公开(公告)号：US20050022929A1

公开(公告)日：2005-02-03

申请号：US10867652

申请日：2004-06-15

Applicant: Rainer Schoenfeld ,  Hubert Schumann

Inventor： Rainer Schoenfeld ,  Hubert Schumann

IPC: C08L55/00 ,  C08L63/00 ,  C09J5/06 ,  C09J163/00 ,  C09J201/00 ,  B32B31/00

CPC classification number: C09J163/00 ,  C08L55/00 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/24 ,  C09J5/06 ,  C09J201/00 ,  C09J2400/163 ,  C09J2400/226 ,  C09J2455/00 ,  C09J2463/00

Abstract: Hot-curing structural adhesives with multiphase polymer morphology, wherein the binder matrix of the cured chemically reactive adhesive displays (a) a continuous phase containing a polymer P1 having a glass transition temperature of over 100° C.; (b) a heterodisperse phase consisting of individual continuous domains of a thermoplastic or elastomeric polymer P2 having a glass transition temperature of below −30° C. and an average particle size of between 0.5 and 50 μm, which itself contains separate phases of another thermoplastic or elastomeric polymer P3 having a glass transition temperature of below −30° C. and a size of between 1 nm and 100 nm, parts of which can be in aggregated form as larger agglomerates; and (c) another heterodisperse phase embedded in the continuous phase and consisting of domains of the polymer P3, at least parts of which have an average particle size of between 1 nm and 50 nm, wherein P3 is not identical to P2; are suitable as high-strength, impact resistant structural adhesives, for internal stiffeners for cavities in automobile construction and for the production of reinforcing coatings for thin-wall sheet components.

Abstract translation: 具有多相聚合物形态的热固化结构粘合剂，其中固化的化学反应性粘合剂的粘合剂基质显示（a）含有玻璃化转变温度超过100℃的聚合物P1的连续相; （b）由玻璃化转变温度低于-30℃的平均粒径为0.5-50微米的热塑性或弹性体聚合物P2的单独连续区组成的异分散相，其本身包含另一种热塑性塑料 或具有低于-30℃的玻璃化转变温度和1nm至100nm的尺寸的弹性体聚合物P3，其中的部分可以作为较大的附聚物呈聚集形式; 和（c）嵌入在连续相中并由聚合物P3的结构域组成的另一个异分散相，其中至少部分具有1nm至50nm的平均粒度，其中P3与P2不相同; 适用于高强度，耐冲击的结构粘合剂，用于汽车结构中的腔的内部加强件以及用于生产用于薄壁片材部件的增强涂层。

公开(公告)号：US20060030672A1

公开(公告)日：2006-02-09

申请号：US11248490

申请日：2005-10-12

Applicant: Nikola Nikolic ,  Ruzhi Zhang ,  Osama Musa ,  Hwail Jin ,  Bing Wu

Inventor： Nikola Nikolic ,  Ruzhi Zhang ,  Osama Musa ,  Hwail Jin ,  Bing Wu

IPC: C08F267/10 ,  C08F32/00

CPC classification number: C08F267/10 ,  C08L25/00 ,  C08L33/00 ,  C08L55/00 ,  C09J5/10 ,  C09J11/06 ,  C09J2205/114 ,  C09J2425/00 ,  C09J2433/00 ,  C09J2455/00

Abstract: This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality.

公开(公告)号：US20050137340A1

公开(公告)日：2005-06-23

申请号：US11044374

申请日：2005-01-27

Applicant: Nikola Nikolic ,  Ruzhi Zhang ,  Osama Musa ,  Hwail Jin ,  Bing Wu ,  David Shenfield

Inventor： Nikola Nikolic ,  Ruzhi Zhang ,  Osama Musa ,  Hwail Jin ,  Bing Wu ,  David Shenfield

IPC: C09J7/00 ,  C08L25/00 ,  C08L33/00 ,  C08L55/00 ,  C09J5/10 ,  C09J11/06 ,  C09J109/02 ,  C09J125/08 ,  C09J133/00 ,  C09J133/20 ,  C09J157/00 ,  C09J201/00 ,  C09J201/02 ,  C08L1/00

CPC classification number: C08F267/10 ,  C08L25/00 ,  C08L33/00 ,  C08L55/00 ,  C09J5/10 ,  C09J11/06 ,  C09J2205/114 ,  C09J2425/00 ,  C09J2433/00 ,  C09J2455/00

Abstract: This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality.

