公开(公告)号：US5072591A

公开(公告)日：1991-12-17

申请号：US422759

申请日：1989-10-17

申请人： John A. Grange ,  Sadeg M. Faris

发明人： John A. Grange ,  Sadeg M. Faris

IPC分类号： F16L59/14

CPC分类号： F16L59/141

摘要： A flexible transfer line for delivering coolant from a storage dewar to cool superconducting circuitry is provided with a delivery capillary coupled to the storage dewar, this capillary being thermally isolated from ambient temperatures. The transfer line has an outer flexible support coaxial with the delivery capillary, and an inner flexible shield between the delivery capillary and the outer flexible support. Heat in the shield is continuously removed to thereby provide the thermal isolation of the delivery capillary. The thermal isolation allows a low-flow rate of coolant through the delivery capillary since inefficiences due to thermal conduction and radiation are substantially eliminated.

摘要翻译： 用于将冷却剂从储存杜瓦输送到冷却超导电路的柔性传输线提供有耦合到储存杜瓦瓶的输送毛细管，该毛细管与环境温度热隔离。 输送管线具有与输送毛细管共轴的外部柔性支撑件，以及在输送毛细管和外部柔性支撑件之间的内部柔性护罩。 连续除去屏蔽层的热量，从而提供输送毛细管的热隔离。 热隔离允许冷却剂通过输送毛细管的低流速，因为基本上消除了由于热传导和辐射导致的无效性。

公开(公告)号：US4870830A

公开(公告)日：1989-10-03

申请号：US101763

申请日：1987-09-28

申请人： Gert K. G. Hohenwarter ,  John A. Grange

发明人： Gert K. G. Hohenwarter ,  John A. Grange

IPC分类号： F17C9/00 ,  F25B19/00 ,  F25D29/00

CPC分类号： F17C9/00 ,  F25B19/005 ,  F25D29/001 ,  F17C2270/0527

摘要： A system for delivering a cryogenic fluid to cool devices, such as electronic devices, in an open-cycle environment. The system comprises a dewar which stores a cold fluid, a cryogenic module for holding a device to be cooled and a cold fluid transfer line which delivers the cold fluid from the dewar to the device within the cryogenic module. The system further comprises an interlock mechanism to hold the transfer line and the dewar securely together and a coupling mechanism to allow the transfer line to securely engage the cryogenic module. The system also comprises a control subsystem which monitors and controls the flow of cold fluid from the dewar and through the transfer line.

摘要翻译： 用于在开放循环环境中递送低温流体以冷却装置（例如电子装置）的系统。 该系统包括储存冷流体的杜瓦瓶，用于保持待冷却装置的低温模块和将冷流体从杜瓦输送到低温模块内的装置的冷流体输送管线。 该系统还包括将传送管线和杜瓦瓶牢固地保持在一起的联锁机构和连接机构，以允许传送管线牢固地接合低温模块。 该系统还包括控制子系统，该控制子系统监测和控制来自杜瓦瓶和通过输送管线的冷流体的流动。

公开(公告)号：US4869077A

公开(公告)日：1989-09-26

申请号：US88400

申请日：1987-08-21

申请人： John A. Grange ,  Walter Tuzel

发明人： John A. Grange ,  Walter Tuzel

IPC分类号： F25B19/00

CPC分类号： F25B19/005 ,  Y10S285/904

摘要： An improved open-cycle cooling apparatus in which a cooling chamber holding a device to be cooled is coupled with a cold fluid delivery system and, in which the cold fluid delivery system includes a delivery tube which directs a stream of cold fluid to strike the device and a return which vents the expended cold fluid from the cooling chamber. The improvement comprises a rigid enclosure formed within the chamber and configured to adaptively engage one end of the cold fluid delivery tube. The device to be cooled is disposed within the enclosure. The enclosure also includes a return to remove expended cold fluid from the cooling chamber to the return of the cold fluid delivery stystem. The improvement further comprises an alignment guide disposed within the enclosure between the device to be cooled and the one end of the cold fluid delivery tube engaged to the enclosure. The guide is configured to adaptively receive the one end of the cold fluid delivery tube and is disposed to accurately align the stream of cold fluid from the cold fluid delivery tube with the device to be cooled. The guide also permits the cooling chamber to rotate relative to the cold fluid delivery tube to compensate for any angular or twisting motion by the delivery tube.

摘要翻译： 一种改进的开式循环冷却装置，其中保持要冷却的装置的冷却室与冷流体输送系统联接，并且其中冷流体输送系统包括输送管，该输送管引导冷流体流冲击装置 以及从冷却室排出消耗的冷流体的回流。 该改进包括形成在腔室内并被构造成自适应地接合冷流体输送管的一端的刚性外壳。 要冷却的装置设置在外壳内。 外壳还包括将冷却流体从冷却室移除到冷流体输送系统的返回的返回。 该改进还包括设置在待冷却装置和接合到外壳的冷流体输送管的一端之间的壳体内的对准引导件。 引导件被配置为自适应地接收冷流体输送管的一端并且被设置成将来自冷流体输送管的冷流体流与要冷却的装置精确对准。 引导件还允许冷却室相对于冷流体输送管旋转，以补偿输送管的任何角度或扭转运动。

公开(公告)号：US5398863A

公开(公告)日：1995-03-21

申请号：US96693

申请日：1993-07-23

申请人： Gary W. Grube ,  Gaetan Mathieu ,  Jason Sweis ,  John A. Grange

发明人： Gary W. Grube ,  Gaetan Mathieu ,  Jason Sweis ,  John A. Grange

IPC分类号： H01L23/12 ,  B23K20/10 ,  H01L21/60 ,  H05K3/34 ,  B23K31/02

CPC分类号： H01L24/50 ,  B23K20/10 ,  B23K2201/40 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082

摘要： In a semiconductor inner lead bonding process, a connection component having leads is disposed on the chip surface so that the leads lie above the contacts. A bond region of each lead is forced downwardly by a tool into engagement with a contact on the chip while a first or proximal end of the lead remains attached to a dielectric support structure. The lead is deformed into an S-shaped configuration by moving the bonding tool horizontally towards the proximal or first end of the lead, thereby forcing the bonding region towards the first end and bending or buckling the lead. Alternatively, the lead is bent downwardly by a tool and the tool may then be disengaged from the lead, shifted away from the proximal end of the lead and again advanced downwardly to secure the lead to the chip contact.

摘要翻译： 在半导体内引线接合工艺中，具有引线的连接部件设置在芯片表面上，使得引线位于触点上方。 每个引线的接合区域被工具向下压迫与芯片上的接触件接合，而引线的第一或近端保持附接到电介质支撑结构。 通过将接合工具水平地朝向引线的近端或第一端移动，从而将引线变形为S形构造，从而迫使接合区朝向第一端并弯曲或弯曲引线。 或者，引线通过工具向下弯曲，然后工具可以从引线脱离，从引线的近端移开，并再次向前推进以将引线固定到芯片接触。