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公开(公告)号：US5143756A
公开(公告)日：1992-09-01
申请号：US572554
申请日：1990-08-27
CPC分类号： C08J5/24 , C08G59/4021 , C08J2363/00 , H05K3/022
摘要： A dicyandiamide crosslinked epoxy prepreg substantially free from dicyandiamide crystals is obtained by subjecting an epoxy composition containing dicyandiamide to elevated temperature to thereby form a substantially prereacted product, adding solvents if desired, desolvating, and then thermally advancing the prereacted product to the desired state of crosslinking to thereby form the prepreg.
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公开(公告)号：US4855333A
公开(公告)日：1989-08-08
申请号：US35207
申请日：1987-04-06
IPC分类号： C09J163/10 , H05K3/10 , H05K3/38 , H05K3/46 , H05K7/06
CPC分类号： H05K7/06 , C09J163/10 , H05K3/386 , H05K2201/0195 , H05K2201/10287 , H05K3/103 , H05K3/4626 , Y10T428/31511 , Y10T428/31525 , Y10T428/31529
摘要： A high density dimensionally stable encapsulated wire circuit board and a method of making such a board is described. A photo-curable adhesive having a unique combination of rheological properties is utilized to bond insulated wires to a substrate. The unique combination of rheological properties of the adhesive used in the encapsulated wire circuit boards of this invention include a specified range of values for the Storage Shear Modulus and specified range of values for the Loss Angle ratio.A new photo-curable adhesive having these properties and a method of obtaining such an adhesive are also described.
摘要翻译： 描述了高密度尺寸稳定的封装线电路板和制造这种板的方法。 使用具有流变特性的独特组合的光固化粘合剂将绝缘导线粘合到基底上。 在本发明的封装线路板中使用的粘合剂的流变特性的独特组合包括存储剪切模量的特定值范围和损失角比的值的特定范围。 还描述了具有这些性质的新型可光固化粘合剂和获得这种粘合剂的方法。
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3.发明授权
公开(公告)号：US4479983A
公开(公告)日：1984-10-30
申请号：US456231
申请日：1983-01-07
IPC分类号： B23K35/22 , C08F2/00 , C08F2/48 , C08F290/00 , C08F299/00 , C08F299/02 , C09D163/10 , G03F7/004 , H05K3/28 , H05K3/34 , B05D3/06
CPC分类号： C08F299/028 , B23K35/224 , H05K3/287 , H05K2203/1105
摘要： A coating is produced by a method including a screen printing of a photopolymerizable composition on a printed circuit board, illuminating said composition to partially polymerize it and bake it to complete the polymerization.The composition used by said method contains a reaction product of a monoethylenically unsaturated carboxylic acid with a material of the group of epoxy resin and epoxidized novolak, a phenoxy resin, a thickening agent, a polyethylenically unsaturated compound, a photo-initiator and a solvent.The coating produced according to this invention is used as solder mask.
摘要翻译： 通过包括在印刷电路板上的可光聚合组合物丝网印刷的方法制造涂层，照射所述组合物以使其部分聚合并烘烤以完成聚合。 所述方法使用的组合物含有单烯键式不饱和羧酸与环氧树脂和环氧化酚醛清漆基团的材料，苯氧基树脂，增稠剂，多烯属不饱和化合物，光引发剂和溶剂的反应产物。 将根据本发明生产的涂层用作焊接掩模。
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公开(公告)号：US4544801A
公开(公告)日：1985-10-01
申请号：US639152
申请日：1984-08-09
CPC分类号： H05K7/06 , C09J163/10 , H05K3/386 , H05K2201/0195 , H05K2201/10287 , H05K3/103 , H05K3/4626
摘要： A high density dimensionally stable encapsulated wire circuit board and a method of making such a board is described. A photo-curable adhesive having a unique combination of rheological properties is utilized to bond insulated wires to a substrate. The unique combination of rheological properties of the adhesive used in the encapsulated wire circuit boards of this invention include a specified range of values for the Storage Shear Modulus and specified range of values for the Loss Angle ratio.
摘要翻译： 描述了高密度尺寸稳定的封装线电路板和制造这种板的方法。 使用具有流变特性的独特组合的光固化粘合剂将绝缘导线粘合到基底上。 在本发明的封装线路板中使用的粘合剂的流变特性的独特组合包括存储剪切模量的特定值范围和损失角比的值的特定范围。
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