公开(公告)号：US06632997B2

公开(公告)日：2003-10-14

申请号：US09880277

申请日：2001-06-13

申请人： Paul Robert Hoffman ,  John Armando Miranda

发明人： Paul Robert Hoffman ,  John Armando Miranda

IPC分类号： H01L2328

CPC分类号： H05K5/026

摘要： A personalized circuit module package and method for packaging circuit modules provides graphical packaging for memory modules and other circuit modules. A removable housing is attached to a circuit module containing one or more integrated circuits bonded to a carrier and covered with an encapsulant. Graphics may be printed on the removable housing, or may be printed on an insert that is either inserted into a pocket within the removable housing, or is inserted between a removable housing having a window and the circuit module. Alternatively, the housing itself may be used to personalize the circuit module, by providing a colored or textured removable housing for the circuit module.

摘要翻译： 用于封装电路模块的个性化电路模块封装和方法为存储器模块和其它电路模块提供图形封装。 可拆卸的外壳连接到电路模块，该电路模块包含一个或多个集成电路，该集成电路与载体结合并用密封剂覆盖。 图形可以印刷在可移除的外壳上，或者可以印刷在插入到可移除外壳中的凹槽中的插入件上，或者插入到具有窗口的可移除外壳和电路模块之间。 或者，壳体本身可以用于通过为电路模块提供彩色或纹理可移除的壳体来个性化电路模块。

公开(公告)号：US06603183B1

公开(公告)日：2003-08-05

申请号：US09946750

申请日：2001-09-04

申请人： Paul Robert Hoffman

发明人： Paul Robert Hoffman

IPC分类号： H01L310203

CPC分类号： H01L27/14618 ,  H01L24/73 ,  H01L27/14687 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： An image sensor package includes a substrate and an image sensor mounted to the substrate. Bond pads of the image sensor are wirebonded to interior traces on the substrate by bond wires. An encapsulant encloses the bond wires, the encapsulant being formed of a first optically curable material that has been cured. A lid adhesive mounts a lid to the substrate, the lid adhesive being formed of a second optically curable material that has been cured. During fabrication, the first and second optically curable materials are cured rapidly without heating to form the encapsulant and the lid adhesive, respectively, thus minimizing the fabrication cost of the image sensor package.

摘要翻译： 图像传感器封装包括基板和安装到基板的图像传感器。 图像传感器的接合焊盘通过接合线与衬底上的内部迹线引线键合。 密封剂包封接合线，密封剂由已经固化的第一可光学固化的材料形成。 盖粘合剂将盖子安装到基板上，盖粘合剂由已经固化的第二可光学固化材料形成。 在制造期间，第一和第二光学可固化材料在不加热的情况下被快速固化以分别形成密封剂和盖粘合剂，从而使图像传感器封装的制造成本最小化。

公开(公告)号：US06630661B1

公开(公告)日：2003-10-07

申请号：US10012378

申请日：2001-12-12

申请人： Paul Robert Hoffman

发明人： Paul Robert Hoffman

IPC分类号： H01J4014

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical module includes a window having an interior, e.g., first, surface. The interior surface includes a central region and a peripheral region. A first electronic component is coupled to the peripheral region. The optical module further includes a substrate and an image sensor coupled to the substrate. The window is coupled to the substrate such that the image sensor is aligned with the central region of the window.

摘要翻译： 光学模块包括具有内部例如第一表面的窗口。 内表面包括中心区域和周边区域。 第一电子部件耦合到外围区域。 该光学模块还包括一个衬底和耦合到该衬底的一个图像传感器。 窗口耦合到基板，使得图像传感器与窗口的中心区域对准。

公开(公告)号：US06900527B1

公开(公告)日：2005-05-31

申请号：US09956190

申请日：2001-09-19

申请人： Jeffrey Alan Miks ,  Kenneth Kaskoun ,  Markus Liebhard ,  Donald Craig Foster ,  Paul Robert Hoffman ,  Frederic Bertholio

发明人： Jeffrey Alan Miks ,  Kenneth Kaskoun ,  Markus Liebhard ,  Donald Craig Foster ,  Paul Robert Hoffman ,  Frederic Bertholio

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L23/02 ,  H01L23/04

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.

摘要翻译： 用于在电路模块内互连电路的引线框架方法和组件允许在没有电路板基板的情况下制造电路模块。 集成电路管芯连接到金属引线框架组件，并且管芯互连线被引线接合到引线框架组件上的互连点。 引线框架组件从电路互连平面的延伸提供外部电触头，用于将电路模块连接到插座。

公开(公告)号：US06576998B1

公开(公告)日：2003-06-10

申请号：US10086293

申请日：2002-02-28

申请人： Paul Robert Hoffman

发明人： Paul Robert Hoffman

IPC分类号： H01L2334

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/4828 ,  H01L23/538 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/15151 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Semiconductor packages including at least one semiconductor chip and at least one electronic discrete device, such as a transistor, oscillator, optical sensor, resistor, capacitor, or inductor, are disclosed. The semiconductor chip and the discrete device are electrically coupled to each other, and are encapsulated within a protective encapsulant material. The semiconductor chip and the discrete device are disposed either in an aperture through the substrate or in a pocket of the substrate, thereby allowing for a thin package, even where the discrete device is taller (e.g., 1.5 to 5 times taller) than the semiconductor chip and/or substrate.

