公开(公告)号：US08778215B2

公开(公告)日：2014-07-15

申请号：US13463792

申请日：2012-05-03

申请人： Shih-Chun Tseng ,  Wen-Hsuan Chao ,  Hsu-Shen Chu

发明人： Shih-Chun Tseng ,  Wen-Hsuan Chao ,  Hsu-Shen Chu

IPC分类号： H01L35/22

CPC分类号： H01L35/16 ,  H01L35/26

摘要： An embodiment of the present disclosure provides a thermoelectric composite material including: a thermoelectric matrix including a thermoelectric material; and a plurality of nano-carbon material units located in the thermoelectric matrix and spaced apart from each other, wherein a spacing between two neighboring nano-carbon material unit is about 50 nm to 2 μm.

摘要翻译： 本公开的实施方案提供了一种热电复合材料，其包括：包含热电材料的热电基体; 以及位于热电基体中并彼此间隔开的多个纳米碳材料单元，其中两个相邻的纳米碳材料单元之间的间隔为约50nm至2μm。

公开(公告)号：US20130153819A1

公开(公告)日：2013-06-20

申请号：US13463792

申请日：2012-05-03

申请人： Shih-Chun Tseng ,  Wen-Hsuan Chao ,  Hsu-Shen Chu

发明人： Shih-Chun Tseng ,  Wen-Hsuan Chao ,  Hsu-Shen Chu

IPC分类号： C09K5/00 ,  B82Y30/00

CPC分类号： H01L35/16 ,  H01L35/26

摘要： An embodiment of the present disclosure provides a thermoelectric composite material including: a thermoelectric matrix including a thermoelectric material; and a plurality of nano-carbon material units located in the thermoelectric matrix and spaced apart from each other, wherein a spacing between two neighboring nano-carbon material unit is about 50 nm to 2 μm.

摘要翻译： 本公开的实施方案提供了一种热电复合材料，其包括：包含热电材料的热电基体; 以及多个纳米碳材料单元，其位于热电基体中并彼此间隔开，其中两个相邻的纳米碳材料单元之间的间隔为约50nm至2μm。

公开(公告)号：US20120132242A1

公开(公告)日：2012-05-31

申请号：US12980954

申请日：2010-12-29

申请人： Hsu-Shen Chu ,  Jenn-Dong Hwang

发明人： Hsu-Shen Chu ,  Jenn-Dong Hwang

IPC分类号： H01L35/30

CPC分类号： H01L35/30

摘要： A thermoelectric generator apparatus disposed on a high-temperature surface of an object (as a heat source), at least includes a heat concentrator, a thermoelectric module and a cold-side heat sink. The heat concentrator has a top surface and a bottom surface contacting a high-temperature surface of the object, and an area of the bottom surface is smaller than that of the high-temperature surface. The thermoelectric module is disposed on the top surface of the heat concentrator. The cold-side heat sink is disposed on the thermoelectric module. Heat generated by the heat source is concentrated on the heat concentrator and flows to the hot side of the thermoelectric module for increasing the heat flux (Q′) passing the thermoelectric module and the hot side temperature of the thermoelectric module. Consequently, the thermoelectric conversion efficiency (η) is improved, and the power generation of the thermoelectric module is increased.

摘要翻译： 设置在物体（作为热源）的高温表面上的热电发电装置至少包括集热器，热电模块和冷侧散热器。 集热器具有接触物体的高温表面的顶表面和底表面，并且底表面的面积小于高温表面的面积。 热电模块设置在集热器的顶表面上。 冷侧散热器设置在热电模块上。 由热源产生的热量集中在集热器上并流到热电模块的热侧，以增加通过热电模块的热通量（Q'）和热电模块的热侧温度。 因此，提高了热电转换效率（＆eegr），并且增加了热电模块的发电。

公开(公告)号：US07777126B2

公开(公告)日：2010-08-17

申请号：US12185188

申请日：2008-08-04

申请人： Hsu-Shen Chu

发明人： Hsu-Shen Chu

IPC分类号： H01L35/28

CPC分类号： H01L35/32

摘要： A thermoelectric device at least includes a ring-shaped insulated substrate and plural sets of thermoelectric thin film material pair (TEP) disposed thereon. The ring-shaped insulated substrate has an inner rim, an outer rim and a first surface. The sets of TEP electrically connected to each other are disposed on the first surface of the ring-shaped insulated substrate. Each set of TEP includes a P-type and an N-type thermoelectric thin film elements (TEE) electrically connected to each other. Also, the N-type TEE of each set is electrically connected to the P-type TEE of the adjacent set of TEP. When a current flows through the sets of TEP along a direction parallel to the surfaces of P-type and N-type thermoelectric thin film elements, a temperature difference is generated between the inner rim and the outer rim of the ring-shaped insulated substrate.

