摘要:
The present invention relates to an element comprising a superconductive material or a wiring formation technique. In a thin film wiring board in which a superconductive material is used as a conductor, annealing should be conducted at a high temperature in an oxygen atmosphere after formation of a film in order to convert the conductor portion into a superconductive material, which makes it necessary to use an inorganic oxide as the insulating film. This brought about a problem that the etching of the second and subsequent insulation layers causes a damage to the wiring and insulation layer provided thereunder.In the present invention, an over-etching preventing layer is provided on a wiring layer provided under the second and subsequent insulation layers in order to solve the problem in question.The present invention brings about an effect of realizing the formation of a multi-layered wiring layer by making use of a superconductive material.
摘要:
In an image display device that utilizes field emission and has electron sources made of carbon nanotube or the like, a break attributable to a wiring pattern of thin lines is controlled. Cathode spots and cathode lines are formed independently of each other so that even if one cathode spot is broken, all the cathode lines may become defective. Specifically, each of the cathode spots includes an electron emission layer and a cathode base bearing the electron emission layer. The cathode lines are formed separately. Each cathode spot is electrically coupled to a cathode line via a cathode branchline. Owing to the structure, even if part of the electron emission layer is broken, the other part thereof coupled to the cathode lines will not be adversely affected.
摘要:
In lithographic (exposure) processing for semiconductor device fabrication, the task of extracting exposure parameters is performed by calculating exposure energy and focus offset using a test wafer for each exposure device, because fluctuations due to differences between exposure devices are large. For the fabrication of semiconductor devices in multiple-product small-lot production, the number of times the task of extracting exposure parameters has to be performed increases, so that the operation ratio of the exposure devices decreases, and the TAT of the semiconductor device fabrication increases. Moreover, as the miniaturization of semiconductor devices advances, differences between the exposure devices cause defects due to the exposure processing, and the yield of the semiconductor device fabrication decreases. In an improved method of exposure processing for semiconductor devices, the exposure energy and focus offset according to the illumination parameters for an exposure device and optical projection system, using information regarding the projection lens aberrations of a plurality of exposure devices, the photoresist parameters, and the circuit pattern information, as determined beforehand, are calculated using an optical development simulator, and the exposure processing is carried out using an exposure device, selected from a plurality of exposure devices, in which the process window is within a certain tolerance value.
摘要:
In an image display apparatus using an FED or an organic EL element, image display that is high in illumination uniformity and high in image quality can be performed. A display element with a matrix structure which conducts linear sequential driving which determines the luminance by a current is used, a threshold voltage of a cathode line immediately before one select period has been terminated where a control electrode line is sequentially driven is measured by a threshold voltage measuring section, the measured threshold voltage is recorded for each of the pixels, and a driving signal at the time of selecting the pixel is corrected by using the value of the recorded threshold voltage, to thereby control electric charge that is emitted from a cathode.
摘要:
A ceramic material for an optical member which shows black, wherein the ceramic material comprises a reaction-sintered sintered ceramic body prepared by synthesizing a formed body of a mixture comprising a ceramic raw material and a component that accelerates blackening, making use of a reaction sintering; and wherein the ceramic material is a porous body.
摘要:
An image display device in which a damage which is imparted to carbon nanotubes is small and electron emission characteristics are favorable and a production method thereof are provided. A printed film 6 having carbon nanotubes 3, a resin 4 and a carbon component 5 is formed on a cathode electrode 2 of a glass substrate 1 and, then, by irradiating laser having a short pulse and high output in an ultraviolet region on the thus-formed printed film 6, the resin 4 is thermally decomposed and evaporated and, thereafter, by an impact generated at that time, binding between carbon nanotubes 3 themselves in the vicinity of a surface of the printed film 6 is severed and, at the same time, the carbon nanotubes 3 come to be in a state of being raised on the surface of the printed film 6.
摘要:
Two electrodes out of a cathode electrode, a gate electrode and a focusing gate electrode are formed on a same plane of a back substrate adjacent to each other, and this electrode structure is stacked in plural stages whereby the number of steps of printing process for forming the respective electrodes can be decreased and the alignment accuracy at the time of manufacturing the electrode structure can be largely alleviated. Further, by forming the cathode electrode and the gate electrode using the same material which contains carbon nanotubes, the alignment accuracy at the time of manufacturing the electrode structure can be largely alleviated. Accordingly, it is possible to manufacture an emissive flat panel display device easily and at a low cost using printing coating process or the like which is usually used.
摘要:
A plastic case for a photographic film cassette consisting of a case body having a closed bottom and an open top, and a lid to be fitted to the open top of the case body, characterized by comprising a supporting device formed integrally on an internal bottom surface of the case body. The supporting device is upwardly tapered and deformable by the photographic film cassette when the lid is fitted to the case body and depresses the photographic film cassette into the case body. The supporting device is constituted of a pair of supporting ribs whose upper ends have a thickness of 0.12 to 0.35 mm. The ribs are disposed apart from each other, and the upper ends are inclined in opposite directions to each other relative to the internal bottom surface of the case body.
摘要:
In a token train retrieval device including a memory device (24) for memorizing a plurality of tokens as stored tokens each of which starts at a starting address and ends at an end address and each of which has a nest level selected from first through N-th nest levels and comprises a header and a data set where the header comprises a data length code and a data identifier code including a nest bit, a retrieval condition memory (25) memorizes a retrieval condition as a stored condition. Supplied with the header, a header register (26) holds the data length code, the data identifier code, and the nest bit as a held data length code, a held data identifier code, and a held nest bit. Responsive to the held data identifier code and a decided nest level, a checking circuit (27) checks whether or not the stored condition is satisfied to produce a matching signal when the stored condition is satisfied. An intra-train address generating circuit (29) generates an intra-train address variable in response to the matching signal, the held nest bit, and the held data length code. By using the intra-train address and the held data length code, an end address calculating circuit (30) calculates the end address of each token as a calculated address. By using the calculated address, the intra-train addresses, and the held nest bit, a nest level decision circuit (31) decides the decided nest level indicative of one of the first through the N-th nest levels.
摘要:
A highly reliable LED package mounting structure which can realize improvement in solder fatigue life at low costs is provided. An LED package has a light-emitting surface which is perpendicular to a mounting surface of a circuit board, comprises connection terminal portions on the side face or on the side face and the bottom face of the package, and is joined with the circuit board by soldering via the connection terminal portion. Furthermore, the shape of the solder is optimized by defining the relative position relation between the end of an electrode on the central side of the LED package on the bottom face of an LED package body and the end of a component mounting pad on the circuit board.