公开(公告)号：US09028982B2

公开(公告)日：2015-05-12

申请号：US12991902

申请日：2009-03-02

Applicant: Shinji Yae ,  Tatsuya Hirano ,  Hitoshi Matsuda

Inventor： Shinji Yae ,  Tatsuya Hirano ,  Hitoshi Matsuda

IPC: B32B9/00 ,  B32B19/00 ,  B32B9/04 ,  B32B9/06 ,  H01L21/02 ,  C23C18/16 ,  C23C18/44 ,  C23C18/54

CPC classification number: H01L21/02697 ,  C23C18/1651 ,  C23C18/1658 ,  C23C18/44 ,  C23C18/54 ,  Y10S977/721 ,  Y10S977/779

Abstract: Disclosed is a composite material wherein adhesion between a silicon surface and a plating material is enhanced. A method and an apparatus for producing the composite material are also disclosed. The method for producing a composite material comprises a dispersion/allocation step wherein the surface of a silicon substrate (102), which is a matrix provided with a silicon layer at least as the outermost layer, is immersed into a first solution containing gold (Au) ions, so that particulate or island-shaped gold (Au) serving as a first metal and substituted with a part of the silicon layer are dispersed/allocated on the matrix surface, and a plating step wherein the silicon substrate (102) is immersed into a second solution (24), which contains a reducing agent to which gold (Au) exhibits catalyst activity and metal ions which can be reduced by the reducing agent, so that the surface of the silicon substrate (102) is covered with the metal or an alloy of the metal (108) which is formed by autocatalytic electroless plating using gold (Au) as a starting point.

Abstract translation: 公开了一种复合材料，其中硅表面和电镀材料之间的粘附性增强。 还公开了一种用于生产复合材料的方法和装置。 复合材料的制造方法包括：分散/分配步骤，其中将作为至少具有最外层的硅层的基体的硅基板（102）的表面浸入含有金（Au ）离子，使得用作第一金属并被硅层的一部分取代的颗粒状或岛状金（Au）分散/分配在基体表面上，以及电镀步骤，其中硅基板（102）浸没 进入第二溶液（24），其含有金（Au）表现出催化剂活性的还原剂和可被还原剂还原的金属离子，使得硅衬底（102）的表面被金属覆盖 或通过使用金（Au）作为起点的自催化无电镀形成的金属（108）的合金。

公开(公告)号：US5972648A

公开(公告)日：1999-10-26

申请号：US861459

申请日：1997-05-22

Applicant: Akiko Sukesada ,  Satoru Misawa ,  Hitoshi Matsuda

Inventor： Akiko Sukesada ,  Satoru Misawa ,  Hitoshi Matsuda

IPC: A61K38/00 ,  C07K14/815 ,  C12N15/12 ,  C07H21/04 ,  C07K14/00 ,  C12N15/63

CPC classification number: C07K14/815 ,  A61K38/00

Abstract: Disclosed are hirudin analogs, a method of manufacture thereof, and anticoagulant compositions containing the same. Sequences Asp.sup.33 -Gly.sup.34 or Asp.sup.62 -Ala.sup.63 of naturally-occurring hirudins or their analogs were substituted as disclosed to suppress the formation of succinimide- or beta- forms, thereby yielding hirudin analogs with high stability, high anti-thrombin activity, and therapeutic potential as anticoagulants. Hirudin analogs having Val.sup.1 -Val.sup.2 of naturally-occurring hirudin substituted with Ile.sup.1 -Ile.sup.2 are preferred for their high antithrombiin activity. The invention also provides DNAs encoding the amino acid sequence of hirudin analogs, expression vectors, recombinant microogranisms, and a method of manufacturing hirudin analogs using recombinant microorganisms.

