公开(公告)号：US20190148420A1

公开(公告)日：2019-05-16

申请号：US16217563

申请日：2018-12-12

申请人： Patrick HOGAN ,  John MOORE ,  Alex BREWER ,  Jared PETTIT

发明人： Patrick HOGAN ,  John MOORE ,  Alex BREWER ,  Jared PETTIT

IPC分类号： H01L27/12 ,  H01L21/3213 ,  C23F1/18 ,  C23F1/02 ,  C23F1/16 ,  H01L29/786 ,  H01L29/423 ,  H01L29/49 ,  H01L21/283 ,  H01L29/66 ,  H01L29/417 ,  C23F1/26 ,  C23F1/30

摘要： In various embodiments, etchants featuring (i) mixtures of hydrochloric acid, methanesulfonic acid, and nitric acid, or (ii) mixtures of phosphoric acid, methanesulfonic acid, and nitric acid, are utilized to etch metallic bilayers while minimizing resulting etch discontinuities between the layers of the bilayer.

公开(公告)号：US10186530B2

公开(公告)日：2019-01-22

申请号：US15249603

申请日：2016-08-29

申请人： Patrick Hogan ,  John Moore ,  Alex Brewer ,  Jared Pettit

发明人： Patrick Hogan ,  John Moore ,  Alex Brewer ,  Jared Pettit

IPC分类号： H01L21/3205 ,  C23F1/16 ,  H01L27/12 ,  C23F1/02 ,  H01L29/66 ,  H01L21/283 ,  H01L29/49 ,  H01L29/423 ,  H01L29/786 ,  H01L21/3213 ,  C23F1/18 ,  C23F1/26 ,  C23F1/30 ,  H01L29/417 ,  G02F1/1343 ,  G02F1/1368

摘要： In various embodiments, etchants featuring (i) mixtures of hydrochloric acid, methanesulfonic acid, and nitric acid, or (ii) mixtures of phosphoric acid, methanesulfonic acid, and nitric acid, are utilized to etch metallic bilayers while minimizing resulting etch discontinuities between the layers of the bilayer.

公开(公告)号：US10923514B2

公开(公告)日：2021-02-16

申请号：US16217563

申请日：2018-12-12

申请人： Patrick Hogan ,  John Moore ,  Alex Brewer ,  Jared Pettit

发明人： Patrick Hogan ,  John Moore ,  Alex Brewer ,  Jared Pettit

IPC分类号： H01L21/3205 ,  C23F1/16 ,  H01L27/12 ,  C23F1/02 ,  H01L29/66 ,  H01L21/283 ,  H01L29/49 ,  H01L29/423 ,  H01L29/786 ,  H01L21/3213 ,  C23F1/18 ,  C23F1/26 ,  C23F1/30 ,  H01L29/417 ,  G02F1/1343 ,  G02F1/1368

摘要： In various embodiments, etchants featuring (i) mixtures of hydrochloric acid, methanesulfonic acid, and nitric acid, or (ii) mixtures of phosphoric acid, methanesulfonic acid, and nitric acid, are utilized to etch metallic bilayers while minimizing resulting etch discontinuities between the layers of the bilayer.

公开(公告)号：US20160372500A1

公开(公告)日：2016-12-22

申请号：US15249603

申请日：2016-08-29

申请人： Patrick HOGAN ,  John MOORE ,  Alex BREWER ,  Jared PETTIT

发明人： Patrick HOGAN ,  John MOORE ,  Alex BREWER ,  Jared PETTIT

IPC分类号： H01L27/12 ,  H01L29/786 ,  H01L29/423 ,  C23F1/26 ,  H01L21/3213 ,  C23F1/02 ,  C23F1/18 ,  C23F1/30 ,  H01L29/66 ,  H01L29/417

CPC分类号： H01L27/1288 ,  C23F1/02 ,  C23F1/16 ,  C23F1/18 ,  C23F1/26 ,  C23F1/30 ,  G02F1/13439 ,  G02F1/1368 ,  G02F2202/103 ,  H01L21/283 ,  H01L21/32134 ,  H01L21/32139 ,  H01L27/1218 ,  H01L27/1222 ,  H01L27/1296 ,  H01L29/41733 ,  H01L29/42384 ,  H01L29/4908 ,  H01L29/4958 ,  H01L29/66742 ,  H01L29/66765 ,  H01L29/78603 ,  H01L29/78669

摘要： In various embodiments, etchants featuring (i) mixtures of hydrochloric acid, methanesulfonic acid, and nitric acid, or (ii) mixtures of phosphoric acid, methanesulfonic acid, and nitric acid, are utilized to etch metallic bilayers while minimizing resulting etch discontinuities between the layers of the bilayer.

