公开(公告)号：US09228270B2

公开(公告)日：2016-01-05

申请号：US13584343

申请日：2012-08-13

Applicant: Jingbin Feng ,  Marshall Stowell ,  Frederick D. Wilmot

Inventor： Jingbin Feng ,  Marshall Stowell ,  Frederick D. Wilmot

IPC: C25D17/00 ,  C25D7/12 ,  C25D17/06

CPC classification number: C25D17/005 ,  C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/007 ,  C25D17/06 ,  C25D17/08 ,  Y10T29/49778

Abstract: Disclosed herein are lipseal assemblies for use in electroplating clamshells which may include an elastomeric lipseal for excluding plating solution from a peripheral region of a semiconductor substrate and one or more electrical contact elements. The contact elements may be structurally integrated with the elastomeric lipseal. The lipseal assemblies may include one or more flexible contact elements at least a portion of which may be conformally positioned on an upper surface of the elastomeric lipseal, and may be configured to flex and form a conformal contact surface that interfaces with the substrate. Some elastomeric lipseals disclosed herein may support, align, and seal a substrate in a clamshell, and may include a flexible elastomeric upper portion located above a flexible elastomeric support edge, the upper portion having a top surface and an inner side surface, the later configured to move inward and align the substrate upon compression of the top surface.

Abstract translation: 本文公开了用于电镀蛤壳的唇形组件，其可包括用于从半导体衬底的周边区域排除电镀溶液的弹性唇形密封件和一个或多个电接触元件。 接触元件可以在结构上与弹性唇形密封结合。 唇密封组件可以包括一个或多个柔性接触元件，其至少一部分可以共形地定位在弹性唇形密封件的上表面上，并且可以构造成弯曲并形成与基底相接合的共形接触表面。 本文公开的一些弹性密封件可以在蛤壳中支撑，对准和密封基底，并且可以包括位于柔性弹性体支撑边缘上方的柔性弹性体上部，上部具有顶表面和内侧表面， 向内移动并在顶表面压缩时对准基板。

公开(公告)号：US09512538B2

公开(公告)日：2016-12-06

申请号：US13609037

申请日：2012-09-10

Applicant: Zhian He ,  Jingbin Feng ,  Shantinath Ghongadi ,  Frederick D. Wilmot

Inventor： Zhian He ,  Jingbin Feng ,  Shantinath Ghongadi ,  Frederick D. Wilmot

IPC: C25D17/00 ,  C25D17/06 ,  C25D17/12 ,  C25D7/12

CPC classification number: C25D17/06 ,  C25D7/12 ,  C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D17/007 ,  C25D17/12

Abstract: Disclosed herein are cups for engaging wafers during electroplating in clamshell assemblies and supplying electrical current to the wafers during electroplating. The cup can comprise an elastomeric seal disposed on the cup and configured to engage the wafer during electroplating, where upon engagement the elastomeric seal substantially excludes plating solution from a peripheral region of the wafer, and where the elastomeric seal and the cup are annular in shape, and comprise one or more contact elements for supplying electrical current to the wafer during electroplating, the one or more contact elements attached to and extending inwardly towards a center of the cup from a metal strip disposed over the elastomeric seal. A notch area of the cup can have a protrusion or an insulated portion on a portion of a bottom surface of the cup where the notch area is aligned with a notch in the wafer.

Abstract translation: 这里公开了用于在电镀期间在蛤壳式组件中接合晶片并在电镀期间向晶片供应电流的杯子。 杯子可以包括设置在杯子上并被配置为在电镀期间接合晶片的弹性体密封件，其中在接合时，弹性体密封件基本上排除来自晶片的周边区域的电镀溶液，并且其中弹性体密封件和杯子是环形的 并且包括用于在电镀期间向晶片供应电流的一个或多个接触元件，所述一个或多个接触元件从设置在弹性体密封件上方的金属条附接到杯的中心并向内延伸。 杯的切口区域可以在杯的底表面的一部分上具有突起或绝缘部分，其中凹口区域与晶片中的凹口对准。

