公开(公告)号：US20060113621A1

公开(公告)日：2006-06-01

申请号：US11327216

申请日：2006-01-06

Applicant: James Hofmann

Inventor： James Hofmann

IPC: H01L31/0203

CPC classification number: H01L21/76817 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F9/00 ,  H01L21/76801 ,  H01L21/76802 ,  H01L21/76807 ,  H01L23/3114 ,  H01L23/525 ,  H01L23/5329 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  Y10S438/951 ,  H01L2924/00

Abstract: The invention includes methods of forming patterns in low-k dielectric materials by contact lithography. In a particular application, a mold having a first pattern is pressed into a low-k dielectric material to form a second pattern within the material. The second pattern is substantially complementary to the first pattern. The mold is then removed from the low-k dielectric material. The invention also includes a method of forming a mold; and includes a mold configured to pattern a mass over a semiconductor substrate during contact lithography of the mass.

Abstract translation: 本发明包括通过接触光刻在低k电介质材料中形成图案的方法。 在具体应用中，具有第一图案的模具被压入低k电介质材料中以在材料内形成第二图案。 第二图案与第一图案基本上互补。 然后将模具从低k电介质材料中取出。 本发明还包括一种形成模具的方法; 并且包括配置成在所述物体的接触光刻期间在半导体衬底上图案化的模具。

公开(公告)号：US20060253748A1

公开(公告)日：2006-11-09

申请号：US11121152

申请日：2005-05-03

Applicant: Robert Brink ,  James Hofmann ,  Max Olsen ,  Gary Schiessler ,  Lane Smith

Inventor： Robert Brink ,  James Hofmann ,  Max Olsen ,  Gary Schiessler ,  Lane Smith

IPC: G01R31/28

CPC classification number: H04L1/244 ,  H04L43/50

Abstract: Communications equipment can be tested using a test pattern that is modified compared to, and more exploitive than, a standard test pattern. Test patterns can be employed that have lengthened or shortened consecutive identical digit (CID) portions, or that have lengthened or shortened pseudo random bit sequence (PRBS) portions. In some cases, PRBS polynomials are not re-seeded after each CID. Further, different order polynomials can be employed for different applications. Exemplary applications can include test equipment and built-in self-test capability for integrated circuits.

Abstract translation: 通信设备可以使用与标准测试模式相比修改的测试模式进行测试，并且比标准测试模式更具有潜力。 可以采用具有延长或缩短连续相同数字（CID）部分或具有延长或缩短的伪随机位序列（PRBS）部分的测试模式。 在某些情况下，在每个CID之后，PRBS多项式不再重播。 此外，不同的阶多项式可以用于不同的应用。 示例性应用可以包括测试设备和用于集成电路的内置自检能力。

公开(公告)号：US20060183331A1

公开(公告)日：2006-08-17

申请号：US11395476

申请日：2006-03-30

Applicant: James Hofmann

Inventor： James Hofmann

IPC: H01L21/302

CPC classification number: H01L21/76817 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F9/00 ,  H01L21/76801 ,  H01L21/76802 ,  H01L21/76807 ,  H01L23/3114 ,  H01L23/525 ,  H01L23/5329 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  Y10S438/951 ,  H01L2924/00

Abstract: The invention includes methods of forming patterns in low-k dielectric materials by contact lithography. In a particular application, a mold having a first pattern is pressed into a low-k dielectric material to form a second pattern within the material. The second pattern is substantially complementary to the first pattern. The mold is then removed from the low-k dielectric material. The invention also includes a method of forming a mold; and includes a mold configured to pattern a mass over a semiconductor substrate during contact lithography of the mass.

Abstract translation: 本发明包括通过接触光刻在低k电介质材料中形成图案的方法。 在具体应用中，具有第一图案的模具被压入低k电介质材料中以在材料内形成第二图案。 第二图案与第一图案基本上互补。 然后将模具从低k电介质材料中取出。 本发明还包括一种形成模具的方法; 并且包括配置成在所述物体的接触光刻期间在半导体衬底上图案化的模具。

公开(公告)号：US20060139561A1

公开(公告)日：2006-06-29

申请号：US11356907

申请日：2006-02-17

Applicant: James Hofmann ,  Brian Vaartstra ,  Brenda Kraus ,  Donald Westmoreland

Inventor： James Hofmann ,  Brian Vaartstra ,  Brenda Kraus ,  Donald Westmoreland

IPC: G02F1/1339

CPC classification number: G03F7/0017 ,  B29C33/3857 ,  G02F1/1339 ,  G02F1/13394 ,  H01J2211/36 ,  Y10T428/1059

Abstract: The present invention describes thick film photolithographic molds, methods of making thick film photolithographic molds, and methods of using thick film photolithographic molds to form spacers on a substrate. The thick film photolithographic molds preferably comprise an epoxy bisphenol A novolac resin. The present invention also describes sol gel spacers comprising sodium silicates and potassium silicates. The thick film photolithographic molds and sol gel spacers of the present invention can be used in flat panel displays, such as field emission displays and plasma displays.