摘要翻译： 热电装置至少包括环形绝缘基板和设置在其上的多组热电薄膜材料对（TEP）。 环形绝缘基板具有内缘，外缘和第一表面。 彼此电连接的TEP组被布置在环形绝缘基板的第一表面上。 每组TEP包括彼此电连接的P型和N型热电薄膜元件（TEE）。 此外，每组的N型TEE电连接到相邻TEP组的P型TEE。 当电流沿着与P型和N型热电薄膜元件的表面平行的方向流过TEP组时，在环形绝缘基板的内缘和外缘之间产生温度差。

公开(公告)号：US20090165835A1

公开(公告)日：2009-07-02

申请号：US12185188

申请日：2008-08-04

申请人： Hsu-Shen CHU

发明人： Hsu-Shen CHU

IPC分类号： H01L35/32

CPC分类号： H01L35/32

摘要： A thermoelectric device at least includes a ring-shaped insulative substrate and plural sets of thermoelectric thin film material pair (TEP) disposed thereon. The ring-shaped insulative substrate has an inner rim, an outer rim and a first surface. The sets of TEP electrically connected to each other are disposed on the first surface of the ring-shaped insulative substrate. Each set of TEP includes a P-type and an N-type thermoelectric thin film elements (TEE) electrically connected to each other. Also, the N-type TEE of each set is electrically connected to the P-type TEE of the adjacent set of TER When a current flows through the sets of TEP along a direction parallel to the surfaces of P-type and N-type thermoelectric thin film elements, a temperature difference is generated between the inner rim and the outer rim of the ring-shaped insulative substrate.

摘要翻译： 热电装置至少包括环形绝缘基板和设置在其上的多组热电薄膜材料对（TEP）。 环形绝缘基板具有内缘，外缘和第一表面。 彼此电连接的TEP组被布置在环形绝缘衬底的第一表面上。 每组TEP包括彼此电连接的P型和N型热电薄膜元件（TEE）。 此外，每组的N型TEE电连接到相邻TER组的P型TEE当电流沿着平行于P型和N型热电的表面的方向流过TEP组时 在环状绝缘基板的内缘和外缘之间产生温度差。

公开(公告)号：US20120167937A1

公开(公告)日：2012-07-05

申请号：US13195299

申请日：2011-08-01

申请人： Yuan-Chang Fann ,  Chun-Mu Chen ,  Hsu-Shen Chu ,  Cheng-Chuan Wang ,  Jenn-Dong Hwang

发明人： Yuan-Chang Fann ,  Chun-Mu Chen ,  Hsu-Shen Chu ,  Cheng-Chuan Wang ,  Jenn-Dong Hwang

IPC分类号： H01L35/30 ,  H01L35/34 ,  H01L35/04

CPC分类号： H01L35/08 ,  Y10T29/49213 ,  Y10T29/49222

摘要： A thermoelectric module includes a first and a second substrates, plural thermoelectric elements, plural first and second metal electrodes, plural first and second solder layers, and spacers. The thermoelectric elements are disposed between the first and second substrates, and each pair includes a P-type and an N-type thermoelectric elements. An N-type thermoelectric element is electrically connected to the other P-type thermoelectric element of the adjacent pair of thermoelectric element by the second metal electrode. The first metal electrodes and the lower end surfaces of the P/N type thermoelectric elements are jointed by the first solder layers. The second metal electrodes and the upper end surfaces of the P/N type thermoelectric elements are jointed by the second solder layers. The spacers are positioned at one of the first and second solder layers. The melting point of the spacer is higher than the liquidus temperatures of the first and second solder layers.

