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Patent Agency Ranking
1.发明授权Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components 有权粘合用于制造电子组件的部件和包括接合部件的电子组件的方法公开(公告)号：US08967453B2
公开(公告)日：2015-03-03
申请号：US13426051
申请日：2012-03-21
Applicant: Khiet Le , Vicentiu Grosu , Gregory S. Smith , Yunqi Zheng , Gregory D. Rosdahl
Inventor： Khiet Le , Vicentiu Grosu , Gregory S. Smith , Yunqi Zheng , Gregory D. Rosdahl
IPC: B23K31/02
CPC classification number: H01L21/4882 , B23K1/0006 , B23K1/0016 , B23K1/19 , B23K3/085 , B23K2101/38 , H01L23/3735 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29294 , H01L2224/29324 , H01L2224/29339 , H01L2224/29355 , H01L2224/83191 , H01L2224/83232 , H01L2224/8384 , H01L2924/00014
Abstract: Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components are provided herein. In one example, a method of bonding components for fabricating an electronic assembly comprises the steps of disposing a first layer of a first high temperature metal-containing paste adjacent to a first component. A second layer of a second high temperature metal-containing paste is disposed adjacent to a second component. A nanostructured multilayer reactive foil is disposed between the first and second layers. The nanostructured multilayer reactive foil is activated to sinter the first and second layers and bond the first and second components.
Abstract translation: 本文提供了用于制造用于制造电子组件的部件和包括接合部件的电子组件的方法。 在一个示例中，一种用于制造电子组件的部件的粘接方法包括以下步骤：将第一高温含金属浆料的第一层与第一组分相邻。 第二高温含金属浆料的第二层邻近第二组分设置。 纳米结构多层反应箔设置在第一层和第二层之间。 激活纳米结构多层反应箔以烧结第一层和第二层并结合第一和第二组分。
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2.发明申请公开(公告)号：US20130250538A1
公开(公告)日：2013-09-26
申请号：US13426051
申请日：2012-03-21
Applicant: KHIET LE , VICENTIU GROSU , GREGORY S. SMITH , YUNQI ZHENG , GREGORY D. ROSDAHL
Inventor： KHIET LE , VICENTIU GROSU , GREGORY S. SMITH , YUNQI ZHENG , GREGORY D. ROSDAHL
CPC classification number: H01L21/4882 , B23K1/0006 , B23K1/0016 , B23K1/19 , B23K3/085 , B23K2101/38 , H01L23/3735 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29294 , H01L2224/29324 , H01L2224/29339 , H01L2224/29355 , H01L2224/83191 , H01L2224/83232 , H01L2224/8384 , H01L2924/00014
Abstract: Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components are provided herein. In one example, a method of bonding components for fabricating an electronic assembly comprises the steps of disposing a first layer of a first high temperature metal-containing paste adjacent to a first component. A second layer of a second high temperature metal-containing paste is disposed adjacent to a second component. A nanostructured multilayer reactive foil is disposed between the first and second layers. The nanostructured multilayer reactive foil is activated to sinter the first and second layers and bond the first and second components.
Abstract translation: 本文提供了用于制造用于制造电子组件的部件和包括接合部件的电子组件的方法。 在一个示例中，一种用于制造电子组件的部件的粘接方法包括以下步骤：将第一高温含金属浆料的第一层与第一组分相邻。 第二高温含金属浆料的第二层邻近第二组分设置。 纳米结构多层反应箔设置在第一层和第二层之间。 激活纳米结构多层反应箔以烧结第一层和第二层并结合第一和第二组分。
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3.发明授权Prediction of transistor temperature in an inverter power module of a vehicle, and related operating methods 有权车辆逆变器功率模块中晶体管温度的预测及相关操作方法公开(公告)号：US08847427B2
公开(公告)日：2014-09-30
申请号：US13221667
申请日：2011-08-30
Applicant: Khiet Le , Gregory D. Rosdahl , David Tang , Seok-Joo Jang , Song He
Inventor： Khiet Le , Gregory D. Rosdahl , David Tang , Seok-Joo Jang , Song He
IPC: B60L1/00
CPC classification number: H02P27/06 , B60L3/003 , B60L2240/525 , B60L2260/44 , H02M1/32 , H02M2001/327 , Y02T10/642
Abstract: A power module system for a vehicle includes a circuit board, a power transistor mounted to the circuit board, and a temperature sensor mounted to the circuit board in a sensing location remote from the power transistor. The temperature sensor is configured to measure a real-time temperature at the sensing location. The system also includes a processor coupled to the temperature sensor to generate a predicted real-time silicon temperature for the power transistor from the measured real-time temperature at the sensing location. The predicted real-time silicon temperature is generated using a selected calibration curve that corresponds to a current operating state of the vehicle.
