公开(公告)号：US20050001570A1

公开(公告)日：2005-01-06

申请号：US10884750

申请日：2004-07-02

Applicant: Joung-Joo Lee ,  Ssi-Chol Choi

Inventor： Joung-Joo Lee ,  Ssi-Chol Choi

IPC: H02P6/16 ,  H02P5/06

CPC classification number: H02P6/16 ,  H02P6/28

Abstract: A motor driving circuit is described for three-phase brushless DC motors, which have a three-phase-coil and first and second Hall sensors to detect the magnetic field of a rotor. The motor driving circuit includes first and second comparators, comparing a first and second pair of Hall signals from the Hall sensors, and outputting a first and second Hall signals. An adder unit receives the first and second pair of Hall signals to output a third pair of Hall signals to a third comparator, which outputs a third Hall signal. A motor driver is controlled by the first, second, and third Hall signals of the first, second and third comparators to change directions of currents flowing through phases of the three-phase coil accordingly to rotate the rotor of the motor. The first and second Hall signals can be amplified to match the level of the third Hall signal, or vice versa.

公开(公告)号：US09905443B2

公开(公告)日：2018-02-27

申请号：US13598828

申请日：2012-08-30

Applicant: Anantha K. Subramani ,  Joseph M. Ranish ,  Xiaoxiong Yuan ,  Ashish Goel ,  Joung Joo Lee

Inventor： Anantha K. Subramani ,  Joseph M. Ranish ,  Xiaoxiong Yuan ,  Ashish Goel ,  Joung Joo Lee

IPC: C23C14/54 ,  C23C16/48 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67115 ,  C23C14/541 ,  C23C16/481 ,  H01L21/67248 ,  H01L21/68735 ,  H01L21/68742

Abstract: Apparatus for improving temperature uniformity across a substrate are provided herein. In some embodiments, a deposition ring for use in a substrate processing system to process a substrate may include an annular body having a first surface, an opposing second surface, and a central opening passing through the first and second surfaces, wherein the second surface is configured to be disposed over a substrate support having a support surface to support a substrate having a given width, and wherein the opening is sized to expose a predominant portion of the support surface; and wherein the first surface includes at least one reflective portion configured to reflect heat energy toward a central axis of the annular body, wherein the at least one reflective portion has a surface area that is about 5 to about 50 percent of a total surface area of the first surface.

公开(公告)号：US08841211B2

公开(公告)日：2014-09-23

申请号：US13153992

申请日：2011-06-06

Applicant: Joung Joo Lee ,  Xianmin Tang ,  Tza-Jing Gung

Inventor： Joung Joo Lee ,  Xianmin Tang ,  Tza-Jing Gung

IPC: H01L21/4763 ,  H01L21/285 ,  C23C14/34 ,  H01L21/768 ,  C23C14/04

CPC classification number: H01L21/2855 ,  C23C14/046 ,  C23C14/345 ,  C23C14/3492 ,  H01L21/76882

Abstract: Methods for forming interconnect structures are provided herein. In some embodiments, a method for forming an interconnect on a substrate may include depositing a material atop an upper surface of the substrate and atop one or more surfaces of a feature disposed in the substrate by a first deposition process that deposits the material at a faster rate on the upper surface than on a bottom surface of the feature; depositing the material atop the upper surface of the substrate and atop one or more surfaces of the feature by a second deposition process that deposits the material at a greater rate on the bottom surface of the feature than on the upper surface of the substrate; and heating the deposited material to draw the deposited material towards the bottom surface of the feature to at least partially fill the feature with the deposited material.

Abstract translation: 本文提供形成互连结构的方法。 在一些实施例中，用于在衬底上形成互连的方法可以包括在衬底的上表面顶部沉积材料，并且通过第一沉积工艺沉积位于衬底中的特征的一个或多个表面上，所述第一沉积工艺以更快的速度沉积材料 在上表面上比在特征的底表面上的速率; 通过第二沉积工艺将所述材料沉积在所述基底的上表面顶部和所述特征的一个或多个表面上方，所述第二沉积工艺在所述特征的底表面上以比在所述基底的上表面上更大的速率沉积材料; 以及加热沉积的材料以将沉积的材料拉向特征的底表面，以至少部分地用沉积的材料填充该特征。

