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7 条记录 (耗时 0.013 秒)

    Adhesive compound and method for encapsulating an electronic arrangement
    3.
    发明授权
    Adhesive compound and method for encapsulating an electronic arrangement 有权
    粘合剂和封装电子装置的方法

    公开(公告)号：US09230829B2

    公开(公告)日：2016-01-05

    申请号：US13992269

    申请日：2011-11-03

    申请人： Klaus Telgenbüscher ,  Judith Grünauer ,  Jan Ellinger

    发明人： Klaus Telgenbüscher ,  Judith Grünauer ,  Jan Ellinger

    IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L51/52

    CPC分类号： H01L21/56 ,  H01L21/561 ,  H01L23/3121 ,  H01L51/5253 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

    摘要： The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby.

    摘要翻译： 本发明涉及一种用于将电子装置封装在穿透物上的方法，其中电子装置可在衬底上获得，其中在真空中，包围要被封装的电子装置的该区域的衬底区域， 优选地，所述区域和待封装的电子装置的区域与包含至少一种粘合剂化合物和复合材料的片材接触。 本发明还涉及一种用于实现该方法的装置以及由此产生的封装的电子装置。

    ADHESIVE COMPOUND AND METHOD FOR ENCAPSULATING AN ELECTRONIC ARRANGEMENT
    4.
    发明申请
    ADHESIVE COMPOUND AND METHOD FOR ENCAPSULATING AN ELECTRONIC ARRANGEMENT 有权
    用于封装电子布置的粘合剂和方法

    公开(公告)号：US20130264724A1

    公开(公告)日：2013-10-10

    申请号：US13992269

    申请日：2011-11-03

    申请人： Klaus Telgenbüscher ,  Judith Grünauer ,  Jan Ellinger

    发明人： Klaus Telgenbüscher ,  Judith Grünauer ,  Jan Ellinger

    IPC分类号： H01L21/56

    CPC分类号： H01L21/56 ,  H01L21/561 ,  H01L23/3121 ,  H01L51/5253 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

    摘要： The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby.

    摘要翻译： 本发明涉及一种用于将电子装置封装在穿透物上的方法，其中电子装置可在衬底上获得，其中在真空中，包围要被封装的电子装置的该区域的衬底区域， 优选地，所述区域和待封装的电子装置的区域与包含至少一种粘合剂化合物和复合材料的片材接触。 本发明还涉及一种用于实现该方法的装置以及由此产生的封装的电子装置。

    TRANSPARENT BARRIER LAMINATES
    7.
    发明申请
    TRANSPARENT BARRIER LAMINATES 审中-公开
    透明屏障层压板

    公开(公告)号：US20120064318A1

    公开(公告)日：2012-03-15

    申请号：US13264355

    申请日：2010-04-08

    申请人： Klaus Keite-Telgenbüscher ,  Judith Grünauer ,  Jan Ellinger

    发明人： Klaus Keite-Telgenbüscher ,  Judith Grünauer ,  Jan Ellinger

    IPC分类号： B32B7/02 ,  B32B38/08

    CPC分类号： B32B27/08 ,  B32B15/08 ,  H01L51/448 ,  H01L51/5256 ,  H01L2251/5338 ,  H01M14/005 ,  Y10T428/24975

    摘要： A novel, transparent, non-substrate-based permeation barrier film for encapsulating electronic, more particularly optoelectronic, assemblies consists of a first polymer layer (10), a first inorganic barrier layer (20), at least one at least partially organic compensation layer (30), at least one further inorganic barrier layer (21) and also at least one further polymer layer (11), wherein the polymer layers and the inorganic barrier layers, respectively, can be made of the same or different material, wherein the inorganic barrier layers have a thickness of between 2 and 1000 nm, and wherein the polymer layers and the at least partially organic compensation layer have a thickness of less than 5 [mu]m, preferably between 0.5 and 4 [mu]m. The film can have, on one or both sides, an auxiliary carrier attached by means of a re-releasable adhesive. It is also possible for a plurality of films to be laminated to one another by means of a further at least partially organic compensation layer.

    摘要翻译： 用于封装电子，更具体地，光电子组件的新颖的，透明的，非基底的渗透阻挡膜由第一聚合物层（10），第一无机阻挡层（20），至少一个至少部分有机补偿层 （30），至少一个另外的无机阻挡层（21）和至少一个另外的聚合物层（11），其中聚合物层和无机阻挡层分别可以由相同或不同的材料制成，其中 无机阻挡层具有2至1000nm的厚度，并且其中聚合物层和至少部分有机补偿层具有小于5μm，优选0.5至4μm的厚度。 该膜可以在一侧或两侧上具有通过可再剥离粘合剂附着的辅助载体。 还可以通过另外的至少部分有机补偿层将多个膜彼此层压。