Abstract translation: 用于车辆的电源模块系统包括电路板，安装到电路板的功率晶体管和安装在远离功率晶体管的感测位置中的电路板的温度传感器。 温度传感器被配置为测量感测位置处的实时温度。 该系统还包括耦合到温度传感器的处理器，以从感测位置处测量的实时温度产生功率晶体管的预测实时硅温度。 使用对应于车辆的当前操作状态的所选择的校准曲线来生成预测的实时硅温度。
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公开(公告)号：US20090032229A1
公开(公告)日：2009-02-05
申请号：US12171851
申请日：2008-07-11
Applicant: Gabriel GALLEGOS-LOPEZ , Khiet LE , David F. NELSON , George JOHN , Gregory S. SMITH , Gregory D. ROSDAHL
Inventor： Gabriel GALLEGOS-LOPEZ , Khiet LE , David F. NELSON , George JOHN , Gregory S. SMITH , Gregory D. ROSDAHL
CPC classification number: G05D23/1919 , H01L23/34 , H01L23/473 , H01L2924/0002 , H01L2924/00
Abstract: A method for cooling an inverter of a vehicle system includes the steps of providing a flow of cooling fluid to the inverter, determining a value of a variable that is influenced at least in part by the flow of cooling fluid to the inverter, and regulating the flow of cooling fluid to the inverter based at least in part on the value of the variable.
Abstract translation: 一种用于冷却车辆系统的逆变器的方法，包括以下步骤：向所述逆变器提供冷却流体流，确定至少部分地受到所述逆变器的冷却流体流动的影响的变量的值，以及 至少部分地基于变量的值将冷却流体流向逆变器。
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5.发明申请PREDICTION OF TRANSISTOR TEMPERATURE IN AN INVERTER POWER MODULE OF A VEHICLE, AND RELATED OPERATING METHODS 有权车辆逆变器功率模块中的晶体管温度的预测及相关操作方法公开(公告)号：US20130049454A1
公开(公告)日：2013-02-28
申请号：US13221667
申请日：2011-08-30
Applicant: KHIET LE , GREGORY D. ROSDAHL , David TANG , SEOK-JOO JANG , SONG HE
Inventor： KHIET LE , GREGORY D. ROSDAHL , David TANG , SEOK-JOO JANG , SONG HE
IPC: B60L1/00
CPC classification number: H02P27/06 , B60L3/003 , B60L2240/525 , B60L2260/44 , H02M1/32 , H02M2001/327 , Y02T10/642
Abstract: A power module system for a vehicle includes a circuit board, a power transistor mounted to the circuit board, and a temperature sensor mounted to the circuit board in a sensing location remote from the power transistor. The temperature sensor is configured to measure a real-time temperature at the sensing location. The system also includes a processor coupled to the temperature sensor to generate a predicted real-time silicon temperature for the power transistor from the measured real-time temperature at the sensing location. The predicted real-time silicon temperature is generated using a selected calibration curve that corresponds to a current operating state of the vehicle.
Abstract translation: 用于车辆的电源模块系统包括电路板，安装到电路板的功率晶体管和安装在远离功率晶体管的感测位置中的电路板的温度传感器。 温度传感器被配置为测量感测位置处的实时温度。 该系统还包括耦合到温度传感器的处理器，以从感测位置处测量的实时温度产生功率晶体管的预测实时硅温度。 使用对应于车辆的当前操作状态的所选择的校准曲线来生成预测的实时硅温度。
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