摘要:
In a replacement gate approach in sophisticated semiconductor devices, a tantalum nitride etch stop material may be efficiently removed on the basis of a wet chemical etch recipe using ammonium hydroxide. Consequently, a further work function adjusting material may be formed with superior uniformity, while the efficiency of the subsequent adjusting of the work function may also be increased. Thus, superior uniformity, i.e., less pronounced transistor variability, may be accomplished on the basis of a replacement gate approach in which the work function of the gate electrodes of P-channel transistors and N-channel transistors is adjusted after completing the basic transistor configuration.
摘要:
When forming sophisticated high-k metal gate electrode structures, for instance on the basis of a replacement gate approach, superior interface characteristics may be obtained on the basis of using a thermally grown base material, wherein the electrically effective thickness may be reduced on the basis of a low temperature anneal process. Consequently, the superior interface characteristics of a thermally grown base material may be provided without requiring high temperature anneal processes, as are typically applied in conventional strategies using a very thin oxide layer formed on the basis of a wet oxidation chemistry.
摘要:
In a replacement gate approach, one work function metal may be provided in an early manufacturing stage, i.e., upon depositing the gate layer stack, thereby reducing the number of deposition steps required in a later manufacturing stage. Consequently, the further work function metal and the electrode metal may be filled into the gate trenches on the basis of superior process conditions compared to conventional replacement gate approaches.
摘要:
A frame element (10) for use in an aircraft component installation system (46) is attachable to an aircraft structure (36) and comprises a storage bin fastening device which is designed to fasten a storage bin (26) at various positions on the frame element (10). A storage bin (26) for use in an aircraft comprises a complementary device to the storage bin fastening device of the frame element (10), in order to fasten the storage bin (26) at various positions on the frame element (10). In a method for the installation of a storage bin (26) in an aircraft a frame element (10) is provided. A storage bin (26) is fastened in a desired position on the frame element (10). The frame element (10) is attached to an aircraft structure (36).
摘要:
In a replacement gate approach, the oxygen contents of a cap material may be increased, thereby providing more stable characteristics of the cap material itself and of the high-k dielectric material. Consequently, upon providing a work function adjusting metal species at a very advanced manufacturing stage, corresponding additional treatments may be reduced in number or may even be completely avoided, while at the same time threshold voltage variations may be reduced.
摘要:
A frame element (10) for use in an aircraft component installation system (46) is attachable to an aircraft structure (36) and comprises a storage bin fastening device which is designed to fasten a storage bin (26) at various positions on the frame element (10). A storage bin (26) for use in an aircraft comprises a complementary device to the storage bin fastening device of the frame element (10), in order to fasten the storage bin (26) at various positions on the frame element (10). In a method for the installation of a storage bin (26) in an aircraft a frame element (10) is provided. A storage bin (26) is fastened in a desired position on the frame element (10). The frame element (10) is attached to an aircraft structure (36).
摘要:
Generally, the subject matter disclosed herein relates to modern sophisticated semiconductor devices and methods for forming the same, wherein a reduced threshold voltage (Vt) may be achieved in HK/MG transistor elements that are manufactured based on replacement gate electrode integrations. One illustrative method disclosed herein includes forming a first metal gate electrode material layer above a gate dielectric material layer having a dielectric constant of approximately 10 or greater. The method further includes exposing the first metal gate electrode material layer to an oxygen diffusion process, forming a second metal gate electrode material layer above the first metal gate electrode material layer, and adjusting an oxygen concentration gradient and a nitrogen concentration gradient in at least the first metal gate electrode material layer and the gate dielectric material layer.
摘要:
The work function of a high-k gate electrode structure may be adjusted in a late manufacturing stage on the basis of a lanthanum species in an N-channel transistor, thereby obtaining the desired high work function in combination with a typical conductive barrier material, such as titanium nitride. For this purpose, in some illustrative embodiments, the lanthanum species may be formed directly on the previously provided metal-containing electrode material, while an efficient barrier material may be provided in the P-channel transistor, thereby avoiding undue interaction of the lanthanum species in the P-channel transistor.
摘要:
Generally, the subject matter disclosed herein relates to modern sophisticated semiconductor devices and methods for forming the same, wherein a reduced threshold voltage (Vt) may be achieved in HK/MG transistor elements that are manufactured based on replacement gate electrode integrations. One illustrative method disclosed herein includes forming a first metal gate electrode material layer above a gate dielectric material layer having a dielectric constant of approximately 10 or greater. The method further includes exposing the first metal gate electrode material layer to an oxygen diffusion process, forming a second metal gate electrode material layer above the first metal gate electrode material layer, and adjusting an oxygen concentration gradient and a nitrogen concentration gradient in at least the first metal gate electrode material layer and the gate dielectric material layer.
摘要:
A frame element for use in an aircraft air-conditioning system is attachable to an aircraft structure and includes at least one strut which is formed to at least in sections as a hollow cylinder, wherein an air inlet connection of the at least one-section-wise hollow cylindrically formed strut of the frame element is connectable to an air outlet duct of an aircraft air-conditioning unit, and an air outlet connection of the at least one section-wise hollow cylindrically formed strut of the frame element is connectable to an air outlet opening terminating in a cabin region of an aircraft.