公开(公告)号：US20120108058A1

公开(公告)日：2012-05-03

申请号：US13269243

申请日：2011-10-07

Applicant: TAE HONG HA ,  WINSOR LAM ,  TZA-JING GUNG ,  JOUNG JOO LEE

Inventor： TAE HONG HA ,  WINSOR LAM ,  TZA-JING GUNG ,  JOUNG JOO LEE

IPC: H01L21/768

CPC classification number: H01L21/76843 ,  C23C14/046 ,  C23C14/345 ,  H01L21/2855 ,  H01L21/76858 ,  H01L21/76865 ,  H01L21/76873

Abstract: Methods for forming layers on a substrate are provided herein. In some embodiments, methods of forming layers on a substrate disposed in a process chamber may include depositing a barrier layer comprising titanium within one or more features in the substrate; and sputtering a material from a target in the presence of a plasma formed from a process gas by applying a DC power to the target, maintaining a pressure of less than about 500 mTorr within the process chamber, and providing up to about 5000 W of a substrate bias RF power to deposit a seed layer comprising the material atop the barrier layer.

Abstract translation: 本文提供了在基板上形成层的方法。 在一些实施例中，在设置在处理室中的衬底上形成层的方法可以包括在衬底的一个或多个特征内沉积包含钛的阻挡层; 在通过向目标施加DC电力的情况下，在由处理气体形成的等离子体存在下溅射材料，在处理室内保持小于约500mTorr的压力，并提供高达约5000W的 衬底偏置射频功率以在阻挡层顶上沉积包含该材料的晶种层。

公开(公告)号：US20110306200A1

公开(公告)日：2011-12-15

申请号：US13153992

申请日：2011-06-06

Applicant: JOUNG JOO LEE ,  XIANMIN TANG ,  TZA-JING GUNG

Inventor： JOUNG JOO LEE ,  XIANMIN TANG ,  TZA-JING GUNG

IPC: H01L21/768

CPC classification number: H01L21/2855 ,  C23C14/046 ,  C23C14/345 ,  C23C14/3492 ,  H01L21/76882

Abstract: Methods for forming interconnect structures are provided herein. In some embodiments, a method for forming an interconnect on a substrate may include depositing a material atop an upper surface of the substrate and atop one or more surfaces of a feature disposed in the substrate by a first deposition process that deposits the material at a faster rate on the upper surface than on a bottom surface of the feature; depositing the material atop the upper surface of the substrate and atop one or more surfaces of the feature by a second deposition process that deposits the material at a greater rate on the bottom surface of the feature than on the upper surface of the substrate; and heating the deposited material to draw the deposited material towards the bottom surface of the feature to at least partially fill the feature with the deposited material.

Abstract translation: 本文提供形成互连结构的方法。 在一些实施例中，用于在衬底上形成互连的方法可以包括在衬底的上表面顶部沉积材料，并且通过第一沉积工艺沉积位于衬底中的特征的一个或多个表面上，所述第一沉积工艺以更快的速度沉积材料 在上表面上比在特征的底表面上的速率; 通过第二沉积工艺将所述材料沉积在所述基底的上表面顶部和所述特征的一个或多个表面上方，所述第二沉积工艺在所述特征的底表面上以比在所述基底的上表面上更大的速率沉积材料; 以及加热沉积的材料以将沉积的材料拉向特征的底表面，以至少部分地用沉积的材料填充该特征。

公开(公告)号：US08476162B2

公开(公告)日：2013-07-02

申请号：US13269243

申请日：2011-10-07

Applicant: Tae Hong Ha ,  Winsor Lam ,  Tza-Jing Gung ,  Joung Joo Lee

Inventor： Tae Hong Ha ,  Winsor Lam ,  Tza-Jing Gung ,  Joung Joo Lee

IPC: H01L21/44

CPC classification number: H01L21/76843 ,  C23C14/046 ,  C23C14/345 ,  H01L21/2855 ,  H01L21/76858 ,  H01L21/76865 ,  H01L21/76873

Abstract: Methods for forming layers on a substrate are provided herein. In some embodiments, methods of forming layers on a substrate disposed in a process chamber may include depositing a barrier layer comprising titanium within one or more features in the substrate; and sputtering a material from a target in the presence of a plasma formed from a process gas by applying a DC power to the target, maintaining a pressure of less than about 500 mTorr within the process chamber, and providing up to about 5000 W of a substrate bias RF power to deposit a seed layer comprising the material atop the barrier layer.

Abstract translation: 本文提供了在基板上形成层的方法。 在一些实施例中，在设置在处理室中的衬底上形成层的方法可以包括在衬底的一个或多个特征内沉积包含钛的阻挡层; 在通过向目标施加DC电力的情况下，在由处理气体形成的等离子体存在下溅射材料，在处理室内保持小于约500mTorr的压力，并提供高达约5000W的 衬底偏置射频功率以在阻挡层顶上沉积包含该材料的晶种层。

公开(公告)号：US20130055952A1

公开(公告)日：2013-03-07

申请号：US13598828

申请日：2012-08-30

Applicant: ANANTHA K. SUBRAMANI ,  JOSEPH M. RANISH ,  XIAOXIONG YUAN ,  ASHISH GOEL ,  JOUNG JOO LEE

Inventor： ANANTHA K. SUBRAMANI ,  JOSEPH M. RANISH ,  XIAOXIONG YUAN ,  ASHISH GOEL ,  JOUNG JOO LEE

IPC: H01L21/461 ,  B23Q3/00

CPC classification number: H01L21/67115 ,  C23C14/541 ,  C23C16/481 ,  H01L21/67248 ,  H01L21/68735 ,  H01L21/68742

Abstract: Apparatus for improving temperature uniformity across a substrate are provided herein. In some embodiments, a deposition ring for use in a substrate processing system to process a substrate may include an annular body having a first surface, an opposing second surface, and a central opening passing through the first and second surfaces, wherein the second surface is configured to be disposed over a substrate support having a support surface to support a substrate having a given width, and wherein the opening is sized to expose a predominant portion of the support surface; and wherein the first surface includes at least one reflective portion configured to reflect heat energy toward a central axis of the annular body, wherein the at least one reflective portion has a surface area that is about 5 to about 50 percent of a total surface area of the first surface.

Abstract translation: 本文提供了用于提高基板上的温度均匀性的装置。 在一些实施例中，用于处理衬底的衬底处理系统中的沉积环可以包括具有第一表面，相对的第二表面和穿过第一表面和第二表面的中心开口的环形体，其中第二表面是 被配置为设置在具有支撑表面的基板支撑件上，以支撑具有给定宽度的基板，并且其中所述开口的尺寸设定成暴露所述支撑表面的主要部分; 并且其中所述第一表面包括至少一个反射部分，所述至少一个反射部分构造成朝向所述环形体的中心轴线反射热能，其中所述至少一个反射部分的表面积为所述环形体的总表面积的约5至约50％ 第一个表面。

公开(公告)号：US06954042B2

公开(公告)日：2005-10-11

申请号：US10884750

申请日：2004-07-02

Applicant: Joung-Joo Lee ,  Ssi-Chol Choi

Inventor： Joung-Joo Lee ,  Ssi-Chol Choi

IPC: H02P6/16 ,  H02P5/06

CPC classification number: H02P6/16 ,  H02P6/28

Abstract: A motor driving circuit is described for three-phase brushless DC motors, which have a three-phase-coil and first and second Hall sensors to detect the magnetic field of a rotor. The motor driving circuit includes first and second comparators, comparing a first and second pair of Hall signals from the Hall sensors, and outputting a first and second Hall signals. An adder unit receives the first and second pair of Hall signals to output a third pair of Hall signals to a third comparator, which outputs a third Hall signal. A motor driver is controlled by the first, second, and third Hall signals of the first, second and third comparators to change directions of currents flowing through phases of the three-phase coil accordingly to rotate the rotor of the motor. The first and second Hall signals can be amplified to match the level of the third Hall signal, or vice versa.

Abstract translation: 对具有用于检测转子的磁场的三相线圈和第一和第二霍尔传感器的三相无刷直流电动机描述电动机驱动电路。 马达驱动电路包括第一和第二比较器，比较来自霍尔传感器的第一和第二对霍尔信号，并输出第一和第二霍尔信号。 加法器单元接收第一和第二对霍尔信号，以将第三对霍尔信号输出到第三比较器，其输出第三霍尔信号。 马达驱动器由第一，第二和第三比较器的第一，第二和第三霍尔信号控制，以改变流经三相线圈的相位的电流的方向，从而使马达的转子旋转。 第一和第二霍尔信号可被放大以匹配第三霍尔信号的电平，反之亦然。