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公开(公告)号：US07326754B2
公开(公告)日：2008-02-05
申请号：US11248490
申请日：2005-10-12
申请人： Nikola A. Nikolic , Ruzhi Zhang , Osama M. Musa , Hwail Jin , Bing Wu , David Shenfield
发明人： Nikola A. Nikolic , Ruzhi Zhang , Osama M. Musa , Hwail Jin , Bing Wu , David Shenfield
IPC分类号： C08F136/56 , C08F136/02 , C08F236/56 , C08F236/10
CPC分类号： C08F267/10 , C08L25/00 , C08L33/00 , C08L55/00 , C09J5/10 , C09J11/06 , C09J2205/114 , C09J2425/00 , C09J2433/00 , C09J2455/00
摘要： This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality.
摘要翻译： 本发明是由包含聚合物体系，成膜橡胶化合物和用于聚合物体系的固化剂的粘合剂组合物制备的薄膜粘合剂。 聚合物体系包括基础聚合物和电子给体和电子受体官能团。
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公开(公告)号：US6165613A
公开(公告)日：2000-12-26
申请号：US264999
申请日：1999-03-09
IPC分类号： C09D201/00 , C09J11/06 , H01L21/58 , H01L23/31 , H01L23/495 , B32B15/04 , B32B7/12 , C08K3/10
CPC分类号： H01L24/31 , C09D201/00 , C09J11/06 , H01L23/3171 , H01L23/49513 , H01L24/83 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/15747 , H01L2924/15787 , Y10T428/2852 , Y10T428/287 , C08L2666/28 , H01L2924/00
摘要： This invention is an adhesive paste that consists essentially of a polymeric resin in particulate form and a carrier for the resin. The polymeric resin is present as particles with a particles size of 50 microns or smaller, is insoluble in the carrier at ambient temperature, and is soluble in the carrier at a temperature above ambient temperature. The carrier either reacts with the resin to form a covalent bond, or vaporizes from the adhesive paste, at a temperature above the temperature at which the resin is soluble in the carrier. The paste contains no inorganic fillers, holds its geometry on application, and fuses to a void-free bond.
摘要翻译： 本发明是一种基本上由颗粒形式的聚合物树脂和用于树脂的载体组成的粘合剂浆料。 聚合物树脂以粒径为50微米或更小的颗粒存在，在环境温度下不溶于载体，并且在高于环境温度的温度下可溶于载体。 载体与树脂反应形成共价键，或者在高于树脂可溶于载体的温度的温度下从粘合剂浆料中蒸发。 糊状物不含无机填料，在使用时保持其几何形状，并熔化成无空隙键。
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公开(公告)号：US20060134901A1
公开(公告)日：2006-06-22
申请号：US11275080
申请日：2005-12-08
申请人： Raghunandan Chaware , Xiping He , David Shenfield
发明人： Raghunandan Chaware , Xiping He , David Shenfield
IPC分类号： H01L21/44
CPC分类号： H01L21/563 , H01L24/29 , H01L2224/16 , H01L2224/16225 , H01L2224/274 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81193 , H01L2224/83191 , H01L2224/83856 , H01L2224/94 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01056 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2224/13111 , H01L2924/00 , H01L2224/27 , H01L2224/11 , H01L2224/0401
摘要： This invention provides a process for applying a wafer level underfill comprising: providing a solvent-free hot-melt underfill composition; melting the underfill; applying the underfill in a uniform layer to the active side of a semiconductor wafer; returning the underfill to a solid state; optionally B-staging the underfill; optionally removing any excess underfill from the bumps on the wafer; and dicing the wafer into individual dies.
摘要翻译： 本发明提供了一种施加晶片级底层填料的方法，包括：提供无溶剂的热熔底层填充组合物; 融化底部填充物; 将底层填料均匀地施加到半导体晶片的活性侧; 将底部填充物恢复到固体状态; 可选地分选底层填料; 任选地从晶片上的凸起去除任何多余的底部填充物; 并将晶片切割成单独的模具。
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公开(公告)号：US20050137340A1
公开(公告)日：2005-06-23
申请号：US11044374
申请日：2005-01-27
申请人： Nikola Nikolic , Ruzhi Zhang , Osama Musa , Hwail Jin , Bing Wu , David Shenfield
发明人： Nikola Nikolic , Ruzhi Zhang , Osama Musa , Hwail Jin , Bing Wu , David Shenfield
IPC分类号： C09J7/00 , C08L25/00 , C08L33/00 , C08L55/00 , C09J5/10 , C09J11/06 , C09J109/02 , C09J125/08 , C09J133/00 , C09J133/20 , C09J157/00 , C09J201/00 , C09J201/02 , C08L1/00
CPC分类号： C08F267/10 , C08L25/00 , C08L33/00 , C08L55/00 , C09J5/10 , C09J11/06 , C09J2205/114 , C09J2425/00 , C09J2433/00 , C09J2455/00
摘要： This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality.
摘要翻译： 本发明是由包含聚合物体系，成膜橡胶化合物和用于聚合物体系的固化剂的粘合剂组合物制备的薄膜粘合剂。 聚合物体系包括基础聚合物和电子给体和电子受体官能团。
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