Abstract translation: 公开了水蛭素类似物，其制造方法和含有该水溶液的抗凝剂组合物。 天然存在的水蛭素或其类似物的序列Asp33-Gly34或Asp62-Ala63被公开地取代以抑制琥珀酰亚胺或β-形成，由此产生具有高稳定性，高抗凝血酶活性和治疗潜力的水蛭素类似物 抗凝剂 由于其抗血小板活性高，因此优选具有被Ile1-Ile2取代的天然水蛭素的Val1-Val2的水蛭素类似物。 本发明还提供编码水蛭素类似物，表达载体，重组微粒体的氨基酸序列的DNA，以及使用重组微生物制备水蛭素类似物的方法。

公开(公告)号：US4997600A

公开(公告)日：1991-03-05

申请号：US356269

申请日：1989-05-23

Applicant: Tsuguo Okumura ,  Shinichi Ohashi ,  Hitoshi Matsuda ,  Kazuhisa Miyashita ,  Naomichi Yamagishi

Inventor： Tsuguo Okumura ,  Shinichi Ohashi ,  Hitoshi Matsuda ,  Kazuhisa Miyashita ,  Naomichi Yamagishi

IPC: B29C47/88 ,  B29L7/00

CPC classification number: B29C47/887 ,  B29C47/0021 ,  B29C47/8845

Abstract: A thermoplastic sheet is prepared by (i) extruding a molten thermoplastic resin in the form of a sheet from a molding die; (ii) applying static charges to the extruded resin sheet from a first electrode whereby the charged resin sheet is pinned to the surface of an electrical insulating layer of a quenching roller to quench the resin sheet; (iii) peeling the quenched sheet from the surface of the quenching roller; and (v) applying electrostatic charges having a reverse polarity to that of the electrostatic charges from the first electrode to the exposed surface portion of the quenching roller from a second electrode. The quenching roller is made of an electrically earthed substrate and the electrical insulating layer formed on the surface of the substrate. The second electrode is made of a plurality of electrodes arranged at intervals along the rotating direction of the quenching roller between the sheet-peeling position where the quenched sheet is peeled from the quenching roller and the sheet pinning-initiating position where the sheet to be quenched is pinned to the quenching roller, and the electrical insulating layer has a volume resistance and surface resistance of at least 10.sup.7 .OMEGA. and a surface roughness not larger than 0.3 .mu.m expressed as the center line average roughness (Ra).

公开(公告)号：US20110151242A1

公开(公告)日：2011-06-23

申请号：US12920638

申请日：2009-03-02

Applicant: Shinji Yae ,  Tatsuya Hirano ,  Hitoshi Matsuda

Inventor： Shinji Yae ,  Tatsuya Hirano ,  Hitoshi Matsuda

IPC: B32B3/26 ,  B05D1/36 ,  B05D5/00 ,  B05D3/10

CPC classification number: G11B5/858 ,  B82Y30/00 ,  C23C18/1619 ,  C23C18/1879 ,  C23C18/54 ,  G11B5/65 ,  Y10T428/12014 ,  Y10T428/12028 ,  Y10T428/24273 ,  Y10T428/249954 ,  Y10T428/24999

Abstract: Proposed are a composite material, wherein non-penetrating pores that are formed in a silicon surface layer are filled up with a metal or the like without leaving any voids by using the plating technique, and a method of producing the composite material. A composite material, which has been packed at a high accuracy, or in other words, in which little voids are left, can be obtained by filling up non-penetrating pores that are formed from a silicon surface (100) substantially with a second metal or an alloy of the second metal (106) with the use of the autocatalytic electroless plating technique wherein a first metal located at the bottom of the non-penetrating pores as described above serves as the starting point.

Abstract translation: 提出了一种复合材料，其中形成在硅表面层中的非穿透孔被金属等填充，而不会通过使用电镀技术而留下任何空隙，以及制造复合材料的方法。 通过填充由基本上具有第二金属的硅表面（100）形成的非穿透孔，可以获得以高精度包装的换句话说，其中留下很少空隙的复合材料 或第二金属（106）的合金与使用如上所述的非穿透孔底部的第一金属作为起始点的自催化化学镀技术。

公开(公告)号：US5908953A

公开(公告)日：1999-06-01

申请号：US988099

申请日：1997-12-10

Applicant: Hitoshi Matsuda ,  Toshiharu Shibata ,  Hidekichi Hashimoto ,  Mitsumasa Kitai

Inventor： Hitoshi Matsuda ,  Toshiharu Shibata ,  Hidekichi Hashimoto ,  Mitsumasa Kitai

IPC: C07C253/14 ,  C07C253/34 ,  C07C255/20 ,  C07C255/10 ,  C07C253/12

CPC classification number: C07C253/34 ,  C07C253/14

Abstract: Crude (R)-4-cyano-3-hydroxybutyric acid lower alkyl ester, obtained by subjecting an (S)-4-halogeno-3-hydroxybutyric acid lower alkyl ester to a cyano-introducing reaction, is purified by distillation carried out in the presence of a solvent having a boiling point within the range of 50.degree. C. to 160.degree. C. at 10 Torr.

Abstract translation: 通过使（S）-4-卤代-3-羟基丁酸低级烷基酯进行氰基引入反应得到的粗（R）-4-氰基-3-羟基丁酸低级烷基酯通过蒸馏 在10乇下存在沸点在50〜160℃范围内的溶剂。

公开(公告)号：US4690792A

公开(公告)日：1987-09-01

申请号：US861571

申请日：1986-05-09

Applicant: Hitoshi Matsuda ,  Tsuguo Okumura ,  Kazuharu Abe

Inventor： Hitoshi Matsuda ,  Tsuguo Okumura ,  Kazuharu Abe

IPC: B29C55/02 ,  B29C55/14 ,  B29K7/00 ,  B29K55/00 ,  B29K77/00 ,  B29L9/00 ,  B32B27/28 ,  B29C55/26

CPC classification number: B29C55/143 ,  B29C55/023 ,  Y10S264/73 ,  Y10T428/3175

Abstract: A biaxially drawn laminated films having a good oxygen barrier property, a good mechanical strength and high thickness uniformity are made by a process comprising:a first step of forming a substantially amorphous unoriented laminated film comprising a saponified ethylene/vinyl acetate copolymer having an ethylene content of 25 to 45 mole % and a polyamide, and drawing the film in the longitudinal direction at a deformation rate of at least 10,000%/min and a draw ratio of 2.7 to 3.5 at 45.degree. to 65.degree. C. by using a roll drawing machine;a second step of transferring the film drawn at the first step to the transverse drawing-initiating point of a tenter type transverse drawing machine, expanding the width of the film at an angle of not larger than 6.degree. with respect to the central line of the film at least until the mechanically set ratio of the tenter clip distance to the original distance becomes at least 1.4 while maintaining the temperature of the tenter clips at a level lower than the temperature of the film and drawing the film in the transverse direction at an average deformation rate of 2,000 to 10,000%/min and a draw ratio of 3 to 5 under temperature conditions such that, from the transverse drawing-initiating point, the temperature of the film is elevated stepwise so that the temperature of the film is from 70.degree. to 100.degree. C. at the point of termination of the transverse drawing; anda third step of heat-treating the film drawn at the second step at a temperature form 110.degree. C. to the temperature lower by 10.degree. C. than the melting point of the starting polyamide.