Abstract translation: 本发明是由包含聚合物体系，成膜橡胶化合物和用于聚合物体系的固化剂的粘合剂组合物制备的薄膜粘合剂。 聚合物体系包括基础聚合物和电子给体和电子受体官能团。

公开(公告)号：US20060234044A1

公开(公告)日：2006-10-19

申请号：US11401870

申请日：2006-04-12

Applicant: Toru Nakanishi ,  Kazunori Kondo ,  Shigehiro Hoshida ,  Tadashi Amano

Inventor： Toru Nakanishi ,  Kazunori Kondo ,  Shigehiro Hoshida ,  Tadashi Amano

IPC: B32B7/12 ,  B32B3/00

CPC classification number: C08L55/02 ,  B32B7/12 ,  B32B15/06 ,  B32B15/092 ,  B32B15/16 ,  B32B15/20 ,  B32B25/08 ,  B32B25/16 ,  B32B27/08 ,  B32B27/18 ,  B32B27/26 ,  B32B27/38 ,  B32B2264/104 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/5825 ,  B32B2405/00 ,  B32B2457/00 ,  C08J5/125 ,  C08K5/521 ,  C08L33/00 ,  C08L33/08 ,  C08L33/20 ,  C08L55/00 ,  C08L61/00 ,  C08L63/00 ,  C08L67/00 ,  C08L2666/02 ,  C08L2666/14 ,  C09J7/10 ,  C09J11/06 ,  C09J113/00 ,  C09J133/08 ,  C09J133/20 ,  C09J155/02 ,  C09J163/00 ,  C09J2433/00 ,  C09J2455/00 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2467/00 ,  C09K21/12 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0355 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31721

Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties). The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate.

公开(公告)号：US06949602B2

公开(公告)日：2005-09-27

申请号：US10326300

申请日：2002-12-19

Applicant: Donald E. Gosiewski ,  Brian Rice

Inventor： Donald E. Gosiewski ,  Brian Rice

IPC: C09J163/00 ,  C08L51/04 ,  C08L55/02 ,  C08L63/00 ,  C09J4/02 ,  C09J4/06 ,  C09J5/04 ,  C09J5/06 ,  C09J11/08 ,  C09J133/00 ,  C09J133/02 ,  C09J133/12 ,  C09J133/14 ,  C09J163/02 ,  C09J163/10 ,  C08L51/00

CPC classification number: C09J5/06 ,  C08L51/04 ,  C08L55/02 ,  C08L63/00 ,  C08L2666/02 ,  C09J4/06 ,  C09J163/10 ,  C09J2451/00 ,  C09J2455/00 ,  C09J2463/00 ,  C08F285/00 ,  C08F283/10

Abstract: A heat and impact resistant adhesive is disclosed. The adhesive can include at least one acrylic-based monomer, at least epoxy based monomer/resin, at least one bifunctional monomer chemically reactive with the acrylic-based monomer and the epoxy based monomer/resin, at least one impact modifier, and a catalyst system.