摘要翻译： 热电模块包括第一和第二基板，多个热电元件，多个第一和第二金属电极，多个第一和第二焊料层以及间隔件。 热电元件设置在第一和第二基板之间，并且每对包括P型和N型热电元件。 N型热电元件通过第二金属电极与相邻的一对热电元件​​的另一P型热电元件电连接。 P / N型热电元件的第一金属电极和下端面通过第一焊料层接合。 第二金属电极和P / N型热电元件的上端面通过第二焊料层接合。 间隔物位于第一和第二焊料层中的一个处。 间隔物的熔点高于第一和第二焊料层的液相线温度。

公开(公告)号：US20090277490A1

公开(公告)日：2009-11-12

申请号：US12206575

申请日：2008-09-08

申请人： Hsu-Shen Chu

发明人： Hsu-Shen Chu

IPC分类号： H01L35/02 ,  C23C14/00

CPC分类号： H01L35/32

摘要： A thermoelectric module device with thin film elements is disclosed. A pillar structure with a hollow region is formed by stacking a plurality of thin-film type thermoelectric module elements, each including a plurality thin-film thermoelectric pairs arranged in a ring. An insulating and thermal conducting layer covers the inner sidewalls of the hollow region of the pillar structure and the outer sidewalls of the pillar structure. A cool source and a heat source are disposed in the hollow region or outer side of the pillar structure, respectively.

摘要翻译： 公开了一种具有薄膜元件的热电模块装置。 具有中空区域的柱结构通过堆叠多个薄膜型热电模块元件形成，每个薄膜型热电模块元件包括以环形布置的多个薄膜热电对。 绝缘导热层覆盖柱结构的中空区域的内侧壁和柱结构的外侧壁。 冷源和热源分别设置在柱结构的中空区域或外侧。

公开(公告)号：US08269098B2

公开(公告)日：2012-09-18

申请号：US12206575

申请日：2008-09-08

申请人： Hsu-Shen Chu

发明人： Hsu-Shen Chu

IPC分类号： H01L35/28 ,  H01L35/02

CPC分类号： H01L35/32

摘要： A thermoelectric module device with thin film elements is disclosed. A pillar structure with a hollow region is formed by stacking a plurality of thin-film type thermoelectric module elements, each including a plurality thin-film thermoelectric pairs arranged in a ring. An insulating and thermal conducting layer covers the inner sidewalls of the hollow region of the pillar structure and the outer sidewalls of the pillar structure. A cool source and a heat source are disposed in the hollow region or outer side of the pillar structure, respectively.

摘要翻译： 公开了一种具有薄膜元件的热电模块装置。 具有中空区域的柱结构通过堆叠多个薄膜型热电模块元件形成，每个薄膜型热电模块元件包括以环形布置的多个薄膜热电对。 绝缘导热层覆盖柱结构的中空区域的内侧壁和柱结构的外侧壁。 冷源和热源分别设置在柱结构的中空区域或外侧。

公开(公告)号：US20130152990A1

公开(公告)日：2013-06-20

申请号：US13668306

申请日：2012-11-04

申请人： Hong-Jen Lai ,  Jenn-Dong Hwang ,  Hsu-Shen Chu ,  Tung-Han Chuang ,  Chao-Chi Jain ,  Che-Wei Lin

发明人： Hong-Jen Lai ,  Jenn-Dong Hwang ,  Hsu-Shen Chu ,  Tung-Han Chuang ,  Chao-Chi Jain ,  Che-Wei Lin

IPC分类号： H01L35/08 ,  H01L35/34 ,  H01L35/18 ,  B23K31/02 ,  H01L35/16

CPC分类号： H01L35/08 ,  B23K20/026 ,  B23K20/16 ,  B23K20/233 ,  B23K20/24 ,  B23K35/00 ,  B23K35/004 ,  B23K35/007 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3033 ,  B23K2101/36 ,  B23K2103/08 ,  B23K2103/12 ,  B23K2103/18 ,  B32B15/01 ,  H01L35/16 ,  H01L35/34

摘要： A solid-liquid interdiffusion bonding structure of a thermoelectric module and a fabricating method thereof are provided. The method includes coating a silver, nickel, or copper layer on surfaces of a thermoelectric component and an electrode plate, and then coating a tin layer. A thermocompression treatment is performed on the thermoelectric component and the electrode plate, such that the melted tin layer reacts with the silver, nickel, or copper layer to form a silver-tin intermetallic compound, a nickel-tin intermetallic compound, or a copper-tin intermetallic compound. After cooling, the thermoelectric component and the electrode plate are bonded together.

摘要翻译： 提供了一种热电模块的固液相互扩散接合结构及其制造方法。 该方法包括在热电元件和电极板的表面上涂覆银，镍或铜层，然后涂覆锡层。 对热电组件和电极板进行热压处理，使得熔融的锡层与银，镍或铜层反应形成银 - 锡金属间化合物，镍 - 锡金属间化合物或铜 - 锡金属间化合物。 冷却后，将热电成分和电极板接合。