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公开(公告)号:US06499335B2
公开(公告)日:2002-12-31
申请号:US09734546
申请日:2000-12-13
申请人: Tohru Nomura , Hideki Okoshi , Tomoko Yoshimura
发明人: Tohru Nomura , Hideki Okoshi , Tomoko Yoshimura
IPC分类号: G01N700
CPC分类号: G01N33/004 , G01N27/12 , G01N33/0047
摘要: A central electrode 12 is arranged in a coiled heater electrode 10. They are buried in a SnO2-based inner area 6, and the entirety is covered by a filter 8. The volume of the inner area 6 is set at from 1×10−3 mm3 to 16×10−3 mm3, the total volume of the bead 4 is set at from 15×10−3 mm3 to 70×10−3 mm3, and the ratio of the total volume of the bead 4 to the volume of the inner area 6 is set at from four to twenty to bring the sensor resistance in CO and that in methane closer to each other and increase the selectivity from hydrogen.
摘要翻译: 中心电极12布置在线圈加热器电极10中。它们被埋在基于SnO 2的内部区域6中,并且整个被过滤器8覆盖。内部区域6的体积设定为1×10 -3 mm 3 到16×10 -3 mm 3,珠4的总体积设定为15×10 -3 mm 3〜70×10 -3 mm 3,珠4的总体积与内区6的体积的比率设定为 四到二十个,使传感器电阻在CO和甲烷中的电阻更接近并增加氢的选择性。
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公开(公告)号:US07435321B2
公开(公告)日:2008-10-14
申请号:US10476947
申请日:2002-05-23
IPC分类号: G01N27/407
CPC分类号: G01N33/0027 , G01N27/4071 , G01N27/4074
摘要: A MEA 6 having a proton conductive membrane is sandwiched by metal plates 14, 15 and they are further sandwiched by heat pressable films 20, 21. An opening 24 and an opening 18 are formed in the heat pressable film 20 and the metal plate 14, respectively so that an electrode 10 is used as the sensing electrode and exposed to atmosphere to be measured. Openings 25, 19 are formed in the heat pressable film 21 and metal plate 15, respectively so that an electrode 11 is used as the counter electrode, and water vapor is supplied to the electrode from a water pack.
摘要翻译: 具有质子传导膜的MEA 6夹在金属板14,15之间,并进一步被可压热膜20,21夹持。 分别在可热压膜20和金属板14中分别形成开口24和开口18,使得电极10用作感测电极并暴露于要测量的大气。 开口25,19分别形成在可热压膜21和金属板15中,使得电极11用作对电极,并且水蒸气从水包提供给电极。
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公开(公告)号:US07393505B2
公开(公告)日:2008-07-01
申请号:US10522707
申请日:2003-07-28
申请人: Tomohiro Inoue , Hideki Okoshi , Kazunari Kaneyasu
发明人: Tomohiro Inoue , Hideki Okoshi , Kazunari Kaneyasu
CPC分类号: G01N27/407
摘要: A proton conductor gas sensor whose durability at high temperature is enhanced by using gel not converted to sol even at high temperature in a water reservoir. Fine particles of silica are gelled by adding water thereto and agitating the mixture under shear force. The thus obtained gel (34) is placed in a water reservoir of proton conductor gas sensor (2) and fed through steam introduction port (30) to MEA (10).
摘要翻译: 质子导体气体传感器,其耐高温性能通过使用即使在高温下也不会溶解在水槽中的凝胶来增强。 通过向其中加入水并在剪切力下搅拌混合物,使二氧化硅的细颗粒凝胶化。 将如此获得的凝胶(34)置于质子导体气体传感器(2)的储水器中,并通过蒸汽引入口(30)进料至MEA(10)。
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公开(公告)号:US06565812B1
公开(公告)日:2003-05-20
申请号:US09702698
申请日:2000-11-01
IPC分类号: G01N2700
CPC分类号: G01N27/12 , Y10T29/49 , Y10T29/49002
摘要: A base is provided with a concave and three leads, and the central lead is bent to the side opposite to the concave, and the other leads are bent to the side of the concave. A central electrode of a sensor element is attached to the central lead and the bottom of the concave and a coil serving as both a heater and an electrode is attached to the other leads to support the sensor element on a small base at four points.
摘要翻译: 基部设有凹陷和三根引线,中心引线弯曲到与凹面相对的一侧,另一个引线弯曲到凹面的一侧。 传感器元件的中心电极附接到中心引线和凹部的底部,并且用作加热器和电极两者的线圈附接到另一个引线,以将传感器元件支撑在四个小点上的小基座上。
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公开(公告)号:US20060120924A1
公开(公告)日:2006-06-08
申请号:US10522707
申请日:2003-07-28
申请人: Tomohiro Inoue , Hideki Okoshi , Kazunari Kaneyasu
发明人: Tomohiro Inoue , Hideki Okoshi , Kazunari Kaneyasu
IPC分类号: G01N31/22
CPC分类号: G01N27/407
摘要: A proton conductor gas sensor whose durability at high temperature is enhanced by using gel not converted to sol even at high temperature in a water reservoir. Fine particles of silica are gelled by adding water thereto and agitating the mixture under shear force. The thus obtained gel (34) is placed in a water reservoir of proton conductor gas sensor (2) and fed through steam introduction port (30) to MEA (10).
摘要翻译: 质子导体气体传感器,其耐高温性能通过使用即使在高温下也不会溶解在水槽中的凝胶来增强。 通过向其中加入水并在剪切力下搅拌混合物,使二氧化硅的细颗粒凝胶化。 将如此获得的凝胶(34)置于质子导体气体传感器(2)的储水器中,并通过蒸汽引入口(30)进料至MEA(10)。
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公开(公告)号:US5665473A
公开(公告)日:1997-09-09
申请号:US527225
申请日:1995-09-12
申请人: Tokio Okoshi , Yuka Kato , Hideki Okoshi , Kenichiro Miyahara , Masakatsu Maeda
发明人: Tokio Okoshi , Yuka Kato , Hideki Okoshi , Kenichiro Miyahara , Masakatsu Maeda
IPC分类号: H01L23/057 , H01L23/495 , B32B9/00
CPC分类号: H01L23/49537 , H01L23/057 , H01L24/49 , H01L2224/45014 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2224/85205 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/20753 , H01L2924/30107 , H01L2924/3011 , Y10S428/901
摘要: A package for mounting a semiconductor device comprises a base plate and a conductive layer laminated onto the base plate via an adhesive layer. The modulus of elasticity at 25.degree. C. of the adhesive layer is 10 kg/mm.sup.2 or less.
摘要翻译: 用于安装半导体器件的封装包括基板和通过粘合剂层层压到基板上的导电层。 粘合剂层的25℃下的弹性模量为10kg / mm 2以下。
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