Abstract translation: 具有良好的阻氧性，良好的机械强度和高的厚度均匀性的双轴向拉伸的叠层膜是通过以下方法制备的：第一步骤，形成基本上无定形的未取向的层压膜，其包含乙烯含量为乙烯/ 25〜45摩尔％的聚酰胺和聚酰胺，以45℃〜65℃的变形速度，以45℃〜65℃的拉伸倍率，纵向拉伸薄膜， 机; 将在第一步骤中拉伸的薄膜转印到拉幅机横向拉伸机的横向拉伸起始点的第二步骤，使薄膜的宽度相对于中心线以不大于6°的角度 薄膜至少直到拉幅机夹距离与原始距离的机械设定比例变得至少为1.4，同时将拉幅机夹的温度保持在低于薄膜温度的水平，并将薄膜沿横向拉平 变形率为2000〜10000％/ min，拉伸倍率为3〜5，在横向拉伸起始点，膜的温度逐步升高，膜的温度为70℃ 在横向拉伸终点时为100℃; 以及第三步，在110℃的温度下将在第二步骤中拉伸的薄膜热处理至比原始聚酰胺的熔点低10℃的温度。

公开(公告)号：US20120321798A1

公开(公告)日：2012-12-20

申请号：US13589793

申请日：2012-08-20

Applicant: Shinji Yae ,  Tatsuya Hirano ,  Hitoshi Matsuda

Inventor： Shinji Yae ,  Tatsuya Hirano ,  Hitoshi Matsuda

IPC: C23C18/54

CPC classification number: G11B5/858 ,  B82Y30/00 ,  C23C18/1619 ,  C23C18/1879 ,  C23C18/54 ,  G11B5/65 ,  Y10T428/12014 ,  Y10T428/12028 ,  Y10T428/24273 ,  Y10T428/249954 ,  Y10T428/24999

Abstract: Proposed are a composite material, wherein non-penetrating pores that are formed in a silicon surface layer are filled up with a metal or the like without leaving any voids by using the plating technique, and a method of producing the composite material. A composite material, which has been packed at a high accuracy, or in other words, in which little voids are left, can be obtained by filling up non-penetrating pores that are formed from a silicon surface (100) substantially with a second metal or an alloy of the second metal (106) with the use of the autocatalytic electroless plating technique wherein a first metal located at the bottom of the non-penetrating pores as described above serves as the starting point.

Abstract translation: 提出了一种复合材料，其中形成在硅表面层中的非穿透孔被金属等填充，而不会通过使用电镀技术而留下任何空隙，以及制造复合材料的方法。 通过填充由基本上具有第二金属的硅表面（100）形成的非穿透孔，可以获得以高精度包装的换句话说，其中留下很少空隙的复合材料 或第二金属（106）的合金与使用如上所述的非穿透孔底部的第一金属作为起始点的自催化化学镀技术。

公开(公告)号：US20110123813A1

公开(公告)日：2011-05-26

申请号：US12991902

申请日：2009-03-02

Applicant: Shinji Yae ,  Tatsuya Hirano ,  Hitoshi Matsuda

Inventor： Shinji Yae ,  Tatsuya Hirano ,  Hitoshi Matsuda

IPC: B32B15/04 ,  B05D1/18 ,  B05C3/02

CPC classification number: H01L21/02697 ,  C23C18/1651 ,  C23C18/1658 ,  C23C18/44 ,  C23C18/54 ,  Y10S977/721 ,  Y10S977/779

Abstract: Disclosed is a composite material wherein adhesion between a silicon surface and a plating material is enhanced. A method and an apparatus for producing the composite material are also disclosed. The method for producing a composite material comprises a dispersion/allocation step wherein the surface of a silicon substrate (102), which is a matrix provided with a silicon layer at least as the outermost layer, is immersed into a first solution containing gold (Au) ions, so that particulate or island-shaped gold (Au) serving as a first metal and substituted with a part of the silicon layer are dispersed/allocated on the matrix surface, and a plating step wherein the silicon substrate (102) is immersed into a second solution (24), which contains a reducing agent to which gold (Au) exhibits catalyst activity and metal ions which can be reduced by the reducing agent, so that the surface of the silicon substrate (102) is covered with the metal or an alloy of the metal (108) which is formed by autocatalytic electroless plating using gold (Au) as a starting point.

