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公开(公告)号：US4820769A
公开(公告)日：1989-04-11
申请号：US118910
申请日：1987-11-10
申请人： Morio Gaku , Hidenori Kinbara
发明人： Morio Gaku , Hidenori Kinbara
IPC分类号： C09J123/08 , C09J167/00 , C08L31/04 , C08L23/08
CPC分类号： C09J123/08 , C09J167/00
摘要： A hot melt adhesive composition comprising (A) 99 to 80 wt % of a thermoplastic resin selected from the group consisting of a substantially amorphous thermoplastic saturated polyester resin, an ethylene-vinyl acetate copolymer and an ethylene-ethyl acrylate copolymer and (B) from 1 to 20 wt % of a monofunctional or polyfunctional cyanate ester compound having at least one cyanato group in the molecule is disclosed. The hot melt adhesive composition can further contain a co-modifier, a monofunctional or polyfunctional maleimide compound or a cross-linking catalyst for the thermoplastic resin (A). This composition has improved adhesive force, mechanical characteristics and heat resistance.
摘要翻译： 一种热熔粘合剂组合物，其包含（A）99至80重量％的选自基本无定形的热塑性饱和聚酯树脂，乙烯 - 乙酸乙烯酯共聚物和乙烯 - 丙烯酸乙酯共聚物的热塑性树脂，和（B） 公开了1至20重量％的在分子中具有至少一个氰基的单官能或多官能氰酸酯化合物。 热熔粘合剂组合物还可以含有共改性剂，单官能或多官能马来酰亚胺化合物或热塑性树脂（A）的交联催化剂。 该组合物具有改善的粘合力，机械特性和耐热性。
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公开(公告)号：US4383903A
公开(公告)日：1983-05-17
申请号：US250897
申请日：1981-04-03
IPC分类号： C08G73/00 , C08F2/20 , C08F2/50 , C08F283/00 , C08F299/02 , C08G73/02 , C08G73/06 , C08J5/24 , H05K3/28 , G03C1/68 , G03C1/70
CPC分类号： C08F2/20 , C08F283/00 , C08F299/024 , Y10S430/12 , Y10S430/128
摘要： A photo-curable resin composition is disclosed comprising (i) a mixture and/or a preliminary reaction product of (a) at least one cyanate compound selected from the group consisting of polyfunctional cyanate esters, prepolymers of the cyanate esters, coprepolymers of the cyanate esters and an amine and mixtures thereof, (b) at least one compound selected from the group consisting of monomers having at least one olefinically double bond prepolymers of the monomers, liquid rubbers having one or more acryloyl or methacryloyl groups and mixtures thereof and optionally (c) at least one maleimide compound selected from the group consisting of polyfunctional maleimides, prepolymers of the maleimides, coprepolymers of the maleimides and an amine and mixtures thereof and (ii) a photo polymerization initiator or a photo sensitizer.
摘要翻译： 公开了一种光固化树脂组合物，其包含（i）（a）至少一种氰化物化合物的混合物和/或预反应产物，所述氰化物选自多官能氰酸酯，氰酸酯的预聚物，氰酸的共聚物 酯和胺及其混合物，（b）至少一种选自具有至少一种单体的烯属双键预聚物的单体，具有一个或多个丙烯酰基或甲基丙烯酰基的液体橡胶及其混合物和任选（ c）至少一种选自多官能马来酰亚胺，马来酰亚胺的预聚物，马来酰亚胺的共聚物和胺及其混合物的马来酰亚胺化合物和（ii）光聚合引发剂或光敏剂。
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公开(公告)号：US4871811A
公开(公告)日：1989-10-03
申请号：US235814
申请日：1988-08-23
申请人： Morio Gaku , Hidenori Kinbara
发明人： Morio Gaku , Hidenori Kinbara
IPC分类号： C09J123/08 , C09J167/00
CPC分类号： C09J123/08 , C09J167/00
摘要： A hot melt adhesive composition comprising (A) 99 to 80 wt % of a thermoplastic resin selected from the group consisting of a substantially amorphous thermoplastic saturated polyester resin, an ethylene-vinyl acetate copolymer and an ethylene-ethyl acrylate copolymer and (B) from 1 to 20 wt % of a monofunctional or polyfunctional cyanate ester compound having at least one cyanato group in the molecule is disclosed. The hot melt adhesive composition can further contain a co-modifier, a monofunctional or polyfunctional maleimide compound or a cross-linking catalyst for the thermoplastic resin (A). This composition has improved adhesive force, mechanical characteristics and heat resistance.
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4.发明授权Sheet material for laminate of printed circuit and laminate for printed circuit using the same 失效用于印刷电路层压板和用于印刷电路的层压板的片材
公开(公告)号：US5692940A
公开(公告)日：1997-12-02
申请号：US676180
申请日：1996-07-15
IPC分类号： C08J5/04 , C08J5/24 , D04H1/42 , D04H1/46 , D04H1/48 , D04H1/58 , D04H1/64 , D04H13/00 , H05K1/03 , B32B5/06 , B32B9/00 , B32B27/06 , B32B31/00
CPC分类号： C08J5/046 , B32B5/28 , C08J5/24 , D04H1/435 , D04H1/48 , D04H1/49 , D04H1/587 , D04H1/64 , H05K1/0366 , H05K2201/0141 , H05K2201/0145 , H05K2201/0278 , H05K2201/0293 , H05K2203/1105 , Y10S428/901 , Y10T428/31 , Y10T428/31786 , Y10T442/689
摘要： A substrate for a laminate which comprises a nonwoven fabric which is composed mainly of a liquid crystal polyester fiber, and which is subjected to (1) an entangling treatment, (2) a heating treatment to impart adhesivity to a thermosetting resin, and (3) a surface-modifying treatment, and a laminate containing at least one prepreg prepared by impregnating the substrate with a thermosetting resin and drying are disclosed. The substrate of the present invention has low dielectric constant, is light, exhibits low hygroscopicity, and has good properties to be impregnated with the thermosetting resin and good adhesiveness to the thermosetting resin.
