公开(公告)号：US4691855A

公开(公告)日：1987-09-08

申请号：US814257

申请日：1985-12-30

申请人： Harumi Yagi

发明人： Harumi Yagi

IPC分类号： H05K13/06

CPC分类号： H01L24/78 ,  H01L24/46 ,  H05K13/06 ,  H01L2224/4847 ,  H01L2224/78313 ,  H01L2224/786 ,  H01L2224/851 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  Y10T29/49162 ,  Y10T29/53243

摘要： A twin wire splitter system comprises an X-Y table for mounting a printed circuit board thereon; a wire bonding device for continuously bonding a twin wire to a plurality of wire connecting positions on the printed circuit board; a feeding device for feeding the twin wire; a splitting device provided on a twin wire feeding path to split the twin wire; and a splitting operation controlling device for controlling the start and end of the twin wire splitting operation carried out by the splitting means, according to the length along the twin wire feeding path between the bonding position of the wire bonding device and the splitting position of the splitting device, the length of a portion of the twin wire to be split, and the feed length of the twin wire for each sucessive bonding operation corresponding to the connecting sequence of positions to be interconnected by the twin wire on the printed circuit board.

摘要翻译： 双线分线器系统包括用于在其上安装印刷电路板的X-Y工作台; 用于将双线连续地接合到印刷电路板上的多个电线连接位置的引线接合装置; 用于馈送所述双线的馈送装置; 分离装置，设置在双丝馈送路径上以分裂双网; 以及分割操作控制装置，用于控制由分割装置执行的双线分割操作的开始和结束，根据沿着双引线馈送路径在引线接合装置的接合位置和分接位置之间的长度 分割装置，待分割的双股线的一部分的长度，以及对应于通过印刷电路板上的双网互连的位置的连接顺序的每个成功接合操作的双线的馈送长度。

公开(公告)号：US20120083151A1

公开(公告)日：2012-04-05

申请号：US13185970

申请日：2011-07-19

申请人： Rie TAKADA ,  Tsuyoshi YAMAMOTO ,  Naoaki NAKAMURA ,  Harumi YAGI

发明人： Rie TAKADA ,  Tsuyoshi YAMAMOTO ,  Naoaki NAKAMURA ,  Harumi YAGI

IPC分类号： H01R4/26 ,  H01R43/20 ,  B23P11/00

CPC分类号： H01R13/635 ,  H01R43/26 ,  Y10T29/49821 ,  Y10T29/49822

摘要： A method of detachment of a connector which is provided with a housing having connector pins to be inserted into a board and with a first member which is arranged between the housing and the board and through which the connector pins are inserted, the method including a process of pulling out the connector pins from the board. This process utilizes the lever principle, which uses the first member as a fulcrum and which uses any point on the housing as a point of action, so as to pull out the connector pins from the board.

摘要翻译： 一种连接器的拆卸方法，该连接器设置有具有插入板中的连接器针脚的壳体和布置在壳体和板之间的第一构件，并且连接器插脚穿过该第一构件插入，该方法包括： 从板上拉出连接器针脚。 该方法利用杠杆原理，其使用第一构件作为支点，并且将壳体上的任何点用作作用点，以便从板上拉出连接器销。

公开(公告)号：US20120024512A1

公开(公告)日：2012-02-02

申请号：US13184723

申请日：2011-07-18

申请人： Tsuyoshi Yamamoto ,  Naoaki Nakamura ,  Rie Takada ,  Kenichiro Tsubone ,  Yosuhide Kuroda ,  Harumi Yagi

发明人： Tsuyoshi Yamamoto ,  Naoaki Nakamura ,  Rie Takada ,  Kenichiro Tsubone ,  Yosuhide Kuroda ,  Harumi Yagi

IPC分类号： F28F7/00 ,  B23P6/00

CPC分类号： H01L23/36 ,  F28F3/02 ,  F28F2280/00 ,  H01L21/4871 ,  H01L23/42 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/73253 ,  Y10T29/49721

摘要： A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.

摘要翻译： 一种修复半导体器件的方法包括转动按压部件以对安装在基板上的电子部件施加压力。 因此，通过接合层设置在电子部件上的散热器相对于电子部件在横向上位移。 通过用压力构件剪切结合层，从电子部件去除散热器。

公开(公告)号：US09117788B2

公开(公告)日：2015-08-25

申请号：US13184723

申请日：2011-07-18

申请人： Tsuyoshi Yamamoto ,  Naoaki Nakamura ,  Rie Takada ,  Kenichiro Tsubone ,  Yasuhide Kuroda ,  Harumi Yagi

发明人： Tsuyoshi Yamamoto ,  Naoaki Nakamura ,  Rie Takada ,  Kenichiro Tsubone ,  Yasuhide Kuroda ,  Harumi Yagi

IPC分类号： H01T23/00 ,  H01L23/36

CPC分类号： H01L23/36 ,  F28F3/02 ,  F28F2280/00 ,  H01L21/4871 ,  H01L23/42 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/73253 ,  Y10T29/49721

摘要： A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.

摘要翻译： 一种修复半导体器件的方法包括转动按压部件以对安装在基板上的电子部件施加压力。 因此，通过接合层设置在电子部件上的散热器相对于电子部件在横向上位移。 通过用压力构件剪切结合层，从电子部件去除散热器。

公开(公告)号：US6109507A

公开(公告)日：2000-08-29

申请号：US79521

申请日：1998-05-15

申请人： Harumi Yagi ,  Noritsugu Ozaki ,  Tsuyoshi Yamamoto ,  Toshiyuki Nakada ,  Takeshi Komiyama ,  Yoshihito Okuwaki

发明人： Harumi Yagi ,  Noritsugu Ozaki ,  Tsuyoshi Yamamoto ,  Toshiyuki Nakada ,  Takeshi Komiyama ,  Yoshihito Okuwaki

IPC分类号： H01L23/12 ,  H01L21/60 ,  H05K3/12 ,  H05K3/34 ,  B23K31/02 ,  H05K3/32

CPC分类号： H05K3/3484 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1184 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/11903 ,  H01L2224/13019 ,  H01L2924/00013 ,  H01L2924/00014 ,  H05K2201/035 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K3/1216 ,  Y10T29/49144

摘要： A method of forming solder bumps on pads provided on a board, wherein a plurality of solder bump layer forming cycles are repeatedly implemented. Each of the solder bump layer forming cycles includes the steps of printing solder paste on the board using a mask having mask openings and heating the solder paste so as to fuse the solder paste for forming solder bumps.

摘要翻译： 一种在设置在板上的焊盘上形成焊料凸块的方法，其中重复地实现多个焊料凸块层形成循环。 每个焊料凸块层形成循环包括以下步骤：使用具有掩模开口的掩模将焊膏印刷在板上，并加热焊膏，以熔化用于形成焊料凸块的焊膏。