. Polar coordinate transform image is aligned with a next nominal ball center location until a predetermined number of potential ball center locations is exhausted. The maximum peak in the list of stored peaks is selected as the radius of bond from which the size and position of bond is computed and reported to host controller for further action.
Abstract translation: 本发明自动检查导线与半导体芯片上接触焊盘的接合。 该装置包括用于保持位于引线框架中的半导体芯片的可移动平台; 用于感测图像的摄像机; 用于照亮引线框架中的芯片的照明装置; 图像处理器，用于数字化和分析图像; 粘合机制; 以及主机控制器，电连接到接合机构，可移动平台，摄像机和图像处理器。 图像处理器将数字化图像中的焊盘定位在焊盘上，并提供第一个标称中心的焊球图像。 本发明将具有一个或多个段的极坐标变换图像的中心与球形接合图像的标称中心对准，并使用极坐标变换图像评估球接合图像，以创建极性投影直方图阵列并将其存储。 边缘滤波器应用于直方图阵列以检测峰值并存储其数量和值。 极坐标变换图像与下一个标称球中心位置对齐，直到预定数量的潜在球中心位置被耗尽。 选择存储峰值列表中的最大峰值作为键的半径，从中计算结合的大小和位置并将其报告给主机控制器进行进一步的操作。
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公开(公告)号：US5532739A
公开(公告)日：1996-07-02
申请号：US389437
申请日：1995-02-15
Applicant: Arman M. Garakani , Juha Koljonen
Inventor： Arman M. Garakani , Juha Koljonen
CPC classification number: H01L24/85 , B23K20/007 , B23K31/12 , B23K37/04 , G01R31/04 , G01R31/309 , G06T11/00 , G06T7/001 , G06T7/0024 , H01L24/78 , G06T2207/30152 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/49171 , H01L2224/7865 , H01L2224/85205 , H01L2224/859 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/01322 , H01L2924/14
Abstract: This invention provides a method and apparatus for automatically locating the bond of a wire to a lead flame and semiconductor chip or similar device as an in-process operation to facilitate in-process inspection. The apparatus includes a wire bonding machine, or similar apparatus, having a movable platform such as an X-Y table for holding semiconductor chips situated in lead frames; a video camera or other optical sensing or imaging device for generating images, which camera is typically positioned over the target chip and lead flame to be bonded; illumination means for illuminating the chip in a lead flame; an image processor capable of digitizing and analyzing the optically sensed images; a bonding mechanism; and a host controller connected to the bonding mechanism, the movable platform, the camera and the image processor. The apparatus generates and stores a pre-bond digital image of the semiconductor chip in the lead flame before bonding has occurred; connects one or more wires between the chip and lead frame by any of a number of means such as ultrasonic bonding, heat bonding, conductive glue bonding or other means; generates and stores a post-bond digital image of the now-bonded chip in its lead frame; registers the pre-bond and post-bond stored digital images so that analysis can be done; and permits inspection of the results of the wire bonds according to appropriate criteria.
Abstract translation: 本发明提供了一种用于自动地将引线键合到引线火焰和半导体芯片或类似装置的方法和装置，作为在线操作以便于在线检查。 该装置包括具有诸如X-Y工作台的可移动平台的引线接合机或类似装置，用于保持位于引线框架中的半导体芯片; 用于产生图像的摄像机或其他光学感测或成像装置，该相机通常位于目标芯片上方并且要接合的引导火焰; 用于在铅火焰中照射芯片的照明装置; 能够数字化和分析光学感测图像的图像处理器; 粘合机制; 以及连接到接合机构，可移动平台，相机和图像处理器的主机控制器。 在发生接合之前，该装置产生并存储在铅火焰中的半导体芯片的预结合数字图像; 通过诸如超声波接合，热粘合，导电胶粘或其它方式的任何一种手段来连接芯片和引线框架之间的一条或多条线; 在其引线框中产生并存储现在粘合的芯片的后绑定数字图像; 注册预先存储和后结合存储的数字图像，以便进行分析; 并且可以根据适当的标准检查引线结果。
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