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12 条记录 (耗时 0.013 秒)

    Process for preparing superconductive wiring board
    3.
    发明授权
    Process for preparing superconductive wiring board 失效
    制备超导布线板的工艺

    公开(公告)号：US4913769A

    公开(公告)日：1990-04-03

    申请号：US228297

    申请日：1988-08-04

    申请人： Naoya Kanda ,  Takayoshi Sowa ,  Tetsuya Yamazaki ,  Hiroaki Okudaira

    发明人： Naoya Kanda ,  Takayoshi Sowa ,  Tetsuya Yamazaki ,  Hiroaki Okudaira

    IPC分类号： H01L39/24

    CPC分类号： H01L39/2464 ,  Y10S505/816 ,  Y10S505/82

    摘要： The present invention relates to an element comprising a superconductive material or a wiring formation technique. In a thin film wiring board in which a superconductive material is used as a conductor, annealing should be conducted at a high temperature in an oxygen atmosphere after formation of a film in order to convert the conductor portion into a superconductive material, which makes it necessary to use an inorganic oxide as the insulating film. This brought about a problem that the etching of the second and subsequent insulation layers causes a damage to the wiring and insulation layer provided thereunder.In the present invention, an over-etching preventing layer is provided on a wiring layer provided under the second and subsequent insulation layers in order to solve the problem in question.The present invention brings about an effect of realizing the formation of a multi-layered wiring layer by making use of a superconductive material.

    摘要翻译： 本发明涉及一种包括超导材料或布线形成技术的元件。 在其中使用超导材料作为导体的薄膜布线板中，在形成膜之后，应在氧气氛中在高温下进行退火，以便将导体部分转换为超导材料，这使得它成为必要 使用无机氧化物作为绝缘膜。 这导致了第二和随后的绝缘层的蚀刻对其上提供的布线和绝缘层造成损坏的问题。 在本发明中，为了解决上述问题，在设置在第二绝缘层及其后的绝缘层的布线层上设置防过蚀层。 本发明通过利用超导材料产生实现多层布线层的形成的效果。

    Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same
    5.
    发明授权
    Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same 失效
    化学镀金液，使用金的电镀方法，以及使用其镀金的电子器件

    公开(公告)号：US5202151A

    公开(公告)日：1993-04-13

    申请号：US532656

    申请日：1990-06-04

    申请人： Jiro Ushio ,  Osamu Miyazawa ,  Akira Tomizawa ,  Hitoshi Yokono ,  Naoya Kanda ,  Naoko Matsuura ,  Setsuo Ando ,  Hiroaki Okudaira

    发明人： Jiro Ushio ,  Osamu Miyazawa ,  Akira Tomizawa ,  Hitoshi Yokono ,  Naoya Kanda ,  Naoko Matsuura ,  Setsuo Ando ,  Hiroaki Okudaira

    IPC分类号： C23C18/44

    CPC分类号： C23C18/44

    摘要： The present invention relates to an electroless gold plating solution, a method of plating by using the same, and an electronic device plated with gold by using the same.According to the present electroless gold plating solution, the plating solution components contain no cyanide ions, the amount of a reducing agent used is small, and gold plating can be carried out without causing the gold plating on conducting paths having a fine interval between them to short-circuit the conducting paths.Therefore, according to the method of gold plating by using said electroless gold plating solution, a plating method that is safe in the plating work and in the treatment of its waste liquor can be accomplished. The method has a feature that the method can provide an electronic device on which parts can be mounted highly densely, and wherein the joint reliability to the parts is high.

