公开(公告)号：US20040200879A1

公开(公告)日：2004-10-14

申请号：US10722288

申请日：2003-11-25

申请人： Fry's Metals, Inc.

发明人： Brian G. Lewis ,  Bawa Singh ,  John P. Laughlin ,  David V. Kyaw ,  Anthony E. Ingham ,  Attiganal N. Sreeram ,  Leszek Hozer ,  Michael J. Liberatore ,  Gerard R. Minogue

IPC分类号： B23K035/14

CPC分类号： H01L23/42 ,  B23K35/302 ,  B23K35/3066 ,  B23K35/3602 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2924/01066 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01L2924/00

摘要： A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.

摘要翻译： 具有多个层的焊料预制件，其包括填充有介于两个未填充层之间的添加剂的焊料层，以改善润湿性。 具有包含填充有添加剂的焊料材料的球体的焊料预制件和用于改善润湿性的未填充表面层。 具有粘合组分和作为CTE改性组分和/或导热性增强组分的添加剂组分的热界面材料。 含有内在吸气剂的活性焊料。

公开(公告)号：USRE45175E1

公开(公告)日：2014-10-07

申请号：US13655159

申请日：2012-10-18

申请人： Fry's Metals, Inc.

发明人： Andrew McIntosh Soutar ,  Peter Thomas McGrath

IPC分类号： C23C18/54 ,  H05K3/42

CPC分类号： H05K3/244 ,  C23C18/42

摘要： In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.

摘要翻译： 在PCB制造中，裸板的焊盘和/或通孔在通过镀银工艺安装其它部件之前得到保护。 通过银离子氧化铜并在表面沉积一层银的置换方法从镀覆组合物中施加银板。 在水性电镀组合物中，通过掺入多齿络合剂将银离子保持在溶液中。 组合物可以含有银晦暗抑制剂，并且不含能够将银离子还原成银金属，卤离子并基本上不含非水溶剂的还原剂。 表面安装的部件可以使用任何市售的焊料直接焊接到镀银触点。 银不会沉积在焊料掩模上，而只能沉积在比银正电的金属上。

公开(公告)号：US20040251561A1

公开(公告)日：2004-12-16

申请号：US10458925

申请日：2003-06-11

申请人： Fry's Metals, Inc.

发明人： Mark Wilson ,  David Garrett

IPC分类号： H01L021/44 ,  H01L021/48 ,  H01L021/50 ,  H01L023/29

CPC分类号： H01L21/563 ,  H01L23/293 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2924/01004 ,  H01L2924/01025 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/09701

摘要： A flip chip having solder bumps and an underfill that is thermoplastic and fluxing, as well as methods for making such a device. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes.

摘要翻译： 具有焊料凸点和热塑性和助熔剂的底部填充物的倒装芯片以及制造这种器件的方法。 所得到的器件非常适用于印刷电路板的简单的一步应用，从而简化了倒装芯片制造工艺。

公开(公告)号：US20040261636A1

公开(公告)日：2004-12-30

申请号：US10899679

申请日：2004-07-26

申请人： Fry's Metals, Inc. d/b/a Alpha Metals, Inc.

发明人： Ian McPhee Fleck ,  Ron Tripp ,  Prashant Chouta ,  Scott Craig

IPC分类号： B41M001/12 ,  B41N001/24

CPC分类号： B41N1/24 ,  B41M1/12 ,  H05K3/1225

摘要： A stencil used for printing solder paste on a contact pad of a printed wiring board has interior surfaces that define one or more apertures through the stencil. Those interior surfaces are coated with a material, such as parylene, having a lower surface tension than the interior surfaces absent the coating. The stencil can also have one or more reverse-tapered apertures passing there through, wherein the apertures have a variable cross-section that is larger at the fill side of the stencil (i.e., where solder paste enters the apertures) than at the board side of the stencil (i.e., where the stencil contacts the contact pad of the printed wiring board). Solder paste can be printed through the aperture(s) of the stencil onto contact pads on a printed wiring board.

摘要翻译： 用于在印刷线路板的接触焊盘上印刷焊膏的模板具有限定通过模板的一个或多个孔的内表面。 这些内表面涂覆有诸如聚对二甲苯的材料，其表面张力低于没有涂层的内表面。 模板还可以具有一个或多个穿过其中的倒锥形孔，其中孔具有在模板的填充侧较大的可变横截面（即，焊膏进入孔），而不是在板侧 （即，模板接触印刷电路板的接触垫的位置）。 焊膏可以通过模板的孔被印刷到印刷线路板上的接触垫上。

公开(公告)号：US20030221748A1

公开(公告)日：2003-12-04

申请号：US10158251

申请日：2002-05-30

申请人： Fry's Metals, Inc.

发明人： Bensol Arzadon ,  Andrew David Price ,  Leela Josephine Sequeira ,  Leszek Hozer

IPC分类号： B23K035/34

CPC分类号： B23K35/3612 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/36 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  B23K35/362

摘要： The present invention is directed to a solder flux and solder paste that comprises methylsuccinic acid as an activating component and an imidazole compound as an accelerating component. The imidizole compound is selected from the following: 2-methyl-4-ethylimidazole, 2-methylimidazole and 2-ethylimidazole and mixtures thereof. The present invention is also directed to a method for preparing the above-described solder flux and method for soldering using the solder flux paste. It is also directed to an electronic component assembly joined using the solder flux paste.

摘要翻译： 本发明涉及包含作为活化成分的甲基琥珀酸和作为加速成分的咪唑化合物的助焊剂和焊膏。 咪唑唑化合物选自如下：2-甲基-4-乙基咪唑，2-甲基咪唑和2-乙基咪唑及其混合物。 本发明还涉及一种用于制备上述焊剂的方法以及使用焊料糊焊接的方法。 还涉及使用焊剂膏接合的电子部件组件。

公开(公告)号：US20020175403A1

公开(公告)日：2002-11-28

申请号：US10151741

申请日：2002-05-20

申请人： Fry's Metals, Inc.

发明人： A. N. Sreeram ,  Brian Lewis ,  Leszek Hozer ,  Michael James Liberatore ,  Gerard Minogue

IPC分类号： H01L023/14

CPC分类号： H01L23/42 ,  B23K35/302 ,  B23K35/3066 ,  B23K35/3602 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/433 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/3011 ,  H01L2924/00

摘要： A thermal interface material for use in electronic packaging, the thermal interface material comprises a solder with relatively high heat flow characteristics and a CTE modifying component to reduce or prevent damage due to thermal cycling. The thermal interface material comprises an active solder that contains indium and an intrinsic oxygen getter selected from the group consisting of alkali metals, alkaline-earth metals, refractory metals, rare earth metals and zinc and mixtures and alloys thereof. Lastly, damage due to an electronic package due to thermal cycling stress is reduced by using an insert in a lid of an electronic device package wherein the insert has a coefficient of thermal expansion that is between about that of the lid and about that of a semiconductor substrate.

摘要翻译： 用于电子封装的热界面材料，热界面材料包括具有相对高热流特性的焊料和CTE改性组分，以减少或防止由于热循环引起的损伤。 热界面材料包括含有铟的活性焊料和选自碱金属，碱土金属，难熔金属，稀土金属和锌的本征氧吸气剂及其混合物和合金。 最后，通过在电子设备封装的盖子中使用插入件来减少由于热循环应力而导致的电子封装的损坏，其中插入件的热膨胀系数在盖子的大约和半导体的盖子之间 基质。