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    Thick film resistor compositions
    1.
    发明授权
    Thick film resistor compositions 失效
    厚膜电阻组合物

    公开(公告)号：US5474711A

    公开(公告)日：1995-12-12

    申请号：US310611

    申请日：1994-09-22

    申请人： William Borland ,  Keiichiro Hayakawa ,  Takeshi Sato ,  Jerome D. Smith

    发明人： William Borland ,  Keiichiro Hayakawa ,  Takeshi Sato ,  Jerome D. Smith

    IPC分类号： H01C17/065 ,  H01B1/00 ,  H01B1/06 ,  H01B1/08

    CPC分类号： H01C17/0654 ,  C03C3/07 ,  C03C3/072 ,  C03C3/074 ,  C03C8/10 ,  C03C8/12 ,  C03C8/14 ,  C03C8/22

    摘要： To provide a thick film resistor involving small variations in resistance and TCR during the firing step and a low thermal coefficient of expansion. A thick film resistor composition containing 5-30 wt. % of a ruthenium pyrochlore oxide and 10-90 wt. % of a glass binder, wherein (1) the ruthenium pyrochlore oxide is PbRuO.sub.3, (2) the glass binder is a glass which contains a first glass containing 61-85 wt. % of PbO, 10-36% of SiO.sub.2 and 0-2 wt. % of B.sub.2 O.sub.3, the total content of the PbO, SiO.sub.2 and B.sub.2 O.sub.3 accounting for 95 wt. % or more of the first glass, and in which 2-20 wt. % of B.sub.2 O.sub.3 is contained in the entire glass binder, and (3) the first glass accounts for 5-30 wt. % of the thick film resistor composition, and the weight ratio of the ruthenium pyrochlore oxide to the first glass is 5:30-60:40.

    摘要翻译： 提供一种厚膜电阻器，其在烧制步骤期间具有小的电阻变化和TCR，并且具有低的热膨胀系数。 一种厚膜电阻组合物，其含有5-30wt。 钌烧绿石氧化物的％和10-90重量％ ％的玻璃粘合剂，其中（1）钌烧绿石氧化物是PbRuO 3，（2）玻璃粘合剂是玻璃，其含有含有61-85重量％ ％的PbO，10-36％的SiO 2和0-2wt。 B2O3的含量，PbO，SiO2和B2O3的总含量为95wt。 ％以上的第一玻璃，其中2-20重量％ 整个玻璃粘合剂中含有B 2 O 3％，（3）第一玻璃占5-30重量％。 厚膜电阻组合物的％，钌烧绿石氧化物与第一玻璃的重量比为5:30-60:40。

    Method of manufacturing thick-film resistor elements
    4.
    发明授权
    Method of manufacturing thick-film resistor elements 失效
    制造厚膜电阻元件的方法

    公开(公告)号：US5624782A

    公开(公告)日：1997-04-29

    申请号：US439323

    申请日：1995-05-11

    申请人： Keiichiro Hayakawa ,  Jerome D. Smith ,  Hidehiro Yamada

    发明人： Keiichiro Hayakawa ,  Jerome D. Smith ,  Hidehiro Yamada

    IPC分类号： G03F7/00 ,  H01C17/065 ,  H01C17/28

    CPC分类号： H01C17/06506 ,  G03F7/00 ,  H01C17/283

    摘要： To provide a method of manufacturing thick-film resistor elements that forms thick-film resistors having a uniform thickness on a substrate surface with high precision.A method of manufacturing thick-film resistor elements by applying a thick-film resistor composition, obtained by dispersing a conductive component and an inorganic binder in an organic medium and which has a specified rheology, through a clear relief image obtained by exposing, curing, and developing a resist layer of a photopolymerizable mixture formed on an insulating substrate according to the resist pattern, and the thick-film paste obtained at this time has almost the same thickness as the photopolymerizable layer on the surface of the insulating substrate and is patterned according to the high-precision pattern defined by the sharp, linear, lateral edge enclosed by the resist image removed by development.

    摘要翻译： 提供一种制造厚膜电阻元件的方法，该方法在基板表面上以高精度形成均匀厚度的厚膜电阻器。 通过将通过将导电成分和无机粘合剂分散在有机介质中而得到的具有规定流变性的厚膜电阻体组合物，通过曝光，固化， 并且根据抗蚀剂图案显影形成在绝缘基板上的可光聚合混合物的抗蚀剂层，此时获得的厚膜糊具有与绝缘基板表面上的可光聚合层几乎相同的厚度，并根据 由由显影去除的抗蚀剂图像包围的尖锐的，线性的，侧边缘限定的高精度图案。

    Chip resistor
    5.
    发明授权
    Chip resistor 失效
    贴片电阻

    公开(公告)号：US5379016A

    公开(公告)日：1995-01-03

    申请号：US71625

    申请日：1993-06-03

    申请人： Jerome D. Smith ,  Keiichiro Hayakawa ,  Yasuo Yamamoto

    发明人： Jerome D. Smith ,  Keiichiro Hayakawa ,  Yasuo Yamamoto

    IPC分类号： H01C7/00 ,  H01C17/242 ,  H01C1/012 ,  H01C1/148

    CPC分类号： H01C7/003 ,  H01C17/242

    摘要： To provide a chip resistor with small variation of ESD required when in automobile use, a chip resistor containing(1) insulating substrate,(2) a pair of terminations disposed over said substrate,(3) resistor layer of thick film resistor composition comprising a mixture of finely divided of conductive component and glass binder,wherein said resistor layer being disposed and patterned on the surface of said substrate by printing and firing to form continuous conductive path comprising divided sections connecting to each of said termination, and divided section angled in its longitudinal direction from the direction of current flow in said respective 4 sections connected to said terminations being insulated and separated from one another by underlaying substrata resulting into considerably longer resistor geometry than distance between said terminations.

    摘要翻译： 为了提供在汽车使用时所需的ESD变化小的片式电阻器，包含（1）绝缘基板的芯片电阻器，（2）设置在所述基板上的一对端子，（3）厚膜电阻器组合物的电阻器层， 精细分割的导电部件和玻璃粘合剂的混合物，其中所述电阻层通过印刷和烧制而设置和图案化在所述基板的表面上，以形成连续导电路径，其包括连接到每个所述端接部分的分割部分， 在连接到所述端子的所述相应的4个部分中的电流方向的纵向方向通过底层衬底彼此绝缘和分离，导致比所述端子之间的距离大得多的电阻器几何形状。