公开(公告)号：US06294621B1

公开(公告)日：2001-09-25

申请号：US09552644

申请日：2000-04-19

申请人： Dong Dong Wang ,  Motoo Asai

发明人： Dong Dong Wang ,  Motoo Asai

IPC分类号： C08K900

CPC分类号： H05K3/387 ,  C08L63/00 ,  C08L71/00 ,  C08L81/06 ,  C08L101/00 ,  H05K3/181 ,  H05K3/4661 ,  H05K3/4676 ,  H05K2201/0129 ,  H05K2201/0212 ,  H05K2203/0773 ,  C08L2666/22 ,  C08L2666/02 ,  C08L2666/04

摘要： A novel resin composite consists or a thermosetting resin or photosensitive resin and a thermoplastic resin and has a quasi-homogeneous compatible structure not only having properties inherent to the thermosetting or photosensitive resin but also exhibiting values of properties higher than those inherent to the thermoplastic resin.

摘要翻译： 新型树脂复合体由热固性树脂或感光性树脂和热塑性树脂组成，并且具有准均相的结构，不仅具有热固性或感光性树脂固有的特性，而且还具有高于热塑性树脂固有的性能值。

公开(公告)号：US06265498B1

公开(公告)日：2001-07-24

申请号：US09552643

申请日：2000-04-19

申请人： Dong Dong Wang ,  Motoo Asai

发明人： Dong Dong Wang ,  Motoo Asai

IPC分类号： C08F28300

CPC分类号： H05K3/387 ,  C08L63/00 ,  C08L71/00 ,  C08L81/06 ,  C08L101/00 ,  H05K3/181 ,  H05K3/4661 ,  H05K3/4676 ,  H05K2201/0129 ,  H05K2201/0212 ,  H05K2203/0773 ,  C08L2666/22 ,  C08L2666/02 ,  C08L2666/04

摘要： A novel resin composite consists of a thermosetting resin or photosensitive resin and a thermoplastic resin and has a quasi-homogeneous compatible structure not only having properties inherent to the thermosetting or photosensitive resin but also exhibiting values of properties higher than those inherent to the thermoplastic resin.

摘要翻译： 一种新型树脂复合材料由热固性树脂或感光树脂和热塑性树脂组成，并且具有准均相的结构，不仅具有热固性或感光性树脂固有的特性，而且还具有比热塑性树脂固有的性能更高的特性值。

公开(公告)号：US5994480A

公开(公告)日：1999-11-30

申请号：US941397

申请日：1997-09-30

申请人： Dong Dong Wang ,  Motoo Asai

发明人： Dong Dong Wang ,  Motoo Asai

IPC分类号： C08L63/00 ,  C08L71/00 ,  C08L81/06 ,  C08L101/00 ,  H05K1/00 ,  H05K3/18 ,  H05K3/38 ,  H05K3/46 ,  C08F283/00

CPC分类号： H05K3/387 ,  C08L101/00 ,  C08L63/00 ,  C08L71/00 ,  C08L81/06 ,  H05K2201/0129 ,  H05K2201/0212 ,  H05K2203/0773 ,  H05K3/181 ,  H05K3/4661 ,  H05K3/4676

摘要： A novel resin composite consists of a thermosetting resin or photosensitive resin and a thermoplastic resin and has a quasi-homogeneous compatible structure not only having properties inherent to the thermosetting or photosensitive resin but also exhibiting values of properties higher than those inherent to the thermoplastic resin.

公开(公告)号：US06451932B1

公开(公告)日：2002-09-17

申请号：US09552641

申请日：2000-04-19

申请人： Dong Dong Wang ,  Motoo Asai

发明人： Dong Dong Wang ,  Motoo Asai

IPC分类号： C08F28300

CPC分类号： H05K3/387 ,  C08L63/00 ,  C08L71/00 ,  C08L81/06 ,  C08L101/00 ,  H05K3/181 ,  H05K3/4661 ,  H05K3/4676 ,  H05K2201/0129 ,  H05K2201/0212 ,  H05K2203/0773 ,  C08L2666/22 ,  C08L2666/02 ,  C08L2666/04

摘要： A novel resin composite consists of a thermosetting resin or photosensitive resin and a thermoplastic resin and has a quasi-homogeneous compatible structure not only having properties inherent to the thermosetting or photosensitive resin but also exhibiting values of properties higher than those inherent to the thermoplastic resin.

