摘要:
A novel, transparent, non-substrate-based permeation barrier film for encapsulating electronic, more particularly optoelectronic, assemblies consists of a first polymer layer (10), a first inorganic barrier layer (20), at least one at least partially organic compensation layer (30), at least one further inorganic barrier layer (21) and also at least one further polymer layer (11), wherein the polymer layers and the inorganic barrier layers, respectively, can be made of the same or different material, wherein the inorganic barrier layers have a thickness of between 2 and 1000 nm, and wherein the polymer layers and the at least partially organic compensation layer have a thickness of less than 5 [mu]m, preferably between 0.5 and 4 [mu]m. The film can have, on one or both sides, an auxiliary carrier attached by means of a re-releasable adhesive. It is also possible for a plurality of films to be laminated to one another by means of a further at least partially organic compensation layer.
摘要:
A method glues a heat-activated glueable surface element to an adhesive substrate which does not conduct electric current, whereby a surface thereof has only a low thermal conductivity. The heat-activated glueable surface element has an electrically conductive layer in addition to a heat-activated adhesive mass. The layer is inductively heated for a short time in an alternating magnetic field at a frequency from a middle frequency range. A high pressure of at least 1 MPa is exerted on the gluing surface simultaneously to the inductive heating, whereby preventing thermal decomposition reactions is possible. Further, a device performs the method and has an induction heater integrated in a press tool.
摘要:
A heat-activated, glueable sheetlike element having at least one heat-activatable adhesive, at least one inductively heatable material, and at least one thermally conductive filler, wherein material of the thermally conductive filler has a thermal conductivity of at least 0.5 W/(m*K)
摘要翻译:一种具有至少一种可热激活粘合剂,至少一种可感应加热的材料和至少一种导热填料的热激活的可胶粘的片状元件,其中导热填料的材料具有至少0.5W /( m * K)
摘要:
A heat-activatedly bondable sheetlike element having at least one electrically conductive sheetlike structure and at least two layers of different heat-activable adhesives. A first heat-activatable adhesive layer is located substantially on a first side of the electrically conductive sheetlike structure and the second heat-activatable adhesive layer is located substantially on a second side of the electrically conductive sheetlike structure. Activation temperatures for achieving the adhesive properties of the heat-activatable adhesive layers differ from one another less than the melting temperatures of the two heat-activatable adhesive layers.
摘要:
A method glues a heat-activated glueable surface element to an adhesive substrate which does not conduct electric current, whereby a surface thereof has only a low thermal conductivity. The heat-activated glueable surface element has an electrically conductive layer in addition to a heat-activated adhesive mass. The layer is inductively heated for a short time in an alternating magnetic field at a frequency from a middle frequency range. A high pressure of at least 1 MPa is exerted on the gluing surface simultaneously to the inductive heating, whereby preventing thermal decomposition reactions is possible. Further, a device performs the method and has an induction heater integrated in a press tool.
摘要:
The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby.
摘要:
The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby.