摘要:
A battery structure is provided for making alkali ion and alkaline-earth ion batteries. The battery has a hexacyanometallate cathode, a non-metal anode, and non-aqueous electrolyte. A method is provided for forming the hexacyanometallate battery cathode and non-metal battery anode prior to the battery assembly. The cathode includes hexacyanometallate particles overlying a current collector. The hexacyanometallate particles have the chemical formula A′n′AmM1xM2y(CN)6, and have a Prussian Blue hexacyanometallate crystal structure.
摘要:
Methods are provided for fabricating a solution-processed metal and mixed-metal selenide semiconductor using a selenium (Se) film layer. One aspect provides a conductive substrate and deposits a first Se film layer over the conductive substrate. A first solution, including a first material set of metal salts, metal complexes, or combinations thereof, is dissolved in a solvent and deposited on the first Se film layer. A first intermediate film comprising metal precursors is formed from corresponding members of the first material set. In one aspect, a plurality of intermediate films is formed using metal precursors from the first material set or a different material set. In another aspect, a second Se film layer is formed overlying the intermediate film(s). Thermal annealing is performed in an environment including hydrogen (H2), hydrogen selenide (H2Se), or Se/H2. The metal precursors are transformed in the intermediate film(s), and a metal selenide-containing semiconductor is formed.
摘要:
A solid-state hole transport composite material (ssHTM) is provided. The ssHTM is made from a neutral charge first p-type organic semiconductor, and a chemically oxidized first p-type semiconductor, where the dopants are silver(I) containing materials. A reduced form of the silver(I) containing material is also retained as functional component in the ssHTM. In one aspect, the silver(I) containing material is silver bis(trifluoromethanesulfonyl)imide (TFSI). In another aspect, the first p-type organic semiconductor is 2,2′,7,7′-tetrakis(N,N-di-p-methoxyphenylamine)-9,9′-spirobifluorene (Spiro-OMeTAD). In one variation, the ssHTM additionally includes a first p-type organic semiconductor doped with an ionic dopant such as lithium (Li+), sodium (Na+), potassium (K+), or combinations of the above-mentioned materials. Also provided are a method for synthesizing the above-described ssHTM, and a solid-state dye solar cell (ssDSC) fabricated from the ssHTM.
摘要:
A method is provided for forming a metal-ion battery electrode with large interstitial spacing. A working electrode with hexacyanometallate particles overlies a current collector. The hexacyanometallate particles have a chemical formula AmM1xM2y(CN)6·zH2O, and have a Prussian Blue hexacyanometallate crystal structure, where A is either alkali or alkaline-earth cations. M1 and M2 are metals with 2+ or 3+ valance positions. The working electrode is soaked in an organic first electrolyte including a salt including alkali or alkaline earth cations. A first electric field is created in the first electrolyte between the working electrode and a first counter electrode, causing A cations and water molecules to he simultaneously removed from interstitial spaces in the Prussian Blue hexacyanometallate crystal structure, forming hexacyanometallate particles having the chemical formula of Am′mM1xM2y(CN)6·z′H2O, where m′
摘要:
A back contact solar cell with organic semiconductor heterojunctions is provided. The substrate is made from silicon lightly doped with a first dopant type having a first majority carrier. A second semiconductor layer is formed overlying the texturized substrate topside, made from hydrogenated amorphous silicon (a-Si:H) and doped with the first dopant. An antireflective coating is formed overlying the second semiconductor layer. A third semiconductor layer is formed overlying the first semiconductor substrate backside, made from intrinsic a-Si:H. First and second majority carrier type organic semiconductor layers are formed overlying the third semiconductor layer in patterns. A dielectric organic semiconductor layer is formed overlying the first majority carrier type organic semiconductor layer and the second majority carrier type organic semiconductor layer, filling the spaces in the pattern. A first metal grid is connected to first organic semiconductor contact regions and a second metal grid is connected to the second organic semiconductor contact regions.
摘要:
A germanium (Ge) photodiode array on a glass substrate is provided with a corresponding fabrication method. A Ge substrate is provided that is either not doped or lightly doped with a first dopant. The first dopant can be either an n or p type dopant. A first surface of the Ge substrate is moderately doped with the first dopant and bonded to a glass substrate top surface. Then, a first region of a Ge substrate second surface is heavily doped with the first dopant. A second region of the Ge substrate second surface is heavily doped with a second dopant, having the opposite electron affinity than the first dopant, forming a pn junction. An interlevel dielectric (ILD) layer is formed overlying the Ge substrate second surface and contact holes are etched in the ILD layer overlying the first and second regions of the Ge substrate second surface. The contact holes are filled with metal and metal pads are formed overlying the contact holes.
摘要:
A CMOS active pixel sensor includes a silicon-on-insulator substrate having a silicon substrate with an insulator layer formed thereon and a top silicon layer formed on the insulator layer. A stacked pixel sensor cell includes a bottom photodiode fabricated on the silicon substrate, for sensing light of a longest wavelength; a middle photodiode fabricated on the silicon substrate, for sensing light of a medium wavelength, which is stacked above the bottom photodiode; and a top photodiode fabricated on the top silicon layer, for sensing light of a shorter wavelength, which is stacked above the middle and bottom photodiodes. Pixel transistor sets are fabricated on the top silicon layer and are associated with each pixel sensor cell by electrical connections which extend between each of the photodiodes and respective pixel transistor(s). CMOS control circuitry is fabricated adjacent to an array of active pixel sensor cells and electrically connected thereto.
摘要:
A silicon (Si)-on-insulator (SOI) high voltage transistor with a body ground is provided with an associated fabrication process. The method provides a SOI substrate with a buried oxide (BOX) layer and a Si top layer having a first thickness and a second thickness, greater than the first thickness. A body ground is formed in the second thickness of Si top layer overlying the BOX layer. A control channel is formed in the first thickness of the Si top layer. A control gate is formed overlying the control channel. An auxiliary channel is formed in the second thickness of Si top layer partially overlying the body ground and extending into the first thickness of the Si top layer. An auxiliary gate is formed overlying the auxiliary channel. A pn junction is formed in the second thickness of Si top layer between the auxiliary channel and the body ground.
摘要:
A complementary metal oxide semiconductor (CMOS) imager flush reset circuit is provided. The flush reset circuit has an interface to receive first (e.g., VDD) and second (e.g., ground) reference voltages. The flush reset circuit has a solitary (flush) signal interface. There is also an interface connected to a transistor set power interface to supply a Vflush1 signal at least one threshold voltage different than the second reference voltage, in response to receiving a flush signal. The flush signal is used to create a CMOS imager hard reset prior to a soft reset.
摘要:
A full color complementary metal oxide semiconductor (CMOS) imaging circuit is provided. The imaging circuit comprises an array of photodiodes including a plurality of pixel groups. Each pixel group supplies 3 electrical color signals, corresponding to 3 detectable colors. The circuit also includes a color filter array overlying the photodiode array employing less than 3 separate filter colors. Each pixel group may be enabled as a dual-pixel including a single photodiode (PD) to supply a first color signal and stacked PDs to supply a second and third color signal. In one aspect, the color filter array employs 1 filter color per pixel group. In another aspect, the color filter array employees 2 filter colors per pixel group. In either aspect, the color filter array forms a checkerboard pattern of color filter pixels. For example, a magenta color filter may overlie the stacked PDs of each dual-pixel, to name one variation.