摘要翻译： 一种新型树脂复合材料由热固性树脂或感光树脂和热塑性树脂组成，并且具有准均相的结构，不仅具有热固性或感光性树脂固有的特性，而且还具有比热塑性树脂固有的性能更高的特性值。

公开(公告)号：US06306980B1

公开(公告)日：2001-10-23

申请号：US09552642

申请日：2000-04-19

申请人： Dong Dong Wang ,  Motoo Asai

发明人： Dong Dong Wang ,  Motoo Asai

IPC分类号： C08F28300

CPC分类号： H05K3/387 ,  C08L63/00 ,  C08L71/00 ,  C08L81/06 ,  C08L101/00 ,  H05K3/181 ,  H05K3/4661 ,  H05K3/4676 ,  H05K2201/0129 ,  H05K2201/0212 ,  H05K2203/0773 ,  C08L2666/22 ,  C08L2666/02 ,  C08L2666/04

摘要： A novel resin composite consists of a thermosetting resin or photosensitive resin and a thermoplastic resin and has a guasi-homogeneous compatible structure not only having properties inherent to the thermosetting or photosensitive resin but also exhibiting values of properties higher than those inherent to the thermoplastic resin.

摘要翻译： 一种新型树脂复合材料由热固性树脂或感光性树脂和热塑性树脂组成，并且具有不仅具有热固性或感光性树脂固有性能，而且具有高于热塑性树脂固有性能的特性值的均匀相容的结构。

公开(公告)号：US06607825B1

公开(公告)日：2003-08-19

申请号：US08894376

申请日：1997-08-22

申请人： Dong Dong Wang ,  Motoo Asai

发明人： Dong Dong Wang ,  Motoo Asai

IPC分类号： B32B712

CPC分类号： B32B15/08 ,  B32B7/12 ,  H05K3/0023 ,  H05K3/181 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/0773 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/287 ,  Y10T428/2878 ,  Y10T442/64

摘要： As a technique capable of stably providing various metal film adhered bodies for printed circuit boards having an excellent peel strength even in the wiring having higher density and higher pattern accuracy and other industrial parts, there are provided adhesive, adhesive layer and metal film adhered body in which a mixed resin consisting of a thermoplastic resin and an uncured thermosetting resin including a resin substituted at a part of its functional group with a photosensitive group and/or an uncured photosensitive resin is used as a heat-resistant resin matrix constituting the adhesive and further a cured homogeneous resin composite forming a quasi-homogeneous compatible structure, co-continuous phase structure or spherical domain structure is used as a heat-resistant resin matrix of the adhesive layer.

摘要翻译： 作为能够稳定地提供具有优异剥离强度的印刷电路板的各种金属膜粘合体的技术，即使在具有更高密度和更高图案精度的布线等工业部件中，也提供了粘合剂，粘合剂层和金属膜粘合体 作为构成粘合剂的耐热树脂基质，使用由热塑性树脂和包含在其官能团的一部分被感光性基团取代的树脂和/或未固化的感光性树脂组成的未固化的热固性树脂的混合树脂 使用形成准均相相容结构，共连续相结构或球形结构的固化均匀树脂复合材料作为粘合层的耐热树脂基体。

公开(公告)号：US6124408A

公开(公告)日：2000-09-26

申请号：US258199

申请日：1999-02-26

申请人： Dong Dong Wang ,  Motoo Asai

发明人： Dong Dong Wang ,  Motoo Asai

IPC分类号： C08L63/00 ,  C08L71/00 ,  C08L81/06 ,  C08L101/00 ,  H05K1/00 ,  H05K3/18 ,  H05K3/38 ,  H05K3/46 ,  C08F283/00

CPC分类号： H05K3/387 ,  C08L101/00 ,  C08L63/00 ,  C08L71/00 ,  C08L81/06 ,  H05K2201/0129 ,  H05K2201/0212 ,  H05K2203/0773 ,  H05K3/181 ,  H05K3/4661 ,  H05K3/4676

摘要： A novel resin composite consists of a thermosetting resin or photosensitive resin and a thermoplastic resin and has a quasi-homogeneous compatible structure not only having properties inherent to the thermosetting or photosensitive resin but also exhibiting values of properties higher than those inherent to the thermoplastic resin.

