公开(公告)号：US20060204742A1

公开(公告)日：2006-09-14

申请号：US11387425

申请日：2006-03-23

Applicant: Dana Gronbeck ,  Michael Gallagher ,  Jeffrey Calvert ,  Gregory Prokopowicz ,  Timothy Adams

Inventor： Dana Gronbeck ,  Michael Gallagher ,  Jeffrey Calvert ,  Gregory Prokopowicz ,  Timothy Adams

IPC: B05D5/12 ,  B05D3/02 ,  B32B9/00

CPC classification number: H01L21/02126 ,  C09D183/04 ,  C09D183/14 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/31695 ,  Y10T428/249987

Abstract: Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits.

Abstract translation: 提供了沉积均匀的针孔缺陷有机聚硅氧烷涂层的方法。 这些方法允许在制造集成电路中使用这些材料作为旋涂帽层。

公开(公告)号：US20080038518A1

公开(公告)日：2008-02-14

申请号：US11891857

申请日：2007-08-13

Applicant: Michael Gallagher ,  Dana Gronbeck ,  Timothy Adams ,  Jeffrey Calvert

Inventor： Michael Gallagher ,  Dana Gronbeck ,  Timothy Adams ,  Jeffrey Calvert

IPC: B32B1/00

CPC classification number: B81B7/0006 ,  B81B2203/0315 ,  B81C2201/0108 ,  H01L21/764 ,  H01L21/7682 ,  H01L23/5222 ,  H01L2924/0002 ,  Y10T428/24628 ,  H01L2924/00

Abstract: A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.

Abstract translation: 提供了一种在固体结构内形成气隙的方法。 在该方法中，牺牲材料被覆盖层覆盖。 然后通过覆盖层去除牺牲材料以留下空隙。 这种气隙特别适用于诸如电互连结构的电子设备中的金属线之间的绝缘。 还提供了包含气隙的结构。