Abstract translation: 公开了耐热和耐冲击的粘合剂。 粘合剂可以包括至少一种基于丙烯酸的单体，至少环氧基单体/树脂，至少一种与丙烯酸类单体和环氧基单体/树脂化学反应的双官能单体，至少一种抗冲改性剂和催化剂 系统。

公开(公告)号：US07524394B2

公开(公告)日：2009-04-28

申请号：US11401854

申请日：2006-04-12

Applicant: Toru Nakanishi ,  Kazunori Kondo ,  Shigehiro Hoshida ,  Tadashi Amano

Inventor： Toru Nakanishi ,  Kazunori Kondo ,  Shigehiro Hoshida ,  Tadashi Amano

IPC: B32B37/12 ,  B32B27/38 ,  C08L63/00 ,  C09J163/00

CPC classification number: H05K3/386 ,  B32B7/12 ,  B32B15/06 ,  B32B15/092 ,  B32B15/16 ,  B32B15/20 ,  B32B25/08 ,  B32B25/16 ,  B32B27/08 ,  B32B27/18 ,  B32B27/26 ,  B32B27/38 ,  B32B2264/104 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/5825 ,  B32B2405/00 ,  B32B2457/00 ,  C08J5/125 ,  C08K5/3462 ,  C08K5/34922 ,  C08K5/5205 ,  C08L33/08 ,  C08L33/20 ,  C08L55/02 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/14 ,  C09J7/10 ,  C09J11/06 ,  C09J113/00 ,  C09J133/08 ,  C09J133/20 ,  C09J155/02 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2455/00 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2467/00 ,  C09K21/12 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2203/122 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31721

Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil; and a method of bonding two substrates, including the steps of sandwiching the above adhesive sheet between two substrates, and curing the adhesive sheet. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and anti-migration properties. The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate. The adhesive sheet can be used for a method of bonding two substrates.

Abstract translation: 本发明提供阻燃性粘合剂组合物，其包含（A）无卤环氧树脂，（B）热塑性树脂和/或合成橡胶，（C）固化剂，（D）含氮多磷酸盐化合物和（ E）固化促进剂。 还提供了具有包含上述组合物的层的粘合片和用于覆盖包含该组合物的层的保护层; 具有电绝缘膜的覆盖层膜和设置在膜顶部的包含上述组合物的层; 具有电绝缘膜的柔性覆铜层压板，设置在膜顶部的上述组成的层和铜箔; 以及将两个基板接合的方法，包括将上述粘合片夹在两个基板之间并固化粘合片的步骤。 还提供了粘合片的制造方法，覆盖膜的制造方法以及制造柔性覆铜层压体的方法。 无卤粘合剂组合物在固化时产生固化产物，其显示出优异的阻燃性和抗迁移性能。 该组合物可用于生产粘合片，覆盖膜和柔性覆铜层压板。 粘合片可以用于粘合两个基底的方法。

公开(公告)号：US07326754B2

公开(公告)日：2008-02-05

申请号：US11248490

申请日：2005-10-12

Applicant: Nikola A. Nikolic ,  Ruzhi Zhang ,  Osama M. Musa ,  Hwail Jin ,  Bing Wu ,  David Shenfield

Inventor： Nikola A. Nikolic ,  Ruzhi Zhang ,  Osama M. Musa ,  Hwail Jin ,  Bing Wu ,  David Shenfield

IPC: C08F136/56 ,  C08F136/02 ,  C08F236/56 ,  C08F236/10

CPC classification number: C08F267/10 ,  C08L25/00 ,  C08L33/00 ,  C08L55/00 ,  C09J5/10 ,  C09J11/06 ,  C09J2205/114 ,  C09J2425/00 ,  C09J2433/00 ,  C09J2455/00

Abstract: This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality.

Abstract translation: 本发明是由包含聚合物体系，成膜橡胶化合物和用于聚合物体系的固化剂的粘合剂组合物制备的薄膜粘合剂。 聚合物体系包括基础聚合物和电子给体和电子受体官能团。

公开(公告)号：US20040118514A1

公开(公告)日：2004-06-24

申请号：US10326300

申请日：2002-12-19

Inventor： Donald E. Gosiewski ,  Brian Rice

IPC: C09J163/00

CPC classification number: C09J5/06 ,  C08L51/04 ,  C08L55/02 ,  C08L63/00 ,  C08L2666/02 ,  C09J4/06 ,  C09J163/10 ,  C09J2451/00 ,  C09J2455/00 ,  C09J2463/00 ,  C08F285/00 ,  C08F283/10

Abstract: A heat and impact resistant adhesive is disclosed. The adhesive can include at least one acrylic-based monomer, at least epoxy based monomer/resin, at least one bifunctional monomer chemically reactive with the acrylic-based monomer and the epoxy based monomer/resin, at least one impact modifier, and a catalyst system.

