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    PHOTOSENSITIVE RESIN COMPOSITION CONTAINING POLYIMIDE RESIN AND NOVOLAK RESIN
    3.
    发明申请
    PHOTOSENSITIVE RESIN COMPOSITION CONTAINING POLYIMIDE RESIN AND NOVOLAK RESIN 审中-公开
    含有聚酰胺树脂和NOVOLAK树脂的感光树脂组合物

    公开(公告)号：US20110123927A1

    公开(公告)日：2011-05-26

    申请号：US12994010

    申请日：2009-05-20

    申请人： Chan Hyo Park ,  Hye In Shin ,  Hye Ran Seong ,  Kyung Jun Kim ,  Dong Hyun Oh

    发明人： Chan Hyo Park ,  Hye In Shin ,  Hye Ran Seong ,  Kyung Jun Kim ,  Dong Hyun Oh

    IPC分类号： G03F7/004 ,  G03F7/20 ,  B05D3/02 ,  B05D7/24 ,  B05D7/14

    CPC分类号： G03F7/0233 ,  G03F7/0046 ,  G03F7/40

    摘要： A photosensitive resin composition is provided. The photosensitive resin composition comprises a) an alkali-soluble polyimide resin, b) an alkali-soluble novolak resin, c) a photosensitizer, and d) an organic solvent. The photosensitive resin composition is resistant to heat and can be used to form a pattern whose lateral angles are easily controllable. A large difference in developability between exposed and unexposed portions of the photosensitive resin composition is caused when patterning. The photosensitive resin composition is advantageous in terms of sensitivity, resolution, heat resistance and adhesiveness. Particularly, the lateral angles of the pattern can be easily controlled by varying the contents of the alkali-soluble resins. Therefore, the photosensitive resin composition is useful in the formation of an insulating film pattern of an organic light emitting diode (OLED).

    摘要翻译： 提供感光性树脂组合物。 感光性树脂组合物包含a）碱溶性聚酰亚胺树脂，b）碱溶性酚醛清漆树脂，c）光敏剂，和d）有机溶剂。 感光性树脂组合物耐热，可用于形成其横向角度容易控制的图案。 当图案化时，引起感光性树脂组合物的曝光部与未曝光部之间的显影性差。 感光性树脂组合物在灵敏度，分辨率，耐热性和粘合性方面是有利的。 特别地，可以通过改变碱溶性树脂的含量来容易地控制图案的横向角度。 因此，感光性树脂组合物可用于形成有机发光二极管（OLED）的绝缘膜图案。

    Composition for liquid crystal aligning, liquid crystal aligning layer prepared from the same, and liquid crystal display comprising the same
    8.
    发明申请
    Composition for liquid crystal aligning, liquid crystal aligning layer prepared from the same, and liquid crystal display comprising the same 有权
    用于液晶取向的组合物，由其制备的液晶取向层以及包含该液晶显示器的液晶显示器

    公开(公告)号：US20070154656A1

    公开(公告)日：2007-07-05

    申请号：US11649163

    申请日：2007-01-04

    申请人： Kyung-Jun Kim ,  Yun-Jeong Lee ,  Sang-Kook Kim ,  Hye-Ran Seong ,  Dong-Hyun Oh ,  Jung-Ho Jo

    发明人： Kyung-Jun Kim ,  Yun-Jeong Lee ,  Sang-Kook Kim ,  Hye-Ran Seong ,  Dong-Hyun Oh ,  Jung-Ho Jo

    IPC分类号： C09K19/00 ,  G02F1/1337

    CPC分类号： C08G73/10 ,  G02F1/133723 ,  Y10T428/1005 ,  Y10T428/1018 ,  Y10T428/1023

    摘要： The present invention to a composition for liquid crystal aligning comprising an oligoimide or oligoamic acid, which comprises a thermocurable or photocurable functional group on at least one end of the oligoimide or oligoamic acid backbone, a liquid crystal aligning layer prepared from the same, and a liquid crystal display comprising the same. The composition for liquid crystal aligning according to the present can minimize the generation of the decomposed by-products, which had been generated upon the use of polyimides, by using an oligoimide or oligoamic acid on at least one end of the backbone, instead of the conventional polyimides and has an excellent effect of improvement in alignment property, thermal stability, and image sticking.

