Abstract:
A self-timed sense amplifier read buffer pulls down a pre-charged high global bit line, which then feeds data into a tri state write back buffer that is connected directly to the bit line. The bit line provides charge to a ferroelectric capacitor to write a logical “one” or “zero” while by-passing an isolator switch disposed between the sense amplifier and the ferroelectric capacitor. Because the sense amplifier uses grounded bit line sensing, the read buffer will not start pulling down the global bit line until after the sense amplifier signal amplification, which makes the timing of the control signal for this read buffer non-critical. The write-back buffer enable timing is also self-timed off of the sense amplifier. Therefore, the read data write-back to a ferroelectric memory cell is locally controlled and begins quickly after reading data from the ferroelectric memory cell, thereby allowing a quick cycle time.
Abstract:
A memory cell for storing a charge that gives rise to a cell voltage representing a bit value, the memory cell being capable of having the cell voltage boosted to a boost value at a time following reading of the stored charge. The memory cell includes a first capacitor connected between a first node and ground. A second capacitor is connected between a second node and ground, and a first switch is connected between the first node and the second node. A second switch and a third capacitor are connected in series between the first node and the second node, with a terminal of the second switch being connected to the first node, the common connection node of the second switch and the third capacitor comprising a third node. A third switch is connected between the third node and ground. In operation, in a first storage phase the first and third switches are closed and the second switch is open. In a second storage phase the first and third switches are open and the second switch is closed, resulting in the cell voltage being boosted to the boost value.
Abstract:
Methods and ferroelectric devices are presented, in which pulses are selectively applied to ferroelectric memory cell wordlines to discharge cell storage node disturbances while the cell plateline and the associated bitline are held at substantially the same voltage.
Abstract:
A ferroelectric memory device includes a shunt switch configured to short both sides of the ferroelectric capacitor of the ferroelectric memory device. The shunt switch is configured therefore to remove excess charge from around the ferroelectric capacitor prior to or after reading data from the ferroelectric capacitor. By one approach, the shunt switch is connected to operate in reaction to signals from the same line that controls accessing the ferroelectric capacitor. So configured, the high performance cycle time of the ferroelectric memory device is reduced by eliminating delays used to otherwise drain excess charge from around the ferroelectric capacitor, for example by applying a precharge voltage. The shunt switch also improves reliability of the ferroelectric memory device by ensuring that excess charge does not affect the reading of the ferroelectric capacitor during a read cycle.
Abstract:
A ferroelectric memory device includes a shunt switch configured to short both sides of the ferroelectric capacitor of the ferroelectric memory device. The shunt switch is configured therefore to remove excess charge from around the ferroelectric capacitor prior to or after reading data from the ferroelectric capacitor. By one approach, the shunt switch is connected to operate in reaction to signals from the same line that controls accessing the ferroelectric capacitor. So configured, the high performance cycle time of the ferroelectric memory device is reduced by eliminating delays used to otherwise drain excess charge from around the ferroelectric capacitor, for example by applying a precharge voltage. The shunt switch also improves reliability of the ferroelectric memory device by ensuring that excess charge does not affect the reading of the ferroelectric capacitor during a read cycle.
Abstract:
A scheme for dealing with or handling faulty ‘grains’ or portions of a nonvolatile ferroelectric memory array is disclosed. In one example, a grain of the memory is less than a column high and less than a row wide. A replacement operation is performed on the memory portion when a repair programming group finds that an address of the portion corresponds to a failed row address and a failed column address.
Abstract:
Methods (200) and systems (108) are provided for reading data from ferroelectric memory cells (106) in which charge is removed from a sense amp input (SABL/SABLB) prior to application of a plateline signal (PL) to the target cell capacitor (CFE). Where the sense amp input (SABL/SABLB) is initially precharged to zero volts, the extraction of charge provides a negative voltage on the data bitline (BL/BLB) when the plateline signal (PL) is applied, allowing adequate voltage to be applied across the cell capacitor (CFE) together with reduced plateline voltages (PL).
Abstract:
A memory circuit and method for reducing gate oxide stress is disclosed. A first data word is stored at a first address in a nonvolatile memory circuit 604. The first address 820 and the first data word 842 are stored in a volatile memory circuit 602. A first external address 608 is applied to the volatile memory circuit. The first external address is compared to the first address. The first data word is produced from the volatile memory circuit on a data bus 610 when the first external address matches the first address. The first data word is produced from the nonvolatile memory circuit on the data bus when the first external address does not match the first address.
Abstract:
In a dynamic random access memory, the sense amplifiers associated with the storage cells have the direct sense circuitry (MNEW, MNWE.sub.--, MNRD, MNRD.sub.--) included therewith to minimize the effects of parasitic impedance. In addition, the Y-select circuits (MNYS, MNYS.sub.--) are combined with the read/write enable circuits (MNWE, MNWE.sub.--, MNRD, MNRD.sub.--) to eliminate a transistor pair, thereby reducing the required layout area. By locating the Y-select (MNYS, MNYS.sub.--) circuits between the sense amplifier MNWE, MNWE.sub.--, MNRD, MNRD.sub.--) and the local input/output lines (LIO, LIO.sub.--), the WRITE-ENABLE and the READ-ENABLE signals can be combined in a single signal.
Abstract:
An FRAM device can comprise a sense amplifier, at least a first bitcell, a first control line, and a second control line. The first bitcell can have a bit line that connects to the sense amplifier via a first isolator and a complimentary bit line that connects to the sense amplifier via a second isolator that is different from the first isolator. The first control line can connect to and control the aforementioned first isolator. And the second control line can connect to and control the second isolator such that the second isolator is independently controlled with respect to the first isolator to facilitate testing the device.