公开(公告)号：US20150255494A1

公开(公告)日：2015-09-10

申请号：US14636594

申请日：2015-03-03

申请人： Patrick Hogan ,  John Moore ,  Alex Brewer ,  Jared Pettit

发明人： Patrick Hogan ,  John Moore ,  Alex Brewer ,  Jared Pettit

IPC分类号： H01L27/12 ,  C23F1/02 ,  H01L29/66 ,  H01L21/3213 ,  H01L29/49 ,  H01L29/423 ,  H01L29/786 ,  C23F1/16 ,  H01L21/283

CPC分类号： H01L27/1288 ,  C23F1/02 ,  C23F1/16 ,  C23F1/18 ,  C23F1/26 ,  C23F1/30 ,  G02F1/13439 ,  G02F1/1368 ,  G02F2202/103 ,  H01L21/283 ,  H01L21/32134 ,  H01L21/32139 ,  H01L27/1218 ,  H01L27/1222 ,  H01L27/1296 ,  H01L29/41733 ,  H01L29/42384 ,  H01L29/4908 ,  H01L29/4958 ,  H01L29/66742 ,  H01L29/66765 ,  H01L29/78603 ,  H01L29/78669

摘要： In various embodiments, etchants featuring (i) mixtures of hydrochloric acid, methanesulfonic acid, and nitric acid, or (ii) mixtures of phosphoric acid, methanesulfonic acid, and nitric acid, are utilized to etch metallic bilayers while minimizing resulting etch discontinuities between the layers of the bilayer.

摘要翻译： 在各种实施方案中，使用特征为（i）盐酸，甲磺酸和硝酸的混合物或（ii）磷酸，甲磺酸和硝酸的混合物的蚀刻剂来蚀刻金属双层，同时最小化所得到的蚀刻不连续性 双层的层。

公开(公告)号：US09455283B2

公开(公告)日：2016-09-27

申请号：US14636594

申请日：2015-03-03

申请人： Patrick Hogan ,  John Moore ,  Alex Brewer ,  Jared Pettit

发明人： Patrick Hogan ,  John Moore ,  Alex Brewer ,  Jared Pettit

IPC分类号： C23F1/16 ,  H01L21/3205 ,  H01L27/12 ,  C23F1/02 ,  H01L29/66 ,  H01L21/283 ,  H01L29/49 ,  H01L29/423 ,  H01L29/786 ,  H01L21/3213 ,  C23F1/18 ,  C23F1/26

CPC分类号： H01L27/1288 ,  C23F1/02 ,  C23F1/16 ,  C23F1/18 ,  C23F1/26 ,  C23F1/30 ,  G02F1/13439 ,  G02F1/1368 ,  G02F2202/103 ,  H01L21/283 ,  H01L21/32134 ,  H01L21/32139 ,  H01L27/1218 ,  H01L27/1222 ,  H01L27/1296 ,  H01L29/41733 ,  H01L29/42384 ,  H01L29/4908 ,  H01L29/4958 ,  H01L29/66742 ,  H01L29/66765 ,  H01L29/78603 ,  H01L29/78669

摘要： In various embodiments, etchants featuring (i) mixtures of hydrochloric acid, methanesulfonic acid, and nitric acid, or (ii) mixtures of phosphoric acid, methanesulfonic acid, and nitric acid, are utilized to etch metallic bilayers while minimizing resulting etch discontinuities between the layers of the bilayer.

摘要翻译： 在各种实施方案中，使用特征为（i）盐酸，甲磺酸和硝酸的混合物或（ii）磷酸，甲磺酸和硝酸的混合物的蚀刻剂来蚀刻金属双层，同时最小化所得到的蚀刻不连续性 双层的层。