摘要:
A method of forming a through-silicon-via (TSV) opening includes forming a TSV opening through a substrate. A recast of a material of the substrate on sidewalls of the TSV opening is removed with a first chemical. The sidewalls of the TSV opening are cleaned with a second chemical by substantially removing a residue of the first chemical.
摘要:
An embodiment of the disclosure includes a method of fabricating a plurality of light emitting diode devices. A plurality of LED dies is provided. The LED dies are bonded to a carrier substrate. A patterned mask layer comprising a plurality of openings is formed on the carrier substrate. Each one of the plurality of LED dies is exposed through one of the plurality of the openings respectively. Each of the plurality of openings is filled with a phosphor. The phosphor is cured. The phosphor and the patterned mask layer are polished to thin the phosphor covering each of the plurality of LED dies. The patterned mask layer is removed after polishing the phosphor.
摘要:
A motor stator includes a stator unit and at least one auxiliary unit. The stator unit includes a circuit substrate, and a plurality of spaced-apart induction coils embedded within the circuit substrate. The auxiliary unit includes an auxiliary coil attached to and disposed outwardly of the circuit substrate.
摘要:
A motor stator includes a stator unit and an auxiliary induction unit. The stator unit includes a circuit substrate, and a plurality of induction coils embedded within the circuit substrate. The auxiliary induction unit includes an insulating member, a magnetic conductor, and at least one coil winding assembly. The coil winding assembly includes a conductive rod and an auxiliary coil. The rod has an insert rod section extending through the magnetic conductor, the insulating member, and the circuit substrate, and a wound rod section permitting the auxiliary coil to be wound thereon, such that the auxiliary coil is disposed outwardly of the magnetic conductor. During assembly, the induction coil assembly is mounted to the magnetic conductor, and the insulating member is superposed on the circuit substrate. Subsequently, the rod is inserted through the insulating member and into the circuit substrate.
摘要:
A secure erase system for a solid state memory device is disclosed. A memory area provides a data block for storing data and a key block for storing at least one key. A translation unit maps a logical address to a physical address associated with the memory area. An encryption unit encrypts plaintext data to be written to the memory area with the associated key and decrypts the encrypted data to be read by a host with the associated key. The key associated with a logical erase group to be secure erased is deleted after receiving a command requesting to erase the data associated with the logical erase group.
摘要:
A system for screening a small molecule library with 250,000 molecules to find out a compound of an anti-hypertensive drug aiming at human Angiotensin II type IA receptor is provided. The system includes a first database having a three-dimensional structure datum of a human Angiotensin II type IA receptor, a second database having molecular data of a plurality of small molecules, and a computer acquiring the three-dimensional structure datum and the molecular data from the first database and the second database respectively, wherein the computer has a molecular docking software for calculating a free energy of the human Angiotensin II type IA receptor bound to each of the plurality of small molecules, ranks the plurality of small molecules according to the respective free energy so as to select a top small molecule in the ranking as the compound of the drug.
摘要:
A fan device includes: a fan housing configured with a receiving space defined among opposite top and bottom walls, and a surrounding side wall; and a fan impeller mounted in the receiving space, disposed adjacent to an air outlet in the top wall and operable to rotate about a central axis transverse to the top and bottom walls of the fan housing. The fan impeller includes a hub body disposed coaxially with the central axis, and a plurality of angularly spaced apart fan blades extending outwardly and radially from the hub body. An angular distance between each adjacent pair of the fan blades is different from that of any other adjacent pair of the fan blades.
摘要:
A fan device includes: a fan housing configured with a receiving space defined among opposite top and bottom walls, and a surrounding side wall; a fan impeller mounted in the receiving space, disposed adjacent to an air outlet in the top wall and operable to rotate about a central axis transverse to the top and bottom walls of the fan housing; and an air-guiding unit mounted fixedly in the receiving space and disposed adjacent to an air inlet in the bottom wall. The air-guiding unit includes a central connecting member disposed axially with the central axis, and a plurality of angularly spaced apart air-guiding blades interconnecting the central connecting member and the surrounding sidewall. An angular distance between each adjacent pair of the air-guiding blades is different from that of any other adjacent pair of the air-guiding blades.
摘要:
An apparatus includes a process chamber configured to perform an ion implantation process. A cooling platen or electrostatic chuck is provided within the process chamber. The cooling platen or electrostatic chuck is configured to support a semiconductor wafer. The cooling platen or electrostatic chuck has a plurality of temperature zones. Each temperature zone includes at least one fluid conduit within or adjacent to the cooling platen or electrostatic chuck. At least two coolant sources are provided, each fluidly coupled to a respective one of the fluid conduits and configured to supply a respectively different coolant to a respective one of the plurality of temperature zones during the ion implantation process. The coolant sources include respectively different chilling or refrigeration units.
摘要:
A method for treating waste gas containing acid and/or base, employing fine spray-scrubbing technology for treating the waste gas mentioned above, wherein the scrubbing solution is atomized to generate mists with droplet size of 1 to 100 μm. Another feature of the present invention is to combine the application of surfactant in wet scrubbing technology for treating waste gas containing acids, bases, or both, especially, in a low concentration. Another feature of the present invention is to combine spray tower and/or packed tower and/or other scrubbers vertically/horizontally to get enhanced performance of the conventional control systems.