    摘要翻译： 本发明涉及无电镀金液，使用该方法的电镀方法以及使用该方法镀金的电子器件。 根据本发明的无电解镀金液，电镀液成分不含氰化物离子，还原剂的使用量少，可以进行镀金而不会在其间具有微细间隔的导电路径上进行镀金， 短路导通路径。 因此，根据通过使用所述无电解镀金液的镀金方法，可以实现电镀工作中安全的镀液方法及其废液的处理。 该方法具有该方法能够提供高密度地安装部件的电子设备，并且其中对部件的连接可靠性高的特征。

    Control system
    8.
    发明授权
    Control system 失效
    控制系统

    公开(公告)号：US5510976A

    公开(公告)日：1996-04-23

    申请号：US194378

    申请日：1994-02-08

    申请人： Naoki Tanaka ,  Hiroshi Okamoto ,  Masayoshi Naito ,  Shin-ichiro Umemura ,  Yasuo Morooka ,  Masahiro Kayama ,  Hiroaki Okudaira

    发明人： Naoki Tanaka ,  Hiroshi Okamoto ,  Masayoshi Naito ,  Shin-ichiro Umemura ,  Yasuo Morooka ,  Masahiro Kayama ,  Hiroaki Okudaira

    IPC分类号： G05B5/01 ,  C05B13/02 ,  G06F15/18

    CPC分类号： G05B5/01 ,  Y10S706/903

    摘要： A control system is for accelerating stabilization of a chaotic state of a controlled system into a desired periodic state. In the control system, the SOGY algorithm is extended to permit selection of a region on a chaotic attractor as a target, so that the SOGY algorithm can be successfully combined with the OGY algorithm for the purpose of stabilization of the controlled system in the periodic state. Also, the method of nonlinear prediction is introduced so as to secure the effectiveness of the SOGY algorithm. Further, an uncertainty of prediction is taken into consideration so as to eliminate unnecessary control and to improve the effectiveness of the SOGY algorithm.

    摘要翻译： 控制系统用于加速将受控系统的混沌状态稳定到期望的周期状态。 在控制系统中，扩展SOGY算法以允许选择混沌吸引子上的一个区域作为目标，从而SOGY算法可以与OGY算法成功合并，以便在周期状态下稳定受控系统 。 此外，引入了非线性预测的方法，以确保SOGY算法的有效性。 此外，考虑到预测的不确定性，以消除不必要的控制并提高SOGY算法的有效性。

    Magnetic recording medium having an amorphous, nonmagnetic nickel-tungston-phosphorus underlayer
    9.
    发明授权
    Magnetic recording medium having an amorphous, nonmagnetic nickel-tungston-phosphorus underlayer 失效
    磁记录介质具有无定形，非磁性的镍 - 钨 - 磷底层

    公开(公告)号：US4735853A

    公开(公告)日：1988-04-05

    申请号：US863503

    申请日：1986-05-15

    申请人： Hiroaki Okudaira ,  Hitoshi Oka ,  Masako Fujisawa ,  Yoshio Gobara ,  Nobuo Nakagawa

    发明人： Hiroaki Okudaira ,  Hitoshi Oka ,  Masako Fujisawa ,  Yoshio Gobara ,  Nobuo Nakagawa

    IPC分类号： G11B5/66 ,  G11B5/62 ,  G11B5/64 ,  G11B5/73 ,  G11B5/738 ,  G11B5/82 ,  H01F10/26

    CPC分类号： G11B5/7325 ,  Y10S428/90 ,  Y10T428/265 ,  Y10T428/31678

    摘要： Disclosed is a magnetic recording medium in which an underlayer formed below a magnetic medium, in which a signal is written, is composed of a nickel alloy comprising 0.05 to 10 atom % of tungsten and 14 to 30 atom % of phosphorus. In this magnetic recording medium, the temperature for formation of magnetic medium and the temperature for formation of a protective film can be elevated over the levels adopted in the conventional techniques. Therefore, the magnetic characteristics and abrasion resistance can be improved. Furthermore, the magnetic recording medium is excellent in the mechanical strength and corrosion resistance. Accordingly, the reliability of the magnetic medium can be highly improved.

    摘要翻译： 公开了一种磁记录介质，其中形成在其上写有信号的磁介质下方的底层由包含0.05至10原子％的钨和14至30原子％的磷的镍合金组成。 在这种磁记录介质中，用于形成磁介质的温度和用于形成保护膜的温度可以提高到常规技术中采用的水平。 因此，可以提高磁特性和耐磨性。 此外，磁记录介质的机械强度和耐腐蚀性优异。 因此，可以大大提高磁性介质的可靠性。