Abstract translation: 公开了一种复合材料，其中硅表面和电镀材料之间的粘附性增强。 还公开了一种用于生产复合材料的方法和装置。 复合材料的制造方法包括：分散/分配步骤，其中将作为至少具有最外层的硅层的基体的硅基板（102）的表面浸入含有金（Au ）离子，使得用作第一金属并被硅层的一部分取代的颗粒状或岛状金（Au）分散/分配在基体表面上，以及电镀步骤，其中硅基板（102）浸没 进入第二溶液（24），其含有金（Au）表现出催化剂活性的还原剂和可被还原剂还原的金属离子，使得硅衬底（102）的表面被金属覆盖 或通过使用金（Au）作为起点的自催化无电镀形成的金属（108）的合金。

公开(公告)号：US20110117373A1

公开(公告)日：2011-05-19

申请号：US12921348

申请日：2009-03-02

Applicant: Shinji Yae ,  Tatsuya Hirano ,  Hitoshi Matsuda

Inventor： Shinji Yae ,  Tatsuya Hirano ,  Hitoshi Matsuda

IPC: B32B15/04 ,  H01L21/306 ,  C23F1/00 ,  B05D3/10

CPC classification number: H01L21/288 ,  C23C18/1619 ,  C23C18/1644 ,  C23C18/1889 ,  C23C18/31 ,  C23C18/44 ,  C23C18/54 ,  Y10T428/249953 ,  Y10T428/249955 ,  Y10T428/249977 ,  Y10T428/249978 ,  Y10T428/249979 ,  Y10T428/249986 ,  Y10T428/249994

Abstract: Proposed are a composite material having a high adhesiveness, wherein non-penetrating pores that are formed in a silicone surface layer are filled up with a metal or the like without leaving any voids by using the plating technique and the silicone surface layer is coated with the metal or the like, and a method of producing the composite material. A composite material, which has a high adhesiveness between a second metal or an alloy of the second metal (106a, 106b) and a silicone surface, can be obtained by filling up non-penetrating pores that are formed in the surface of a silicone substrate (100) substantially with a second metal or an alloy of the second metal (106a) with the use of the autocatalytic electroless plating technique wherein a first metal located at the bottom of the non-penetrating pores as described above serves as the starting point, and coating the surface of the silicone substrate (100) with the second metal (106b).

Abstract translation: 提出具有高粘合性的复合材料，其中形成在硅氧烷表面层中的非穿透孔用金属等填充，而不会通过使用电镀技术留下任何空隙，并且硅氧烷表面层涂覆有 金属等，以及复合材料的制造方法。 通过填充在硅树脂基材的表面上形成的非穿透孔，可以获得在第二金属或第二金属（106a，106b）的合金与硅酮表面之间具有高粘附性的复合材料 （100）基本上具有第二金属或第二金属（106a）的合金，使用自催化无电镀技术，其中位于如上所述的非穿透孔底部的第一金属作为起点， 以及用所述第二金属（106b）涂覆所述硅树脂基底（100）的表面。

公开(公告)号：US5574172A

公开(公告)日：1996-11-12

申请号：US250787

申请日：1994-05-26

Applicant: Yoshio Katsuro ,  Hitoshi Matsuda

Inventor： Yoshio Katsuro ,  Hitoshi Matsuda

IPC: C07B61/00 ,  B01J29/04 ,  C07C51/363 ,  C07D307/89 ,  C07B39/00

CPC classification number: B01J29/04 ,  C07D307/89

Abstract: The disclosure describes a process for producing halogenated phthalic anhydride, which comprises reacting phthalic anhydride with a molecular halogen in vapor phase in the presence of a catalyst containing zeolite as active component.

Abstract translation: 本公开描述了一种制备卤代邻苯二甲酸酐的方法，其包括在含有沸石作为活性组分的催化剂的存在下，使气相中的邻苯二甲酸酐与分子卤素反应。