摘要翻译： PCT No.PCT / JP95 / 02328 Sec。 371日期：1996年7月15日 102（e）日期1996年7月15日PCT提交1995年11月15日PCT公布。 公开号WO96 / 15306 日期：1996年5月23日一种层叠体用基材，其为主要由液晶聚酯纤维构成的无纺布，并进行（1）缠结处理，（2）加热处理以赋予热固性树脂 和（3）表面改性处理，以及含有至少一种通过用热固性树脂浸渍基材而制备的预浸料并进行干燥的层压体。 本发明的基材具有低介电常数，轻质，吸湿性低，并且具有良好的热固性树脂浸渍性能和对热固性树脂的良好粘附性。
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公开(公告)号：US5480269A
公开(公告)日：1996-01-02
申请号：US254913
申请日：1994-06-06
申请人： Mitsuo Ejiri , Hidenori Kinbara
发明人： Mitsuo Ejiri , Hidenori Kinbara
CPC分类号： H05K3/0047 , H05K2203/0769 , H05K2203/0786 , H05K2203/127 , Y10T408/03 , Y10T408/44
摘要： A method of drilling a through-hole for inter-surface conduction in a laminate for a printed wiring board, in which the heat generation in a drill bit can be inhibited in drilling holes, quality holes can be highly efficiently made in the presence, on the laminate surface, of a novel water-soluble lubricant sheet which has high strength and can be handled easily, the method comprising drilling the through-holes in the presence of a water-soluble lubricant sheet which has a thickness of 0.02 to 3 mm and is formed from a mixture of 20 to 90% by weight of a polyether ester with 10 to 80% by weight of a water-soluble lubricant.
摘要翻译： 在用于印刷线路板的层叠体中钻孔用于表面间导通的方法，其中可以在钻孔中抑制钻头中的发热，可以在存在下高效地进行质量孔 该层压体表面具有高强度且易于处理的新型水溶性润滑剂片，该方法包括在厚度为0.02〜3mm的水溶性润滑剂片的存在下钻孔， 由20至90重量％的聚醚酯与10至80重量％的水溶性润滑剂的混合物形成。
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公开(公告)号：US4937132A
公开(公告)日：1990-06-26
申请号：US288370
申请日：1988-12-22
申请人： Morio Gaku , Hidenori Kinbara
发明人： Morio Gaku , Hidenori Kinbara
CPC分类号： H05K1/0366 , H05K1/024 , H05K2201/0145 , H05K2201/015 , H05K2201/0278 , H05K2201/029 , H05K2203/095 , Y10S428/901 , Y10T428/24917 , Y10T428/249921 , Y10T428/249922 , Y10T428/31504 , Y10T428/31678 , Y10T428/31725 , Y10T428/31935 , Y10T442/3065 , Y10T442/3528
摘要： A printed circuit board material composed of a reinforcing base material and a cured or uncured resin is disclosed, in which the base material is a fabric woven from hybrid yarns each of which is prepared from (I-1) at least one multifilament yarn made of glass fiber having a dielectric constant at 1 MHz of not higher than 5.5 or (I-2) at least one multifilament yarn made of heat resistant engineering plastic fiber having a dielectric constant at 1 MHz of not higher than 5.5 and (II) at least one yarn made of fluoroplastic long fiber and the thermosetting resin is a thermosetting resin whose dielectric constant after curing is not higher than 3.7. The material is excellent in dielectric properties and characteristics required for use in printed circuit board, such as heat resistance in soldering, flexural strength and peel strength of copper foil. The material shows substantial constancy of dielectric constant even with change of resin content and is therefore particularly suitable for use in a multilayer printed circuit board.
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公开(公告)号：US4917758A
公开(公告)日：1990-04-17
申请号：US354954
申请日：1989-05-19
申请人： Koichi Ishizuka , Morio Gaku , Kenzi Ishii , Hidenori Kinbara , Masakazu Motegi
发明人： Koichi Ishizuka , Morio Gaku , Kenzi Ishii , Hidenori Kinbara , Masakazu Motegi
CPC分类号： C23F1/18 , H05K3/06 , H05K2203/0353
摘要： A method for preparing a thin copper foil-clad substrate for the manufacture therefrom of circuit boards, which comprises subjecting a copper foil-clad circuit board substrate comprising an electrically insulating support having provided on one or both sides thereof a copper foil having an average thickness of 12 .mu.m or more to etching with an etching solution for copper, the etching being performed such that the whole surface of the copper foil is etched at a predetermined etching rate selected from the range of from 0.01 to 0.3 .mu.m/sec, thereby to reduce the thickness of the copper foil on at least one side of the insulating support to 10 to 80% of its original thickness, and the variation of the thickness of the copper foil remaining after the etching is within .+-.2.0 .mu.m on the basis of a desired thickness.
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