公开(公告)号：US08736034B2

公开(公告)日：2014-05-27

申请号：US11816038

申请日：2005-02-24

申请人： Gilles Montoriol, Jr. ,  Thierry Delaunay ,  Frederic Tilhac

发明人： Gilles Montoriol, Jr. ,  Thierry Delaunay ,  Frederic Tilhac

IPC分类号： H01L23/495

CPC分类号： H01L23/49531 ,  H01L23/49575 ,  H01L23/64 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6644 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/0001 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099

摘要： A lead-frame circuit package comprises a die and a substrate located thereon to route radio frequency signals to/from the die. The package preferably comprises an exposed pad on the die to receive a power amplifier device wherein the substrate is used to provide high-Q elements such as RF chokes on signal paths to/from the power amplifier device.In this manner, the design benefits from the power capabilities and improved grounding of a lead-frame conductor, whilst also achieving the routeing capabilities and small scale advantages provided by a multi-layer printed circuit substrate.

摘要翻译： 引线框电路封装包括管芯和位于其上的衬底以将射频信号传送到管芯或从管芯移出。 封装优选地包括裸片上的裸露焊盘以接收功率放大器器件，其中衬底用于在/从功率放大器器件的信号路径上提供高Q元件，例如RF扼流圈。 以这种方式，该设计受益于引线框导体的功率能力和改进的接地，同时还实现了由多层印刷电路基板提供的路由能力和小规模优点。

公开(公告)号：US20080142935A1

公开(公告)日：2008-06-19

申请号：US11816038

申请日：2005-02-24

申请人： Gilles Montoriol ,  Thierry Delaunay ,  Frederic Tilhac

发明人： Gilles Montoriol ,  Thierry Delaunay ,  Frederic Tilhac

IPC分类号： H01L23/495

CPC分类号： H01L23/49531 ,  H01L23/49575 ,  H01L23/64 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6644 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/0001 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099

摘要： A lead-frame circuit package comprises a die and a substrate located thereon to route radio frequency signals to/from the die. The package preferably comprises an exposed pad on the die to receive a power amplifier device wherein the substrate is used to provide high-Q elements such as RF chokes on signal paths to/from the power amplifier device.In this manner, the design benefits from the power capabilities and improved grounding of a lead-frame conductor, whilst also achieving the routeing capabilities and small scale advantages provided by a multi-layer printed circuit substrate.

摘要翻译： 引线框电路封装包括管芯和位于其上的衬底以将射频信号传送到管芯或从管芯移出。 封装优选地包括裸片上的裸露焊盘以接收功率放大器器件，其中衬底用于在/从功率放大器器件的信号路径上提供高Q元件，例如RF扼流圈。 以这种方式，该设计受益于引线框导体的功率能力和改进的接地，同时还实现了由多层印刷电路基板提供的路由能力和小规模优点。

公开(公告)号：US20140252570A1

公开(公告)日：2014-09-11

申请号：US14285079

申请日：2014-05-22

申请人： GILLES MONTORIOL ,  THIERRY DELAUNAY ,  FREDERIC TILHAC

发明人： GILLES MONTORIOL ,  THIERRY DELAUNAY ,  FREDERIC TILHAC

IPC分类号： H01L23/495

CPC分类号： H01L23/49531 ,  H01L23/49575 ,  H01L23/64 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6644 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/0001 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099

摘要： A lead-frame circuit package comprises a die and a substrate located thereon to route radio frequency signals to/from the die. The package preferably comprises an exposed pad on the die to receive a power amplifier device wherein the substrate is used to provide high-Q elements such as RF chokes on signal paths to/from the power amplifier device.In this manner, the design benefits from the power capabilities and improved grounding of a lead-frame conductor, whilst also achieving the routeing capabilities and small scale advantages provided by a multi-layer printed circuit substrate.

摘要翻译： 引线框电路封装包括管芯和位于其上的衬底以将射频信号传送到管芯或从管芯移出。 封装优选地包括裸片上的裸露焊盘以接收功率放大器器件，其中衬底用于在/从功率放大器器件的信号路径上提供高Q元件，例如RF扼流圈。 以这种方式，该设计受益于引线框导体的功率能力和改进的接地，同时还实现了由多层印刷电路基板提供的路由能力和小规模优点。