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公开(公告)号:US5994480A
公开(公告)日:1999-11-30
申请号:US941397
申请日:1997-09-30
申请人: Dong Dong Wang , Motoo Asai
发明人: Dong Dong Wang , Motoo Asai
IPC分类号: C08L63/00 , C08L71/00 , C08L81/06 , C08L101/00 , H05K1/00 , H05K3/18 , H05K3/38 , H05K3/46 , C08F283/00
CPC分类号: H05K3/387 , C08L101/00 , C08L63/00 , C08L71/00 , C08L81/06 , H05K2201/0129 , H05K2201/0212 , H05K2203/0773 , H05K3/181 , H05K3/4661 , H05K3/4676
摘要: A novel resin composite consists of a thermosetting resin or photosensitive resin and a thermoplastic resin and has a quasi-homogeneous compatible structure not only having properties inherent to the thermosetting or photosensitive resin but also exhibiting values of properties higher than those inherent to the thermoplastic resin.
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公开(公告)号:US06451932B1
公开(公告)日:2002-09-17
申请号:US09552641
申请日:2000-04-19
申请人: Dong Dong Wang , Motoo Asai
发明人: Dong Dong Wang , Motoo Asai
IPC分类号: C08F28300
CPC分类号: H05K3/387 , C08L63/00 , C08L71/00 , C08L81/06 , C08L101/00 , H05K3/181 , H05K3/4661 , H05K3/4676 , H05K2201/0129 , H05K2201/0212 , H05K2203/0773 , C08L2666/22 , C08L2666/02 , C08L2666/04
摘要: A novel resin composite consists of a thermosetting resin or photosensitive resin and a thermoplastic resin and has a quasi-homogeneous compatible structure not only having properties inherent to the thermosetting or photosensitive resin but also exhibiting values of properties higher than those inherent to the thermoplastic resin.
摘要翻译: 一种新型树脂复合材料由热固性树脂或感光树脂和热塑性树脂组成,并且具有准均相的结构,不仅具有热固性或感光性树脂固有的特性,而且还具有比热塑性树脂固有的性能更高的特性值。
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公开(公告)号:US06306980B1
公开(公告)日:2001-10-23
申请号:US09552642
申请日:2000-04-19
申请人: Dong Dong Wang , Motoo Asai
发明人: Dong Dong Wang , Motoo Asai
IPC分类号: C08F28300
CPC分类号: H05K3/387 , C08L63/00 , C08L71/00 , C08L81/06 , C08L101/00 , H05K3/181 , H05K3/4661 , H05K3/4676 , H05K2201/0129 , H05K2201/0212 , H05K2203/0773 , C08L2666/22 , C08L2666/02 , C08L2666/04
摘要: A novel resin composite consists of a thermosetting resin or photosensitive resin and a thermoplastic resin and has a guasi-homogeneous compatible structure not only having properties inherent to the thermosetting or photosensitive resin but also exhibiting values of properties higher than those inherent to the thermoplastic resin.
摘要翻译: 一种新型树脂复合材料由热固性树脂或感光性树脂和热塑性树脂组成,并且具有不仅具有热固性或感光性树脂固有性能,而且具有高于热塑性树脂固有性能的特性值的均匀相容的结构。
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公开(公告)号:US06294621B1
公开(公告)日:2001-09-25
申请号:US09552644
申请日:2000-04-19
申请人: Dong Dong Wang , Motoo Asai
发明人: Dong Dong Wang , Motoo Asai
IPC分类号: C08K900
CPC分类号: H05K3/387 , C08L63/00 , C08L71/00 , C08L81/06 , C08L101/00 , H05K3/181 , H05K3/4661 , H05K3/4676 , H05K2201/0129 , H05K2201/0212 , H05K2203/0773 , C08L2666/22 , C08L2666/02 , C08L2666/04
摘要: A novel resin composite consists or a thermosetting resin or photosensitive resin and a thermoplastic resin and has a quasi-homogeneous compatible structure not only having properties inherent to the thermosetting or photosensitive resin but also exhibiting values of properties higher than those inherent to the thermoplastic resin.