    摘要翻译： 本发明涉及用于液晶取向的组合物，其包含寡酰亚胺或寡聚酸，其包含在低聚酰亚胺或寡聚酰胺酸主链的至少一端上的可热固化或光固化的官能团，由其制备的液晶取向层，以及 包含该液晶显示器的液晶显示器。 根据本发明的用于液晶取向的组合物可以通过在骨架的至少一端使用低聚酰亚胺或寡聚酰胺酸来代替使用聚酰亚胺时产生的分解的副产物的产生，而不是 常规的聚酰亚胺，并且具有优异的取向性，热稳定性和图像粘附性的改善效果。

    LOW TEMPERATURE CURABLE POLYIMIDE RESIN AND METHOD OF PREPARING THE SAME
    9.
    发明申请
    LOW TEMPERATURE CURABLE POLYIMIDE RESIN AND METHOD OF PREPARING THE SAME 有权
    低温可固化聚酰胺树脂及其制备方法

    公开(公告)号：US20120016076A1

    公开(公告)日：2012-01-19

    申请号：US13182012

    申请日：2011-07-13

    申请人： Sang Woo KIM ,  Se Jin SHIN ,  Dong Hyun OH ,  Kyung Jun KIM

    发明人： Sang Woo KIM ,  Se Jin SHIN ,  Dong Hyun OH ,  Kyung Jun KIM

    IPC分类号： C09D11/10 ,  C08G77/00 ,  C08G75/14 ,  C08G75/20 ,  C08G73/10 ,  C08G16/00

    CPC分类号： C09D11/101 ,  C08G73/1032 ,  C08G73/1039 ,  C08G73/105 ,  C08G73/1067 ,  G03F7/0007 ,  G03F7/0233

    摘要： In a method for preparing a polyimide resin by reacting diamine and dianhydride, the polyimide resin is polymerized under the presence of a solvent having a boiling point ranging from 130° C. to 180° C. so as to be curable at a low temperature ranging from 150° C. to 250° C.Because the polyimide is curable even at a low temperature, when the polyimide resin is used as an electronic material, damage to equipment due to an otherwise high temperature process can be minimized, and in addition, the polyimide resin can be extensively used as an electronic material such as for a plastic substrate, or the like.

    摘要翻译： 在二胺和二酐反应制备聚酰亚胺树脂的方法中，聚酰亚胺树脂在沸点范围为130℃至180℃的溶剂存在下聚合，以便在低温范围内可固化 由于聚酰亚胺即使在低温下也可固化，因此当将聚酰亚胺树脂用作电子材料时，由于其它高温处理而导致的设备损坏能够最小化，另外， 可以将聚酰亚胺树脂广泛用作塑料基板等电子材料。

    POSITIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION
    10.
    发明申请
    POSITIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION 有权
    正性光敏聚酰亚胺组合物

    公开(公告)号：US20110059397A1

    公开(公告)日：2011-03-10

    申请号：US12921281

    申请日：2009-03-06

    申请人： Hye-Ran Seong ,  Chan-Hyo Park ,  Dong-Hyun Oh ,  Hye-In Shin ,  Kyung-Jun Kim ,  Se-Jin Shin

    发明人： Hye-Ran Seong ,  Chan-Hyo Park ,  Dong-Hyun Oh ,  Hye-In Shin ,  Kyung-Jun Kim ,  Se-Jin Shin

    IPC分类号： G03F7/039

    CPC分类号： G03F7/0233 ,  H01L51/5237 ,  H01L51/5253

    摘要： The present invention relates to a positive photosensitive polyimide composition that includes polyimide, a polyamic acid, and a photoactive compound. An organic insulating layer for organic light-emitting devices (OLED), which includes the positive photosensitive polyimide composition, may control a taper angle and outgassing, and has excellent adhesion in respects to a substrate, water repellent control ability, and storage stability and the like.

    摘要翻译： 本发明涉及包含聚酰亚胺，聚酰胺酸和光敏化合物的正型感光性聚酰亚胺组合物。 包含正光敏聚酰亚胺组合物的有机发光元件（OLED）的有机绝缘层可以控制锥角和除气，并且在基板上具有优异的粘附性，防水性能和储存稳定性， 喜欢。