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    Resin composition and its use
    6.
    发明申请
    Resin composition and its use 审中-公开
    树脂组合物及其用途

    公开(公告)号：US20060093824A1

    公开(公告)日：2006-05-04

    申请号：US11251934

    申请日：2005-10-18

    申请人： Mitsuru Nozaki

    发明人： Mitsuru Nozaki

    IPC分类号： C08K5/34 ,  B32B9/04

    CPC分类号： B32B15/14 ,  B32B15/08 ,  B32B15/20 ,  B32B27/28 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2457/08 ,  C08K5/3415 ,  H05K1/0353 ,  Y10T428/31504 ,  Y10T428/31721 ,  C08L79/00

    摘要： A thermosetting resin composition containing a cyanate ester resin (a) having at least two cyanate groups per molecule, a bismaleimide (b) represented by the formula (1) wherein each of R1, R2, R3, and R4 is independently an alkyl group having 3 or less carbon atoms, and a bismaleimide (c) represented by the formula (2), a copper-clad laminate comprising the above thermosetting resin composition and a printed wiring board comprising the above copper-clad laminate.

    摘要翻译： 含有每分子具有至少两个氰酸酯基的氰酸酯树脂（a）的热固性树脂组合物，由式（1）表示的双马来酰亚胺（b），其中R 1，R 2， 2，R 3和R 4独立地为具有3个以下碳原子的烷基和由式（2）表示的双马来酰亚胺（c） ），包含上述热固性树脂组合物的覆铜层压板和包含上述覆铜层压板的印刷线路板。

    Process for producing cyanate ester resin cure product
    8.
    发明授权
    Process for producing cyanate ester resin cure product 失效
    生产氰酸酯树脂固化产品的方法

    公开(公告)号：US5186880A

    公开(公告)日：1993-02-16

    申请号：US547207

    申请日：1990-07-03

    申请人： Morio Gaku ,  Mitsuru Nozaki

    发明人： Morio Gaku ,  Mitsuru Nozaki

    IPC分类号： C08K5/17 ,  C08G73/06 ,  C08K5/56 ,  C08L79/04

    CPC分类号： C08G73/0655

    摘要： The invention is a process for making a cyanate ester resin cured product by (1) adding organic metal compound (a) and triethanol amine(b) to a cyanate resin composition which is flowable at a temperature of not more than 50.degree. C. comprising as its main component polyfunctional cyanate ester compound having at least two cyanate groups, thereby forming a cyanate resin composition having 0.1-5% by weight of (a) and 0.1-5% by weight of (b), which is flowable at a temperature of not more than 50.degree. C.; (2) molding the composition at a temperature of not more than 50.degree. C. (3) primary curing at a temperature of not more than 50.degree. C.; and (4) post-curing at a temperature of not less than 170.degree. C.

    Process of producing plastic-molded printed circuit boards
    9.
    发明授权
    Process of producing plastic-molded printed circuit boards 失效
    生产塑料印刷电路板的工艺

    公开(公告)号：US4764327A

    公开(公告)日：1988-08-16

    申请号：US3344

    申请日：1987-01-14

    申请人： Mitsuru Nozaki ,  Hirokatsu Nakamura

    发明人： Mitsuru Nozaki ,  Hirokatsu Nakamura

    IPC分类号： B29C33/40 ,  C08K3/08 ,  C08L79/08 ,  H05K3/00

    CPC分类号： H05K3/0014 ,  B29C33/40 ,  C08K3/08 ,  C08L79/08 ,  H05K2201/09118

    摘要： A process of producing plastic-molded printed circuit boards by injection-molding a heat resistant plastic to form a plastic molding having many perforations and forming a conductive layer on the molding, which comprises molding the heat resistant plastic using a mold for injection-molding obtained by preparing a die set for injection-molding composed of a fixed side metal platen having at least an inlet for molten resin and forming a space for installing mold part(s), a stripper metal platen having, if necessary, an inlet for molten resin connected to the fixed side metal platen and forming a space for installing mold part(s), and a movable side metal platen forming a space for installing mold part(s); and assembling a pair of molds composed of a mold I having a concaved portion for cavity and a mold II having perforations for passing hard pins for forming holes and, if desired, a concaved portion for cavity, said molds being formed by a cured resin composition or a composite of a metal and a cured resin composition, and a hard pin mold III having hard pins for forming holes fixed thereto in such a manner that(a) the mold I is fixed to the fixed side metal platen, the mold II is fixed to the stripper metal platen, and the hard pin mold III is fixed to the movable side metal platen in this order, or(b) the hard pin mold III is fixed to the fixed side metal platen, the mold II is fixed to the stripper metal platen, and the mold I is fixed to the movable side metal platen in this order.

    摘要翻译： 一种通过注射成型耐热塑料来形成塑料模制印刷电路板的方法，以形成具有许多穿孔的塑料模制件，并在模制件上形成导电层，该方法包括使用所获得的用于注模的模具模制耐热塑料 通过制备由至少具有熔融树脂入口并形成用于安装模具部件的空间的固定侧金属压板组成的注塑成型模具，如果需要，具有熔融树脂入口的汽提金属压板 连接到固定侧金属压板并形成用于安装模具部件的空间和形成用于安装模具部件的空间的可动侧金属压板; 并且组装由模具I构成的一对模具，该模具具有用于空腔的凹部，模具II具有用于穿过用于形成孔的硬销的穿孔，并且如果需要，还需要一个空腔的凹部，所述模具由固化树脂组合物形成 或金属和固化树脂组合物的复合物，以及具有用于形成孔的硬销的硬销模具III，其以（a）模具I固定在固定侧金属压板上，模具II为 固定到剥离金属压板上，硬销模具III依次固定到可动侧金属压板上，或者（b）硬销模具III固定到固定侧金属压板上，模具II固定到 剥离金属压板，并且模具I按此顺序固定到可移动侧金属压板。