摘要翻译: 新型树脂复合体由热固性树脂或感光性树脂和热塑性树脂组成,并且具有准均相的结构,不仅具有热固性或感光性树脂固有的特性,而且还具有高于热塑性树脂固有的性能值。
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公开(公告)号:US06265498B1
公开(公告)日:2001-07-24
申请号:US09552643
申请日:2000-04-19
申请人: Dong Dong Wang , Motoo Asai
发明人: Dong Dong Wang , Motoo Asai
IPC分类号: C08F28300
CPC分类号: H05K3/387 , C08L63/00 , C08L71/00 , C08L81/06 , C08L101/00 , H05K3/181 , H05K3/4661 , H05K3/4676 , H05K2201/0129 , H05K2201/0212 , H05K2203/0773 , C08L2666/22 , C08L2666/02 , C08L2666/04
摘要: A novel resin composite consists of a thermosetting resin or photosensitive resin and a thermoplastic resin and has a quasi-homogeneous compatible structure not only having properties inherent to the thermosetting or photosensitive resin but also exhibiting values of properties higher than those inherent to the thermoplastic resin.
摘要翻译: 一种新型树脂复合材料由热固性树脂或感光树脂和热塑性树脂组成,并且具有准均相的结构,不仅具有热固性或感光性树脂固有的特性,而且还具有比热塑性树脂固有的性能更高的特性值。
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公开(公告)号:US06607825B1
公开(公告)日:2003-08-19
申请号:US08894376
申请日:1997-08-22
申请人: Dong Dong Wang , Motoo Asai
发明人: Dong Dong Wang , Motoo Asai
IPC分类号: B32B712
CPC分类号: B32B15/08 , B32B7/12 , H05K3/0023 , H05K3/181 , H05K3/4661 , H05K2201/0129 , H05K2201/0209 , H05K2201/0212 , H05K2203/0773 , Y10T428/25 , Y10T428/256 , Y10T428/28 , Y10T428/2804 , Y10T428/287 , Y10T428/2878 , Y10T442/64
摘要: As a technique capable of stably providing various metal film adhered bodies for printed circuit boards having an excellent peel strength even in the wiring having higher density and higher pattern accuracy and other industrial parts, there are provided adhesive, adhesive layer and metal film adhered body in which a mixed resin consisting of a thermoplastic resin and an uncured thermosetting resin including a resin substituted at a part of its functional group with a photosensitive group and/or an uncured photosensitive resin is used as a heat-resistant resin matrix constituting the adhesive and further a cured homogeneous resin composite forming a quasi-homogeneous compatible structure, co-continuous phase structure or spherical domain structure is used as a heat-resistant resin matrix of the adhesive layer.
摘要翻译: 作为能够稳定地提供具有优异剥离强度的印刷电路板的各种金属膜粘合体的技术,即使在具有更高密度和更高图案精度的布线等工业部件中,也提供了粘合剂,粘合剂层和金属膜粘合体 作为构成粘合剂的耐热树脂基质,使用由热塑性树脂和包含在其官能团的一部分被感光性基团取代的树脂和/或未固化的感光性树脂组成的未固化的热固性树脂的混合树脂 使用形成准均相相容结构,共连续相结构或球形结构的固化均匀树脂复合材料作为粘合层的耐热树脂基体。
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公开(公告)号:US6124408A
公开(公告)日:2000-09-26
申请号:US258199
申请日:1999-02-26
申请人: Dong Dong Wang , Motoo Asai
发明人: Dong Dong Wang , Motoo Asai
IPC分类号: C08L63/00 , C08L71/00 , C08L81/06 , C08L101/00 , H05K1/00 , H05K3/18 , H05K3/38 , H05K3/46 , C08F283/00
CPC分类号: H05K3/387 , C08L101/00 , C08L63/00 , C08L71/00 , C08L81/06 , H05K2201/0129 , H05K2201/0212 , H05K2203/0773 , H05K3/181 , H05K3/4661 , H05K3/4676
摘要: A novel resin composite consists of a thermosetting resin or photosensitive resin and a thermoplastic resin and has a quasi-homogeneous compatible structure not only having properties inherent to the thermosetting or photosensitive resin but also exhibiting values of properties higher than those inherent to the thermoplastic resin.
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