公开(公告)号：US20130284604A1

公开(公告)日：2013-10-31

申请号：US13869891

申请日：2013-04-24

Applicant: Tighe A. Spurlin ,  Charles L. Merrill ,  Ludan Huang ,  Matthew Thorum ,  Lee Brogan ,  James E. Duncan ,  Frederick D. Wilmot ,  Marshall R. Stowell ,  Steven T. Mayer ,  Haiying Fu ,  David W. Porter ,  Shantinath Ghongadi ,  Jonathan D. Reid ,  Hyosang S. Lee ,  Mark J. Willey

Inventor： Tighe A. Spurlin ,  Charles L. Merrill ,  Ludan Huang ,  Matthew Thorum ,  Lee Brogan ,  James E. Duncan ,  Frederick D. Wilmot ,  Marshall R. Stowell ,  Steven T. Mayer ,  Haiying Fu ,  David W. Porter ,  Shantinath Ghongadi ,  Jonathan D. Reid ,  Hyosang S. Lee ,  Mark J. Willey

IPC: C25D21/14 ,  C25D17/00 ,  C25D3/38

CPC classification number: C25D21/14 ,  C25D3/38 ,  C25D17/001 ,  C25D17/002 ,  C25D21/12 ,  C25D21/18

Abstract: Apparatus and methods for electroplating metal onto substrates are disclosed. The electroplating apparatus comprise an electroplating cell and at least one oxidization device. The electroplating cell comprises a cathode chamber and an anode chamber separated by a porous barrier that allows metal cations to pass through but prevents organic particles from crossing. The oxidation device (ODD) is configured to oxidize cations of the metal to be electroplated onto the substrate, which cations are present in the anolyte during electroplating. In some embodiments, the ODD is implemented as a carbon anode that removes Cu(I) from the anolyte electrochemically. In other embodiments, the ODD is implemented as an oxygenation device (OGD) or an impressed current cathodic protection anode (ICCP anode), both of which increase oxygen concentration in anolyte solutions. Methods for efficient electroplating are also disclosed.

Abstract translation: 公开了将金属电镀到基底上的装置和方法。 电镀装置包括电镀电池和至少一个氧化装置。 电镀电池包括阴极室和阳极室，隔室由金属阳离子通过但防止有机颗粒穿过。 氧化装置（ODD）被配置为将要电镀的金属的阳离子氧化到基底上，该阳离子在电镀期间存在于阳极电解液中。 在一些实施方案中，ODD被实施为碳阳极，其通过电化学方法从阳极电解液中除去Cu（I）。 在其他实施方案中，ODD被实施为氧化装置（OGD）或外加电流阴极保护阳极（ICCP阳极），这两者都增加了阳极电解液溶液中的氧浓度。 还公开了高效电镀的方法。

公开(公告)号：US20130062197A1

公开(公告)日：2013-03-14

申请号：US13609037

申请日：2012-09-10

Applicant: Zhian He ,  Jingbin Feng ,  Shantinath Ghongadi ,  Frederick D. Wilmot

Inventor： Zhian He ,  Jingbin Feng ,  Shantinath Ghongadi ,  Frederick D. Wilmot

IPC: C25D17/06

CPC classification number: C25D17/06 ,  C25D7/12 ,  C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D17/007 ,  C25D17/12

Abstract: Disclosed herein are cups for engaging wafers during electroplating in clamshell assemblies and supplying electrical current to the wafers during electroplating. The cup can comprise an elastomeric seal disposed on the cup and configured to engage the wafer during electroplating, where upon engagement the elastomeric seal substantially excludes plating solution from a peripheral region of the wafer, and where the elastomeric seal and the cup are annular in shape, and comprise one or more contact elements for supplying electrical current to the wafer during electroplating, the one or more contact elements attached to and extending inwardly towards a center of the cup from a metal strip disposed over the elastomeric seal. A notch area of the cup can have a protrusion or an insulated portion on a portion of a bottom surface of the cup where the notch area is aligned with a notch in the wafer.