Abstract translation: 公开了耐热和耐冲击的粘合剂。 粘合剂可以包括至少一种基于丙烯酸的单体，至少环氧基单体/树脂，至少一种与丙烯酸类单体和环氧基单体/树脂化学反应的双官能单体，至少一种抗冲改性剂和催化剂 系统。

公开(公告)号：US20240026195A1

公开(公告)日：2024-01-25

申请号：US18032894

申请日：2022-09-05

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Noriyuki UCHIDA ,  Takuma GOTOU

IPC: C09J153/02 ,  C08J3/28 ,  C09J7/25 ,  C09J7/30 ,  C09J153/00

CPC classification number: C09J153/02 ,  C08J3/28 ,  C09J7/255 ,  C09J7/30 ,  C09J153/00 ,  C09J2203/326 ,  C09J2301/122 ,  C09J2467/006 ,  C09J2467/001 ,  C09J2453/00 ,  C09J2455/00

Abstract: The present invention aims to provide an adhesive tape for semiconductor device production which exhibits excellent chip component separability and can reduce adhesive deposits on chip components. Provided is an adhesive tape for semiconductor device production, including: a substrate; an ablation layer; a barrier layer; and a first adhesive layer in this order.

公开(公告)号：US07524563B2

公开(公告)日：2009-04-28

申请号：US11401870

申请日：2006-04-12

Applicant: Toru Nakanishi ,  Kazunori Kondo ,  Shigehiro Hoshida ,  Tadashi Amano

Inventor： Toru Nakanishi ,  Kazunori Kondo ,  Shigehiro Hoshida ,  Tadashi Amano

IPC: B32B27/38 ,  B32B37/12 ,  C08L63/00 ,  C09J163/00

CPC classification number: C08L55/02 ,  B32B7/12 ,  B32B15/06 ,  B32B15/092 ,  B32B15/16 ,  B32B15/20 ,  B32B25/08 ,  B32B25/16 ,  B32B27/08 ,  B32B27/18 ,  B32B27/26 ,  B32B27/38 ,  B32B2264/104 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/5825 ,  B32B2405/00 ,  B32B2457/00 ,  C08J5/125 ,  C08K5/521 ,  C08L33/00 ,  C08L33/08 ,  C08L33/20 ,  C08L55/00 ,  C08L61/00 ,  C08L63/00 ,  C08L67/00 ,  C08L2666/02 ,  C08L2666/14 ,  C09J7/10 ,  C09J11/06 ,  C09J113/00 ,  C09J133/08 ,  C09J133/20 ,  C09J155/02 ,  C09J163/00 ,  C09J2433/00 ,  C09J2455/00 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2467/00 ,  C09K21/12 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0355 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31721

Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties). The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate.

Abstract translation: 本发明提供一种阻燃性粘合剂组合物，其包含（A）无卤环氧树脂，（B）热塑性树脂和/或合成橡胶，（C）固化剂，（D）植酸盐化合物和（E） 固化促进剂。 还提供了具有包含上述组合物的层的粘合片和用于覆盖包含该组合物的层的保护层; 具有电绝缘膜的覆盖层膜和设置在膜顶部的包含上述组合物的层; 以及具有电绝缘膜的柔性覆铜层压板，设置在膜顶部的上述组成的层和铜箔。 还提供了粘合片的制造方法，覆盖膜的制造方法以及制造柔性覆铜层压体的方法。 无卤粘合剂组合物在固化时产生固化产物，其表现出优异的阻燃性和电特性（抗迁移性）。 该组合物可用于生产粘合片，覆盖膜和柔性覆铜层压板。