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    Metal film bonded body, bonding agent layer and bonding agent
    6.
    发明授权
    Metal film bonded body, bonding agent layer and bonding agent 失效
    金属膜涂层体，粘合剂层和粘合剂

    公开(公告)号：US06607825B1

    公开(公告)日：2003-08-19

    申请号：US08894376

    申请日：1997-08-22

    申请人： Dong Dong Wang ,  Motoo Asai

    发明人： Dong Dong Wang ,  Motoo Asai

    IPC分类号： B32B712

    CPC分类号： B32B15/08 ,  B32B7/12 ,  H05K3/0023 ,  H05K3/181 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/0773 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/287 ,  Y10T428/2878 ,  Y10T442/64

    摘要： As a technique capable of stably providing various metal film adhered bodies for printed circuit boards having an excellent peel strength even in the wiring having higher density and higher pattern accuracy and other industrial parts, there are provided adhesive, adhesive layer and metal film adhered body in which a mixed resin consisting of a thermoplastic resin and an uncured thermosetting resin including a resin substituted at a part of its functional group with a photosensitive group and/or an uncured photosensitive resin is used as a heat-resistant resin matrix constituting the adhesive and further a cured homogeneous resin composite forming a quasi-homogeneous compatible structure, co-continuous phase structure or spherical domain structure is used as a heat-resistant resin matrix of the adhesive layer.

    摘要翻译： 作为能够稳定地提供具有优异剥离强度的印刷电路板的各种金属膜粘合体的技术，即使在具有更高密度和更高图案精度的布线等工业部件中，也提供了粘合剂，粘合剂层和金属膜粘合体 作为构成粘合剂的耐热树脂基质，使用由热塑性树脂和包含在其官能团的一部分被感光性基团取代的树脂和/或未固化的感光性树脂组成的未固化的热固性树脂的混合树脂 使用形成准均相相容结构，共连续相结构或球形结构的固化均匀树脂复合材料作为粘合层的耐热树脂基体。