公开(公告)号：US09045840B2

公开(公告)日：2015-06-02

申请号：US13306527

申请日：2011-11-29

Applicant: David W. Porter ,  Jonathan D. Reid ,  Frederick D. Wilmot

Inventor： David W. Porter ,  Jonathan D. Reid ,  Frederick D. Wilmot

IPC: C25D17/02 ,  C25D21/12 ,  C25D17/00 ,  C25D17/06 ,  C25D17/10 ,  C25D17/12

CPC classification number: C25D17/001 ,  C25D17/002 ,  C25D17/007 ,  C25D17/06 ,  C25D17/10 ,  C25D17/12 ,  C25D21/12

Abstract: Methods, systems, and apparatus for plating a metal onto a work piece are described. In one aspect, an apparatus includes a plating chamber, a substrate holder, an anode chamber housing an anode, and an ionically resistive ionically permeable element positioned between a substrate and the anode chamber during electroplating. The anode chamber may be movable with respect to the ionically resistive ionically permeable element to vary a distance between the anode chamber and the ionically resistive ionically permeable element during electroplating. The anode chamber may include an insulating shield oriented between the anode and the ionically resistive ionically permeable element, with opening in a central region of the insulating shield.

Abstract translation: 描述了将金属电镀到工件上的方法，系统和装置。 一方面，一种设备包括电镀室，衬底保持器，容纳阳极的阳极室和在电镀期间定位在衬底和阳极室之间的离子电离性离子渗透元件。 阳极室可以相对于离子电离性离子渗透元件移动，以在电镀期间改变阳极室和离子电阻性离子可渗透元件之间的距离。 阳极室可以包括定向在阳极和离子电离性离子渗透元件之间的绝缘屏蔽，其在绝缘屏蔽的中心区域中开口。

公开(公告)号：US20130137242A1

公开(公告)日：2013-05-30

申请号：US13687937

申请日：2012-11-28

Applicant: Zhian HE ,  David W. PORTER ,  Jonathan D. REID ,  Frederick D. WILMOT

Inventor： Zhian HE ,  David W. PORTER ,  Jonathan D. REID ,  Frederick D. WILMOT

IPC: C25D21/12 ,  H01L21/02

CPC classification number: C25D21/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/007 ,  C25D17/06 ,  C25D17/10 ,  H01L21/02697

Abstract: Methods, systems, and apparatus for plating a metal onto a work piece are described. In one aspect, an apparatus includes a plating chamber, a substrate holder, an anode chamber housing an anode, an ionically resistive ionically permeable element positioned between a substrate and the anode chamber during electroplating, an auxiliary cathode located between the anode and the ionically resistive ionically permeable element, and an insulating shield with an opening in its central region. The insulating shield may be movable with respect to the ionically resistive ionically permeable element to vary a distance between the shield and the ionically resistive ionically permeable element during electroplating.

Abstract translation: 描述了将金属电镀到工件上的方法，系统和装置。 一方面，一种装置包括电镀室，衬底保持器，容纳阳极的阳极室，在电镀期间位于衬底和阳极室之间的离子电阻离子可渗透元件，位于阳极和离子电阻之间的辅助阴极 离子渗透元件，以及在其中心区域具有开口的绝缘护罩。 绝缘屏蔽件可以相对于离子电离性离子渗透元件移动，以在电镀期间改变屏蔽层与离子电阻性离子渗透元件之间的距离。

公开(公告)号：US20150191843A9

公开(公告)日：2015-07-09

申请号：US13609037

申请日：2012-09-10

Applicant: Zhian He ,  Jingbin Feng ,  Shantinath Ghongadi ,  Frederick D. Wilmot

Inventor： Zhian He ,  Jingbin Feng ,  Shantinath Ghongadi ,  Frederick D. Wilmot

IPC: C25D17/06 ,  C25D17/00

CPC classification number: C25D17/06 ,  C25D7/12 ,  C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D17/007 ,  C25D17/12

Abstract: Disclosed herein are cups for engaging wafers during electroplating in clamshell assemblies and supplying electrical current to the wafers during electroplating. The cup can comprise an elastomeric seal disposed on the cup and configured to engage the wafer during electroplating, where upon engagement the elastomeric seal substantially excludes plating solution from a peripheral region of the wafer, and where the elastomeric seal and the cup are annular in shape, and comprise one or more contact elements for supplying electrical current to the wafer during electroplating, the one or more contact elements attached to and extending inwardly towards a center of the cup from a metal strip disposed over the elastomeric seal. A notch area of the cup can have a protrusion or an insulated portion on a portion of a bottom surface of the cup where the notch area is aligned with a notch in the wafer.