Abstract translation: 本发明描述了厚膜光刻模具，制备厚膜光刻模具的方法，以及使用厚膜光刻模具在衬底上形成间隔物的方法。 厚膜光刻模优选包含环氧双酚A酚醛清漆树脂。 本发明还描述了包含硅酸钠和硅酸钾的溶胶凝胶间隔物。 本发明的厚膜光刻模和溶胶凝胶间隔物可用于诸如场发射显示器和等离子体显示器的平板显示器中。

公开(公告)号：US20050082581A1

公开(公告)日：2005-04-21

申请号：US10973040

申请日：2004-10-25

Applicant: James Hofmann ,  Glenn Piper

Inventor： James Hofmann ,  Glenn Piper

IPC: C03B37/012 ,  C03B37/028 ,  C03C27/02 ,  C03C27/06 ,  H01J9/18 ,  H01J9/24 ,  H01J9/26 ,  H01L29/768

CPC classification number: H01J9/185 ,  C03B37/01205 ,  C03B37/028 ,  C03B2203/40 ,  C03C27/02 ,  C03C27/06 ,  H01J9/242 ,  H01J2329/8625

Abstract: A controller is used with an anodic bonding system that has a charge flowpath for supplying charge to bond materials together. The controller includes a switch and a circuit. The switch is configured to control a flow of the charge through the charge flowpath. The circuit is configured to monitor a rate of the flow, use the rate to determine an amount of the charge supplied for bonding, and based on the amount or rate, operate the switch to control the flow.

Abstract translation: 控制器与阳极接合系统一起使用，该系统具有用于向粘结材料提供电荷的电荷流动路径。 控制器包括开关和电路。 开关被配置为控制通过电荷流动路径的电荷的流动。 该电路被配置为监测流量的速率，使用速率来确定为粘合提供的电荷的量，并且基于数量或速率，操作开关以控制流量。

公开(公告)号：US20050026438A1

公开(公告)日：2005-02-03

申请号：US10931607

申请日：2004-08-31

Applicant: James Hofmann

Inventor： James Hofmann

IPC: G03F7/00 ,  H01L21/60 ,  H01L21/768 ,  H01L23/525 ,  H01L23/532 ,  B22C9/00

CPC classification number: H01L21/76817 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F9/00 ,  H01L21/76801 ,  H01L21/76802 ,  H01L21/76807 ,  H01L23/3114 ,  H01L23/525 ,  H01L23/5329 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  Y10S438/951 ,  H01L2924/00

Abstract: The invention includes methods of forming patterns in low-k dielectric materials by contact lithography. In a particular application, a mold having a first pattern is pressed into a low-k dielectric material to form a second pattern within the material. The second pattern is substantially complementary to the first pattern. The mold is then removed from the low-k dielectric material. The invention also includes a method of forming a mold; and includes a mold configured to pattern a mass over a semiconductor substrate during contact lithography of the mass.

Abstract translation: 本发明包括通过接触光刻在低k电介质材料中形成图案的方法。 在具体应用中，具有第一图案的模具被压入低k电介质材料中以在材料内形成第二图案。 第二图案与第一图案基本上互补。 然后将模具从低k电介质材料中取出。 本发明还包括一种形成模具的方法; 并且包括配置成在所述物体的接触光刻期间在半导体衬底上图案化的模具。

公开(公告)号：US06287487B1

公开(公告)日：2001-09-11

申请号：US09605547

申请日：2000-06-27

Applicant: Jason B. Elledge ,  James Hofmann

Inventor： Jason B. Elledge ,  James Hofmann

IPC: B29D1100

CPC classification number: H01J9/242 ,  C03B37/01211 ,  C03B37/028 ,  C03B37/14 ,  C03B37/15 ,  G02B6/08 ,  H01J29/864 ,  H01J2329/00 ,  H01J2329/863 ,  Y10T29/49801

Abstract: A hexagonal mold is formed by a unitary base and a unitary cover. Each of the base and the cover form three of the six surfaces of a hexagonal mold cavity when the cover is placed on top of the base. The hexagonal mold may be used to form field emission display spacers and field emission display microchannels by placing etchable single fibers in the hexagonal mold to form hexagonal multiple fiber preforms. The preforms are then drawn to form multiple fibers that are placed in a rectangular mold to form a rectangular fiber block. The rectangular fiber block is then sliced into sheets which are then placed between a field emission display baseplate and a field emission display faceplate.