摘要翻译： 公开了包括至少一个半导体芯片和至少一个电子分立器件（诸如晶体管，振荡器，光学传感器，电阻器，电容器或电感器）的半导体封装。 半导体芯片和分立器件彼此电耦合，并被封装在保护性密封材料内。 半导体芯片和分立器件设置在通过衬底或衬底的凹槽的孔中，从而允许薄封装，即使分立器件比半导体更高（例如，高1.5至5倍） 芯片和/或基板。

公开(公告)号：US07176062B1

公开(公告)日：2007-02-13

申请号：US11035239

申请日：2005-01-13

申请人： Jeffrey Alan Miks ,  Kenneth Kaskoun ,  Markus Liebhard ,  Donald Craig Foster ,  Paul Robert Hoffman ,  Frederic Bertholio

发明人： Jeffrey Alan Miks ,  Kenneth Kaskoun ,  Markus Liebhard ,  Donald Craig Foster ,  Paul Robert Hoffman ,  Frederic Bertholio

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/02 ,  H01L23/52 ,  H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.

摘要翻译： 用于在电路模块内互连电路的引线框架方法和组件允许在没有电路板基板的情况下制造电路模块。 集成电路管芯连接到金属引线框架组件，并且管芯互连线被引线接合到引线框架组件上的互连点。 引线框架组件从电路互连平面的延伸提供外部电触头，用于将电路模块连接到插座。

公开(公告)号：US06919631B1

公开(公告)日：2005-07-19

申请号：US10771072

申请日：2004-02-02

申请人： Paul Robert Hoffman ,  David Albert Zoba

发明人： Paul Robert Hoffman ,  David Albert Zoba

IPC分类号： H01L23/31 ,  H01L25/065 ,  H01L23/10 ,  H01L23/34

CPC分类号： H01L23/552 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： Semiconductor packages including at least two semiconductor dies are disclosed. A first die is mounted on a substrate, which may be a metallized laminate or a leadframe. A rigid support structure is mounted on the substrate over the first die. The support structure may be thermally coupled to the substrate, and also may be electrically coupled to the substrate. A second die is mounted on the support structure, which spaces the second die away from the first die. Encapsulant fills the volume within the support structure, including the vertical space between the pair of dies. In an alternative package embodiment, a heat spreader formed of a flexible metal sheet may be thermally coupled between the two stacked dies. The heat spreader transfers heat from the first and second dies to a heat sink of the substrate. The support structure and the heat spreader mitigate the transfer of heat between the first and second dies.

摘要翻译： 公开了包括至少两个半导体管芯的半导体封装。 第一管芯安装在基底上，其可以是金属化层压体或引线框架。 刚性支撑结构安装在第一模具上的衬底上。 支撑结构可以热耦合到衬底，并且还可以电耦合到衬底。 第二模具安装在支撑结构上，其使第二模具远离第一模具。 密封剂填充支撑结构内的体积，包括一对模具之间的垂直间隙。 在替代的封装实施例中，由柔性金属片形成的散热器可以热耦合在两个堆叠的管芯之间。 散热器将热量从第一和第二模具传递到衬底的散热器。 支撑结构和散热器减轻了第一和第二模具之间的热传递。

公开(公告)号：US06759266B1

公开(公告)日：2004-07-06

申请号：US09946861

申请日：2001-09-04

申请人： Paul Robert Hoffman

发明人： Paul Robert Hoffman

IPC分类号： H01L2100

CPC分类号： H01L27/14618 ,  H01L23/10 ,  H01L24/48 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of forming an image sensor package includes wire bonding bond pads of an image sensor to interior traces on a substrate with bond wires. A first optically curable material is applied to enclose the bond wires. A second optically curable material is applied between a lid and the substrate. The first and second optically curable materials are cured through the lid with ultraviolet radiation. The first and second optically curable materials are cured rapidly without heating thus minimizing the fabrication cost of the image sensor package.

摘要翻译： 形成图像传感器封装的方法包括图像传感器的引线键合焊盘与具有接合线的衬底上的内部迹线。 施加第一可光学固化的材料以包围接合线。 将第二光学可固化材料施加在盖和基底之间。 第一和第二光学可固化材料通过紫外线辐射固化。 第一和第二光学可固化材料在不加热的情况下快速固化，从而使图像传感器封装的制造成本最小化。

公开(公告)号：US06737750B1

公开(公告)日：2004-05-18

申请号：US10013396

申请日：2001-12-07

申请人： Paul Robert Hoffman ,  David Albert Zoba

发明人： Paul Robert Hoffman ,  David Albert Zoba

IPC分类号： H01L2348

CPC分类号： H01L23/552 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： Semiconductor packages including at least two semiconductor dies are disclosed. A first die is mounted on a substrate, which may be a metallized laminate or a leadframe. A rigid support structure is mounted on the substrate over the first die. The support structure may be thermally coupled to the substrate, and also may be electrically coupled to the substrate. A second die is mounted on the support structure, which spaces the second die away from the first die. Encapsulant fills the volume within the support structure, including the vertical space between the pair of dies. In an alternative package embodiment, a heat spreader formed of a flexible metal sheet may be thermally coupled between the two stacked dies. The heat spreader transfers heat from the first and second dies to a heat sink of the substrate. The support structure and the heat spreader mitigate the transfer of heat between the first and second dies.

摘要翻译： 公开了包括至少两个半导体管芯的半导体封装。 第一管芯安装在基底上，其可以是金属化层压体或引线框架。 刚性支撑结构安装在第一模具上的衬底上。 支撑结构可以热耦合到衬底，并且还可以电耦合到衬底。 第二模具安装在支撑结构上，其使第二模具远离第一模具。 密封剂填充支撑结构内的体积，包括一对模具之间的垂直间隙。 在替代的封装实施例中，由柔性金属片形成的散热器可以热耦合在两个堆叠的管芯之间。 散热器将热量从第一和第二模具传递到衬底的散热器。 支撑结构和散热器减轻了第一和第二模具之间的热传递。