Abstract translation: 这里公开了用于在电镀期间在蛤壳式组件中接合晶片并在电镀期间向晶片供应电流的杯子。 杯子可以包括设置在杯子上并被配置为在电镀期间接合晶片的弹性体密封件，其中在接合时，弹性体密封件基本上排除来自晶片的周边区域的电镀溶液，并且其中弹性体密封件和杯子是环形的 并且包括用于在电镀期间向晶片供应电流的一个或多个接触元件，所述一个或多个接触元件从设置在弹性体密封件上方的金属条附接到杯的中心并向内延伸。 杯的切口区域可以在杯的底表面的一部分上具有突起或绝缘部分，其中凹口区域与晶片中的凹口对准。

公开(公告)号：US20130134045A1

公开(公告)日：2013-05-30

申请号：US13306527

申请日：2011-11-29

Applicant: David W. PORTER ,  Jonathan D. REID ,  Frederick D. WILMOT

Inventor： David W. PORTER ,  Jonathan D. REID ,  Frederick D. WILMOT

IPC: C25D5/00 ,  C25D21/12 ,  C25D21/00 ,  C25D17/10 ,  C25D17/00

CPC classification number: C25D17/001 ,  C25D17/002 ,  C25D17/007 ,  C25D17/06 ,  C25D17/10 ,  C25D17/12 ,  C25D21/12

Abstract: Methods, systems, and apparatus for plating a metal onto a work piece are described. In one aspect, an apparatus includes a plating chamber, a substrate holder, an anode chamber housing an anode, and an ionically resistive ionically permeable element positioned between a substrate and the anode chamber during electroplating. The anode chamber may be movable with respect to the ionically resistive ionically permeable element to vary a distance between the anode chamber and the ionically resistive ionically permeable element during electroplating. The anode chamber may include an insulating shield oriented between the anode and the ionically resistive ionically permeable element, with opening in a central region of the insulating shield.

Abstract translation: 描述了将金属电镀到工件上的方法，系统和装置。 一方面，一种设备包括电镀室，衬底保持器，容纳阳极的阳极室和在电镀期间定位在衬底和阳极室之间的离子电离性离子渗透元件。 阳极室可以相对于离子电离性离子渗透元件移动，以在电镀期间改变阳极室和离子电阻性离子可渗透元件之间的距离。 阳极室可以包括定向在阳极和离子电离性离子渗透元件之间的绝缘屏蔽，其在绝缘屏蔽的中心区域中开口。

公开(公告)号：US20130042454A1

公开(公告)日：2013-02-21

申请号：US13584343

申请日：2012-08-13

Applicant: Jingbin Feng ,  Marshall Stowell ,  Frederick D. Wilmot

Inventor： Jingbin Feng ,  Marshall Stowell ,  Frederick D. Wilmot

IPC: C25D17/06 ,  B23Q17/00 ,  C25D17/00

CPC classification number: C25D17/005 ,  C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/007 ,  C25D17/06 ,  C25D17/08 ,  Y10T29/49778

Abstract: Disclosed herein are lipseal assemblies for use in electroplating clamshells which may include an elastomeric lipseal for excluding plating solution from a peripheral region of a semiconductor substrate and one or more electrical contact elements. The contact elements may be structurally integrated with the elastomeric lipseal. The lipseal assemblies may include one or more flexible contact elements at least a portion of which may be conformally positioned on an upper surface of the elastomeric lipseal, and may be configured to flex and form a conformal contact surface that interfaces with the substrate. Some elastomeric lipseals disclosed herein may support, align, and seal a substrate in a clamshell, and may include a flexible elastomeric upper portion located above a flexible elastomeric support edge, the upper portion having a top surface and an inner side surface, the later configured to move inward and align the substrate upon compression of the top surface.

Abstract translation: 本文公开了用于电镀蛤壳的唇形组件，其可包括用于从半导体衬底的周边区域排除电镀溶液的弹性唇形密封件和一个或多个电接触元件。 接触元件可以在结构上与弹性唇形密封结合。 唇密封组件可以包括一个或多个柔性接触元件，其至少一部分可以共形地定位在弹性唇形密封件的上表面上，并且可以构造成弯曲并形成与基底相接合的共形接触表面。 本文公开的一些弹性密封件可以在蛤壳中支撑，对准和密封基底，并且可以包括位于柔性弹性体支撑边缘上方的柔性弹性体上部，上部具有顶表面和内侧表面， 向内移动并在顶表面压缩时对准基板。