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公开(公告)号:US5229550A
公开(公告)日:1993-07-20
申请号:US847122
申请日:1992-03-31
申请人: Perminder S. Bindra , Dennis A. Canfield , Voya Rista Markovich , Jeffrey McKeveny , Robert E. Ruane , Edwin L. Thomas
发明人: Perminder S. Bindra , Dennis A. Canfield , Voya Rista Markovich , Jeffrey McKeveny , Robert E. Ruane , Edwin L. Thomas
CPC分类号: H05K3/462 , H05K3/445 , H05K1/0272 , H05K2201/0305 , H05K2201/0373 , H05K2201/09536 , H05K2201/09563 , H05K2201/09572 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/054 , H05K3/0023 , H05K3/28 , H05K3/36 , H05K3/4038 , H05K3/4069 , H05K3/4076 , H05K3/423 , H05K3/428
摘要: A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.
摘要翻译: 公开了一种用于制造高密度电路板的结构和方法。 在电路化电源核心上使用光敏或其他电介质材料,通孔和焊盘被打开,填充有接合金属并与下一级对齐,从而消除了建立高密度复合材料的主要配准问题,并减少了 制造工艺。
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公开(公告)号:US5318803A
公开(公告)日:1994-06-07
申请号:US614669
申请日:1990-11-13
申请人: Harry R. Bickford , Dennis A. Canfield , Arthur E. Graham , Stephen L. Tisdale , Alfred Viehbeck
发明人: Harry R. Bickford , Dennis A. Canfield , Arthur E. Graham , Stephen L. Tisdale , Alfred Viehbeck
摘要: A dielectric substrate is conditioned for subsequent electroless plating thereon by contacting with a catalytic metal salt and then with a reducing agent and with an electroless metal plating bath followed by contacting with a second catalytic metal salt. In addition, a dielectric substrate is conditioned for electroless plating thereon by obtaining a substrate of a dielectric material that contains metal particles therein and contacting with a catalytic metal salt.
摘要翻译: 通过与催化金属盐接触,然后与还原剂和无电金属电镀浴接触,然后与第二催化金属盐接触,对电介质基板进行后续的化学镀处理。 此外,通过获得在其中含有金属颗粒并与催化金属盐接触的电介质材料的基底,调节电介质基板上的化学镀。
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公开(公告)号:US5129142A
公开(公告)日:1992-07-14
申请号:US605615
申请日:1990-10-30
申请人: Perminder S. Bindra , Dennis A. Canfield , Voya R. Markovich , Jeffrey McKeveny , Robert E. Ruane , Edwin L. Thomas
发明人: Perminder S. Bindra , Dennis A. Canfield , Voya R. Markovich , Jeffrey McKeveny , Robert E. Ruane , Edwin L. Thomas
CPC分类号: H05K3/462 , H05K3/445 , H05K1/0272 , H05K2201/0305 , H05K2201/0373 , H05K2201/09536 , H05K2201/09563 , H05K2201/09572 , H05K2201/096 , H05K2203/0307 , H05K2203/054 , H05K3/0023 , H05K3/28 , H05K3/36 , H05K3/4038 , H05K3/4069 , H05K3/4076 , H05K3/423 , H05K3/428 , Y10T29/49126 , Y10T29/49165
摘要: A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.
摘要翻译: 公开了一种用于制造高密度电路板的结构和方法。 在电路化电源核心上使用光敏或其他电介质材料,通孔和焊盘被打开,填充有接合金属并与下一级对齐,从而消除了建立高密度复合材料的主要配准问题,并减少了 制造工艺。
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