公开(公告)号：US08792239B2

公开(公告)日：2014-07-29

申请号：US13280866

申请日：2011-10-25

申请人： Jin Suk Son ,  Kwang Soo Kim ,  Young Ki Lee ,  Sun Woo Yun ,  Sung Keun Park

发明人： Jin Suk Son ,  Kwang Soo Kim ,  Young Ki Lee ,  Sun Woo Yun ,  Sung Keun Park

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate made of a metal material; cooling channels formed to allow a cooling material to flow in an inner portion of the base substrate; an anodized layer formed on an outer surface of the base substrate; a metal layer formed on a first surface of the base substrate having the anodized layer and including circuits and connection pads; and semiconductor devices mounted on the metal layer.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括：由金属材料制成的基底; 形成为允许冷却材料在基底基板的内部部分流动的冷却通道; 阳极化层，形成在所述基底基板的外表面上; 金属层，其形成在具有阳极氧化层的基底基板的第一表面上，并且包括电路和连接焊盘; 以及安装在金属层上的半导体器件。

公开(公告)号：US20130105953A1

公开(公告)日：2013-05-02

申请号：US13610671

申请日：2012-09-11

申请人： Kwang Soo Kim ,  Yong Hoon Kwak ,  Sun Woo Yun ,  Young Ki Lee ,  Kyu Hwan Oh ,  Jin Suk Son

发明人： Kwang Soo Kim ,  Yong Hoon Kwak ,  Sun Woo Yun ,  Young Ki Lee ,  Kyu Hwan Oh ,  Jin Suk Son

IPC分类号： H01L23/495

CPC分类号： H01L23/4334 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49575 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed herein is a power module package including: a substrate having a ceramic layer formed in one surface thereof; a circuit pattern formed on the ceramic layer; a first lead frame having one side contacting the circuit pattern and the other side protruding toward the outside; and a first semiconductor chip mounted on one side of the first lead frame.

摘要翻译： 本文公开了一种功率模块封装，包括：具有在其一个表面中形成的陶瓷层的基板; 形成在陶瓷层上的电路图案; 第一引线框架，其一侧接触电路图案，另一侧向外突出; 以及安装在所述第一引线框架的一侧上的第一半导体芯片。

公开(公告)号：US09105611B2

公开(公告)日：2015-08-11

申请号：US13610671

申请日：2012-09-11

申请人： Kwang Soo Kim ,  Yong Hoon Kwak ,  Sun Woo Yun ,  Young Ki Lee ,  Kyu Hwan Oh ,  Jin Suk Son

发明人： Kwang Soo Kim ,  Yong Hoon Kwak ,  Sun Woo Yun ,  Young Ki Lee ,  Kyu Hwan Oh ,  Jin Suk Son

IPC分类号： H01L23/495 ,  H01L23/433

CPC分类号： H01L23/4334 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49575 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed herein is a power module package including: a substrate having a ceramic layer formed in one surface thereof; a circuit pattern formed on the ceramic layer; a first lead frame having one side contacting the circuit pattern and the other side protruding toward the outside; and a first semiconductor chip mounted on one side of the first lead frame.

摘要翻译： 本文公开了一种功率模块封装，包括：具有在其一个表面中形成的陶瓷层的基板; 形成在陶瓷层上的电路图案; 第一引线框架，其一侧接触电路图案，另一侧向外突出; 以及安装在所述第一引线框架的一侧上的第一半导体芯片。

公开(公告)号：US20130020687A1

公开(公告)日：2013-01-24

申请号：US13301616

申请日：2011-11-21

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Jin Suk Son

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Jin Suk Son

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L21/50 ,  H01L21/565 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括彼此相对设置的第一和第二引线框架; 形成在所述第一引线框架和所述第二引线框架中的两个或第二引线框架的第一表面的一部分上的陶瓷涂层; 以及安装在第一和第二引线框架的第二表面上的半导体器件。

公开(公告)号：US08502374B2

公开(公告)日：2013-08-06

申请号：US13281285

申请日：2011-10-25

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Sung Keun Park ,  Seog Moon Choi ,  Chang Hyun Lim

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Sung Keun Park ,  Seog Moon Choi ,  Chang Hyun Lim

IPC分类号： H01L23/34

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate having grooves formed between a plurality of semiconductor device mounting areas; semiconductor devices mounted on the semiconductor device mounting areas of the base substrate; and a molding formed on the base substrate and in inner portions of the grooves.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括：具有形成在多个半导体器件安装区域之间的沟槽的基底基板; 安装在基底基板的半导体器件安装区域上的半导体器件; 以及形成在基底基板上和凹槽的内部中的模制件。

公开(公告)号：US08941220B2

公开(公告)日：2015-01-27

申请号：US13484160

申请日：2012-05-30

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Sung Keun Park

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Sung Keun Park

IPC分类号： H01L23/495 ,  H01L23/433 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L23/4334 ,  H01L23/3121 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2924/00014 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.