Abstract translation: 六角形模具由单一基座和整体盖板形成。 当盖子放置在基座的顶部时，基座和盖子中的每一个形成六边形模腔的六个表面中的三个。 六角形模具可用于通过将可蚀刻单纤维放置在六边形模具中以形成六边形多纤维预制件来形成场发射显示间隔件和场发射显示微通道。 然后将预成型件拉伸以形成放置在矩形模具中以形成矩形纤维块的多根纤维。 然后将矩形纤维块切片成片，然后将其放置在场发射显示基板和场发射显示面板之间。

公开(公告)号：US5906037A

公开(公告)日：1999-05-25

申请号：US797779

申请日：1997-02-07

Applicant: Jason B. Elledge ,  James Hofmann

Inventor： Jason B. Elledge ,  James Hofmann

IPC: C03B37/012 ,  C03B37/028 ,  C03B37/14 ,  C03B37/15 ,  G02B6/08 ,  H01J9/18 ,  H01J9/24 ,  H01J29/86 ,  B23P17/00

CPC classification number: H01J9/242 ,  C03B37/01211 ,  C03B37/028 ,  C03B37/14 ,  C03B37/15 ,  G02B6/08 ,  H01J29/864 ,  H01J2329/00 ,  H01J2329/863 ,  Y10T29/49801

Abstract: A hexagonal mold is formed by a unitary base and a unitary cover. Each of the base and the cover form three of the six surfaces of a hexagonal mold cavity when the cover is placed on top of the base. The hexagonal mold may be used to form field emission display spacers and field emission display microchannels by placing etchable single fibers in the hexagonal mold to form hexagonal multiple fiber preforms. The preforms are then drawn to form multiple fibers that are placed in a rectangular mold to form a rectangular fiber block. The rectangular fiber block is then sliced into sheets which are then placed between a field emission display baseplate and a field emission display faceplate.

Abstract translation: 六角形模具由单一基座和整体盖板形成。 当盖子放置在基座的顶部时，基座和盖子中的每一个形成六边形模腔的六个表面中的三个。 六角形模具可用于通过将可蚀刻单纤维放置在六边形模具中以形成六边形多纤维预制件来形成场发射显示间隔件和场发射显示微通道。 然后将预成型件拉伸以形成放置在矩形模具中以形成矩形纤维块的多根纤维。 然后将矩形纤维块切片成片，然后将其放置在场发射显示基板和场发射显示面板之间。

公开(公告)号：US20060002120A1

公开(公告)日：2006-01-05

申请号：US10880836

申请日：2004-06-30

Applicant: Martin Grigg ,  James Hofmann ,  Brian Pendowski

Inventor： Martin Grigg ,  James Hofmann ,  Brian Pendowski

IPC: F21V33/00

CPC classification number: B62J6/005 ,  B60Q1/0483 ,  B62J6/02

Abstract: A lamp assembly mountable on a motorcycle having first and second fork tubes. The lamp assembly includes a bracket that is attachable to only the first fork tube. The bracket is adapted to be solely supported by the first fork tube. A first light is coupled to the bracket and a second light is coupled to the bracket.

Abstract translation: 安装在具有第一和第二叉管的摩托车上的灯组件。 灯组件包括仅可附接到第一叉管的托架。 支架适于单独由第一叉管支撑。 第一个光耦合到支架，第二个光耦合到支架。

公开(公告)号：US20050161153A1

公开(公告)日：2005-07-28

申请号：US10972883

申请日：2004-10-25

Applicant: James Hofmann ,  Glenn Piper

Inventor： James Hofmann ,  Glenn Piper

IPC: C03B37/012 ,  C03B37/028 ,  C03C27/02 ,  C03C27/06 ,  H01J9/18 ,  H01J9/24 ,  H01J9/26 ,  B32B31/00

CPC classification number: H01J9/185 ,  C03B37/01205 ,  C03B37/028 ,  C03B2203/40 ,  C03C27/02 ,  C03C27/06 ,  H01J9/242 ,  H01J2329/8625

Abstract: A controller is used with an anodic bonding system that has a charge flowpath for supplying charge to bond materials together. The controller includes a switch and a circuit. The switch is configured to control a flow of the charge through the charge flowpath. The circuit is configured to monitor a rate of the flow, use the rate to determine an amount of the charge supplied for bonding, and based on the amount or rate, operate the switch to control the flow.