公开(公告)号：US08830691B2

公开(公告)日：2014-09-09

申请号：US12784634

申请日：2010-05-21

申请人： Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

发明人： Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

IPC分类号： H05K1/18

CPC分类号： H05K1/181 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L24/16 ,  H01L24/17 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/185 ,  H05K1/186 ,  H05K1/187 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

摘要： A printed circuit board including a core substrate including a first resin substrate, a second resin substrate having an opening and a third resin substrate in a multilayer manner while interposing bonding plates, insulating layers and conductive circuit layers alternately laminated on the core substrate, solder bumps formed on an outer surface of the printed circuit board, a first capacitor formed in the opening of the second resin substrate, a conductive pad formed on the first resin substrate and connected to an electrode of the first capacitor, a via hole formed in the first resin substrate and directly connected to the conductive pad and a conductive circuit on the core substrate, and a second capacitor mounted on a surface of the printed circuit board.

摘要翻译： 一种印刷电路板，包括具有第一树脂基板的芯基板，具有开口的第二树脂基板和第三树脂基板，同时插入在芯基板上交替层叠的接合板，绝缘层和导电电路层，焊料凸块 形成在所述印刷电路板的外表面上的第一电容器，形成在所述第二树脂基板的开口中的第一电容器，形成在所述第一树脂基板上并连接到所述第一电容器的电极的导电焊盘， 树脂基板，并且直接连接到导电焊盘和芯基板上的导电电路，以及安装在印刷电路板的表面上的第二电容器。

公开(公告)号：US08780573B2

公开(公告)日：2014-07-15

申请号：US13665325

申请日：2012-10-31

申请人： Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi

发明人： Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

IPC分类号： H05K1/16

CPC分类号： H05K1/115 ,  H01G2/06 ,  H01G4/12 ,  H01G4/224 ,  H01G4/228 ,  H01G4/248 ,  H01G4/40 ,  H01L21/4857 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05027 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/112 ,  H05K1/181 ,  H05K1/183 ,  H05K1/185 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611

摘要： A printed circuit board includes an accommodating layer, chip capacitor devices accommodated in the accommodating layer, and a buildup structure formed on the accommodating layer such that the buildup structure covers the chip capacitor devices in the accommodating layer. The buildup structure has mounting conductor structures positioned to mount an IC chip device on a surface of the buildup structure such that the IC chip device is mounted directly over the chip capacitor devices, each of the chip capacitor devices has a dielectric body having a surface facing the buildup structure, a first electrode formed on the dielectric body and extending on the surface of the dielectric body, and a second electrode formed on the dielectric body and extending on the surface of the dielectric body, and the dielectric body is interposed between the first electrode and the second electrode.

摘要翻译： 印刷电路板包括容纳层，容纳层中容纳的片状电容器器件，以及形成在容纳层上的堆积结构，使得堆积结构覆盖容纳层中的片状电容器器件。 积层结构具有安装导体结构，其被定位成将IC芯片装置安装在积层结构的表面上，使得IC芯片装置直接安装在芯片电容器装置上，每个芯片电容器装置具有电介质体， 所述积聚结构，形成在所述电介质体上且在所述电介质体的表面上延伸的第一电极，以及形成在所述电介质体上并在所述电介质体的表面上延伸的第二电极，并且所述电介质体介于所述第一电极 电极和第二电极。

公开(公告)号：US08745863B2

公开(公告)日：2014-06-10

申请号：US13169674

申请日：2011-06-27

申请人： Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

发明人： Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

IPC分类号： H01K3/10

CPC分类号： H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

摘要： A method of manufacturing a multi-layer printed circuit board includes the following steps (A) and (B). (A) Providing penetrating openings which are formed into through holes and each of which has a small diameter for a core substrate, and (B) providing penetrating openings which are formed into through holes each having a large diameter for the core substrate.

摘要翻译： 制造多层印刷电路板的方法包括以下步骤（A）和（B）。 （A）提供穿透开口，其形成为通孔，并且每个具有用于芯基板的小直径，以及（B）提供形成为具有用于芯基板的大直径的通孔的穿透开口。