摘要翻译： 本文公开了一种功率模块封装，包括：第一衬底，其上安装有第一半导体芯片; 以及具有安装在其上的第二半导体芯片的第二基板，所述第二基板与所述第一基板结合，使得其厚度方向的侧表面设置在所述第一基板的上表面上。

公开(公告)号：US20120319260A1

公开(公告)日：2012-12-20

申请号：US13484160

申请日：2012-05-30

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Sung Keun Park

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Sung Keun Park

IPC分类号： H01L23/495

CPC分类号： H01L23/4334 ,  H01L23/3121 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2924/00014 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.

摘要翻译： 本文公开了一种功率模块封装，包括：第一衬底，其上安装有第一半导体芯片; 以及具有安装在其上的第二半导体芯片的第二基板，所述第二基板与所述第一基板结合，使得其厚度方向的侧表面设置在所述第一基板的上表面上。

公开(公告)号：US20110284382A1

公开(公告)日：2011-11-24

申请号：US12868071

申请日：2010-08-25

申请人： Sung Keun Park ,  Sang Hyun Shin ,  Kwang Soo Kim ,  Seog Moon Choi

发明人： Sung Keun Park ,  Sang Hyun Shin ,  Kwang Soo Kim ,  Seog Moon Choi

IPC分类号： C25D5/02 ,  C25D7/00

CPC分类号： H05K1/0256 ,  C23C26/00 ,  C25D5/02 ,  C25D5/48 ,  C25D7/123 ,  C25D11/02 ,  C25D11/18 ,  C25D11/20 ,  C25D11/24 ,  H01L21/4846 ,  H01L23/142 ,  H01L23/49894 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/053 ,  H05K3/06 ,  H05K3/108 ,  H05K2203/0315 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Disclosed herein is a printed circuit board, including: a metal substrate; an anodic oxide layer formed by anodizing the metal substrate; circuit layers formed on the anodic oxide layer; and a first sol-gel layer formed by applying a photocatalytic material between circuit wirings of the circuit layers and then curing the applied photocatalytic material. The printed circuit board is advantageous in that it can be realized into a high-voltage package printed circuit board because a sol-gel layer is formed between circuit wirings of circuit layers.

摘要翻译： 这里公开了一种印刷电路板，包括：金属基板; 通过阳极氧化金属基材形成的阳极氧化层; 形成在阳极氧化层上的电路层; 以及通过在电路层的电路布线之间施加光催化材料然后固化所施加的光催化材料而形成的第一溶胶 - 凝胶层。 印刷电路板的优点在于，由于在电路层的电路布线之间形成溶胶 - 凝胶层，所以可以实现为高压封装印刷电路板。

公开(公告)号：US20110304990A1

公开(公告)日：2011-12-15

申请号：US12884058

申请日：2010-09-16

申请人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

发明人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

IPC分类号： H05K7/20 ,  B32B38/04 ,  B32B38/10 ,  H05K1/00 ,  B32B37/02

CPC分类号： H05K1/0203 ,  H05K1/053 ,  H05K1/141 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10166 ,  Y10T29/49083 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T156/1064

摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：芯层，其包括芯金属层和形成在芯金属层上的芯绝缘层，并分为第一区域和第二区域; 形成在芯层的第一区域中的电路层; 形成在所述芯层的所述第二区域中的堆积层，并且包括积聚绝缘层和积聚电路层; 形成在芯层的第二区域和积层之间的粘合层; 以及安装在堆积层上以浸渍到粘合剂层中的浸渍装置。 发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱化元件被发热元件的热​​量损坏。 浸渍装置形成在堆积层上并浸渍在粘合剂层中，从而有效地利用空间。

公开(公告)号：US08315056B2

公开(公告)日：2012-11-20

申请号：US12884058

申请日：2010-09-16

申请人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

发明人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

IPC分类号： H05K7/20 ,  H05K1/03

CPC分类号： H05K1/0203 ,  H05K1/053 ,  H05K1/141 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10166 ,  Y10T29/49083 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T156/1064

摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：芯层，其包括芯金属层和形成在芯金属层上的芯绝缘层，并分为第一区域和第二区域; 形成在芯层的第一区域中的电路层; 形成在所述芯层的所述第二区域中的堆积层，并且包括积聚绝缘层和积聚电路层; 形成在芯层的第二区域和积层之间的粘合层; 以及安装在堆积层上以浸渍到粘合剂层中的浸渍装置。 发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱化元件被发热元件的热​​量损坏。 浸渍装置形成在堆积层上并浸渍在粘合剂层中，从而有效地利用空间。