Abstract:
One aspect of the invention relates to a method for accessing a memory device. One embodiment relates to a method for accessing a memory device. In the method during a read operation, one data value is provided on a local IO line while complimentary local IO line that is associated with the local IO line is inactivated. During a write operation, another data value is provided on the local IO line and a complimentary data value is provided on the complimentary local IO line. Other systems and methods are also disclosed.
Abstract:
An FeRAM memory array wherein the plate lines run in the direction of word lines is described that provides a reduced plate line resistance in arrays having a common plate line connection. The lower plate line resistance reduces the magnitude of negative spikes on the plate line to reduce the potential for FeCap depolarization. Two or more plate lines of a plurality of columns of memory cells are interconnected along a bit line direction. Some or all of the plate lines of one or more columns of dummy memory cells may also be interconnected to reduce the plate line resistance and minimize any increase in the bit line capacitance for the active cells of the array. The improved FeRAM array provides a reduced data error rate, particularly at fast memory cycle times.
Abstract:
An FeRAM memory array wherein the plate lines run in the direction of word lines is described that provides a reduced plate line resistance in arrays having a common plate line connection. The lower plate line resistance reduces the magnitude of negative spikes on the plate line to reduce the potential for FeCap depolarization. Two or more plate lines of a plurality of columns of memory cells are interconnected along a bit line direction. Some or all of the plate lines of one or more columns of dummy memory cells may also be interconnected to reduce the plate line resistance and minimize any increase in the bit line capacitance for the active cells of the array. The improved FeRAM array provides a reduced data error rate, particularly at fast memory cycle times.
Abstract:
Methods and ferroelectric devices are presented, in which pulses are selectively applied to ferroelectric memory cell wordlines to discharge cell storage node disturbances while the cell plateline and the associated bitline are held at substantially the same voltage.
Abstract:
A supply-voltage detecting stage (11) that supplies first and second reference currents (I.sub.REFP and I.sub.REFN) which vary with the supply voltage (V.sub.cc) and are coupled by first and second gain stages (12A and 12B), respectively, to first and second temperature-detecting stages (13A and 13B), respectively. First and second temperature-detecting stages (13A and 13B) increase the coupled reference currents (I.sub.REFP and I.sub.REFN), respectively, to compensate for temperature increase through use temperature-sensitive, long-channel transistors (M34-M37 and M42-M45), supplying temperature and supply-voltage compensated output bias voltages at output terminals (MIRN and MIRP).
Abstract:
A method for erasing blocks of a non-volatile memory includes detecting whether a block is in at least one of an erased state or a state secured from erasure; then setting a flag register at a first level for each block detected to be in at least one of an erased state or a state secured from erasure or at a second level for each block not so detected; then selecting for erasure blocks that have their respective flags set at the second level; and then erasing the selected blocks.
Abstract:
The power-on-reset test circuit of this invention includes two imbalanced latches to detect the occurrence of a transient power-on-reset signal. The occurrence of a transient power-on-reset signal is latched for later verification during circuit testing. Both latches are designed to default to a low voltage output (Vss) on initial power-up. One of the latches is set by the power-on-reset signal to a high-voltage output (Vcc) state. The other latch is set by a reference-potential input to a low-voltage output state. If the set latch has a high-voltage output and the other latch has a low-voltage output, then the power-on-reset circuitry is functioning properly.
Abstract:
The CMOS high-voltage sensor circuit has a voltage reference including, for example, of four N-channel MOS transistors; one pass-gate P-channel transistor; one current-mirror P-channel MOS transistor; and a conventional high-voltage sensor including, for example, of two P-channel MOS transistors and one N-channel MOS transistor. The sensor circuit of this invention generates a high-voltage signal at the output if the input voltage is greater than both the reference voltage plus two P-channel threshold voltages and the supply voltage Vcc plus two P-channel threshold voltages. The power-up or power-down sequence may be in any order without adversely affecting the operation of the circuit of this invention.
Abstract:
An electrically-erasable, electrically-programmable read-only memory cell 10 is formed at a face of a layer of semiconductor 30 of a first conductivity type. A first source/drain region 16 and a second source/drain region 20 are formed in the face of layer of semiconductor 30 of a second conductivity type opposite the first conductivity type and spaced by a first channel area 50. A third source/drain region 18 is formed in the face of semiconductor layer 30 of the second conductivity type spaced from second source/drain region 20 by a second channel area 52. A thick insulator region 44 is formed adjacent at least a portion of second source/drain region 20 and includes a lateral margin of sloped thickness overlying a corresponding lateral margin of second source/drain region 20. The corresponding lateral margin of second source/drain region 20 has a graded dopant concentration directly proportionate with the sloped thickness of the overlying lateral margin of thick insulator region 44. A differentially grown insulator region 54 overlies second source/drain region 20 and includes a lateral margin of sloped thickness. A thin insulator tunneling window 62 overlies an area 60 of second source/drain region 20, tunneling window 62 formed between and spacing the lateral margin of the thick insulator region 44 and the lateral margin of differentially grown insulator region 54. A floating gate conductor 26 is disposed adjacent tunneling window 62 and insulatively adjacent second channel area 52. A control gate conductor 28 is disposed insulatively adjacent floating gate conductor 28. A gate conductor 24 is disposed insulatively adjacent first channel area 50.
Abstract:
An electrically-erasable, electrically-programmable ROM or an EEPROM is constructed using an enhancement transistor merged with a floating-gate transistor, where the floating-gate transistor has a small self-aligned tunnel window positioned on the opposite side of the source from the channel and drain, in a contact-free cell layout, enhancing the ease of manufacture and reducing cell size. In this cell, the bitlines and source/drain regions are buried beneath relatively thick silicon oxide, which allows a favorable ratio of control gate to floating gate capacitance. Programming and erasing are provided by the tunnel window area on the outside of the source (spaced from the channel). The tunnel window has a thinner dielectric than the remainder of the floating gate to allow Fowler-Nordheim tunneling.