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公开(公告)号：US07221045B2
公开(公告)日：2007-05-22
申请号：US11133613
申请日：2005-05-20
申请人： Kwang-suk Park , Jung-do Kim
发明人： Kwang-suk Park , Jung-do Kim
IPC分类号： H01L23/495
CPC分类号： H01L23/49582 , H01L23/49548 , H01L24/81 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05572 , H01L2224/05639 , H01L2224/05647 , H01L2224/05671 , H01L2224/13111 , H01L2224/16 , H01L2224/16245 , H01L2224/81024 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/00 , H01L2924/00014
摘要： A flip chip semiconductor device having an improved structure and a method of manufacturing the flip chip semiconductor device, in which a semiconductor chip can be more securely joined to a lead frame while preventing contact defects between the two. The flip chip semiconductor device includes: a semiconductor chip having electrode pads formed on one side; conductive bumps formed on the electrode pads of the semiconductor chip; and a lead frame including a plurality of leads, the ends of which are electrically connected to the conductive bumps, wherein each of the leads has at least one groove formed thereon, and a solder plating layer is provided on the leads in and about the groove and melted to secure the connection with the conductive bumps.
摘要翻译： 具有改进的结构的倒装芯片半导体器件和制造倒装芯片半导体器件的方法，其中半导体芯片可以更牢固地接合到引线框架，同时防止两者之间的接触缺陷。 所述倒装芯片半导体器件包括：具有形成在一侧的电极焊盘的半导体芯片; 形成在半导体芯片的电极焊盘上的导电凸块; 以及引线框架，其包括多个引线，其端部电连接到所述导电凸块，其中每个所述引线具有形成在其上的至少一个沟槽，并且在所述引线中并且围绕所述沟槽设置焊料镀层 并熔化以固定与导电凸块的连接。
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公开(公告)号：US20060049517A1
公开(公告)日：2006-03-09
申请号：US11133613
申请日：2005-05-20
申请人： Kwang-suk Park , Jung-do Kim
发明人： Kwang-suk Park , Jung-do Kim
CPC分类号： H01L23/49582 , H01L23/49548 , H01L24/81 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05572 , H01L2224/05639 , H01L2224/05647 , H01L2224/05671 , H01L2224/13111 , H01L2224/16 , H01L2224/16245 , H01L2224/81024 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/00 , H01L2924/00014
摘要： A flip chip semiconductor device having an improved structure and a method of manufacturing the flip chip semiconductor device, in which a semiconductor chip can be more securely joined to a lead frame while preventing contact defects between the two. The flip chip semiconductor device includes: a semiconductor chip having electrode pads formed on one side; conductive bumps formed on the electrode pads of the semiconductor chip; and a lead frame including a plurality of leads, the ends of which are electrically connected to the conductive bumps, wherein each of the leads has at least one groove formed thereon, and a solder plating layer is provided on the leads in and about the groove and melted to secure the connection with the conductive bumps.
摘要翻译： 具有改进的结构的倒装芯片半导体器件和制造倒装芯片半导体器件的方法，其中半导体芯片可以更牢固地接合到引线框架，同时防止两者之间的接触缺陷。 所述倒装芯片半导体器件包括：具有形成在一侧的电极焊盘的半导体芯片; 形成在半导体芯片的电极焊盘上的导电凸块; 以及引线框架，其包括多个引线，其端部电连接到所述导电凸块，其中每个所述引线具有形成在其上的至少一个沟槽，并且在所述引线中并且围绕所述沟槽设置焊料镀层 并熔化以固定与导电凸块的连接。
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公开(公告)号：US20060049493A1
公开(公告)日：2006-03-09
申请号：US11134138
申请日：2005-05-20
申请人： Soo-bong Lee , Jung-Do Kim , Woo-suk Choi , Eun-hee Kim
发明人： Soo-bong Lee , Jung-Do Kim , Woo-suk Choi , Eun-hee Kim
IPC分类号： H01L23/495
CPC分类号： H01L24/85 , H01L23/4951 , H01L23/49524 , H01L23/49537 , H01L23/49582 , H01L24/48 , H01L2224/0401 , H01L2224/05599 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/16 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/484 , H01L2224/73215 , H01L2224/73265 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01028 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2224/78 , H01L2224/45099 , H01L2924/00012
摘要： Provided is a lead frame having an improved wire bonding property of inner leads and an improved soldering property of outer leads and preventing defects with high producing yield, and a method of manufacturing the lead frame. The lead frame includes a plurality of inner leads formed with predetermined intervals between them; and a plurality of outer leads extended from the inner leads in length directions of the inner leads, each of which has an end portion overlapped with the inner lead and coupled thereto and the other end connected to neighboring outer lead by a supporting portion.
摘要翻译： 提供一种引线框架，其具有改善的内引线的引线接合性能和改善的外引线的焊接性能，并且防止产率高的缺陷，以及制造引线框架的方法。 引线框架包括在它们之间以预定间隔形成的多个内引线; 以及从所述内引线在所述内引线的长度方向上延伸的多个外引线，所述多个外引线具有与所述内引线重叠并与其连接的端部，并且另一端通过支撑部连接到相邻的外引线。
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公开(公告)号：US07541664B2
公开(公告)日：2009-06-02
申请号：US11134138
申请日：2005-05-20
申请人： Soo-bong Lee , Jung-Do Kim , Woo-suk Choi , Eun-hee Kim
发明人： Soo-bong Lee , Jung-Do Kim , Woo-suk Choi , Eun-hee Kim
IPC分类号： H01L23/495
CPC分类号： H01L24/85 , H01L23/4951 , H01L23/49524 , H01L23/49537 , H01L23/49582 , H01L24/48 , H01L2224/0401 , H01L2224/05599 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/16 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/484 , H01L2224/73215 , H01L2224/73265 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01028 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2224/78 , H01L2224/45099 , H01L2924/00012
摘要： Provided is a lead frame having an improved wire bonding property of inner leads and an improved soldering property of outer leads and preventing defects with high producing yield, and a method of manufacturing the lead frame. The lead frame includes a plurality of inner leads formed with predetermined intervals between them; and a plurality of outer leads extended from the inner leads in length directions of the inner leads, each of which has an end portion overlapped with the inner lead and coupled thereto and the other end connected to neighboring outer lead by a supporting portion.
摘要翻译： 提供一种引线框架，其具有改善的内引线的引线接合性能和改善的外引线的焊接性能，并且防止产率高的缺陷，以及制造引线框架的方法。 引线框架包括在它们之间以预定间隔形成的多个内引线; 以及从所述内引线在所述内引线的长度方向上延伸的多个外引线，所述多个外引线具有与所述内引线重叠并与其连接的端部，并且另一端通过支撑部连接到相邻的外引线。
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