Abstract:
The semiconductor device is provided with an element isolating region disposed in a matrix to define a channel region on a semiconductor substrate, gate interconnection layers extending in a direction and disposed at predetermined intervals from each other above element isolating region, and aluminum interconnection layers extending in a direction intersecting gate interconnection layers and disposed at predetermined intervals from each other, aluminum interconnection layer being disposed above element isolating region. Thus, it becomes possible to provide a semiconductor device and a method of manufacturing thereof which enable the reduction in time required for the final manufacturing steps of the semiconductor device after the ROM specifications are determined.
Abstract:
A brake fluid pressure control apparatus for a vehicle includes a parameter calculation unit configured to calculate a rollover detection parameter; and a steering maneuver determination unit configured to determine whether an abrupt steering maneuver is made. The parameter calculation unit is configured to calculate a first composition roll angle as the rollover detection parameter, by combining at a predetermined weight assignment ratio a first roll angle equivalent to an actual roll angle with a second roll angle obtained using a parameter which changes with a phase earlier than the first roll angle, and to calculate the first composition roll angle by changing the weight assignment ratio such that a weight of the second roll angle is higher when the steering maneuver determination unit determines that an abrupt steering maneuver is made than when the steering maneuver determination unit determines that the abrupt steering maneuver is not made.
Abstract:
A movement stabilizing control ECU 25 includes a differential unit 25a, a cycle calculation unit 25b, a time constant/gain setting portion 25c, a first-order lag processing unit 25d, a pendulum movement detection unit 25e, a control amount calculation portion 25f and a control amount output unit 25g. The time constant/gain setting portion 25c sets a time constant τ and a gain K used at the time of subjecting a yaw acceleration ω′ which is a time-differential value of a yaw rate ω to the first-order lag processing at the first-order lag processing unit 25d, with reference to a function or data of a look-up table, for example, depending on the cycle or the frequency of the yaw acceleration ω′ due to the pendulum movement. The control amount calculation portion 25f multiplies the amplitude of a yaw acceleration ωd′ outputted from the first-order lag processing unit 25d by a predetermined constant to calculate a yaw control amount with a phase in opposite to that of the yaw acceleration ωd′ and outputs the yaw control amount to the control amount output unit 25g.
Abstract:
A single chip microcomputer as a semiconductor device comprises CMOS logic portion and a driver portion operating at a high voltage which can be connected to an external device. In the region of the CMOS logic portion, a P type well layer and an N type well layer are formed on a P type silicon substrate. An N type well layer is formed in the region constituting the driver portion. The junction depth of the N type well layer constituting the driver portion is made deeper than that of the N type well layer constituting the CMOS logic portion. A MOS transistor is formed in the region of each well layer in the CMOS logic portion. A MOS transistor whose drain breakdown voltage is increased is formed in the region of the N type well layer of the driver portion. The junction depth of the N type well layer is made deeper than that of the N type well layer constituting the CMOS logic portion at least below the drain region of this MOS transistor. The MOS transistor constituting the CMOS logic portion operates at a lower voltage while the MOS transistor constituting the driver portion operates at a higher voltage in order to drive external devices such as a fluorescent display tube connected thereto.
Abstract:
The semiconductor device is of high break down voltage type and has a source, drain and a gate deposited therebetween on the semiconductor substrate. The gate oxide film has a thick portion and below that portion, a doped layer as a drain is provided with two layers having different impurity concentration.
Abstract:
A movement stabilizing control ECU 25 includes a differential unit 25a, a cycle calculation unit 25b, a time constant/gain setting portion 25c, a first-order lag processing unit 25d, a pendulum movement detection unit 25e, a control amount calculation portion 25f and a control amount output unit 25g. The time constant/gain setting portion 25c sets a time constant τ and a gain K used at the time of subjecting a yaw acceleration ω′ which is a time-differential value of a yaw rate ω to the first-order lag processing at the first-order lag processing unit 25d, with reference to a function or data of a look-up table, for example, depending on the cycle or the frequency of the yaw acceleration ω′ due to the pendulum movement. The control amount calculation portion 25f multiplies the amplitude of a yaw acceleration ωd′ outputted from the first-order lag processing unit 25d by a predetermined constant to calculate a yaw control amount with a phase in opposite to that of the yaw acceleration ωd′ and outputs the yaw control amount to the control amount output unit 25g.
Abstract:
In a MOS type LSI comprising an n channel-open-drain-transistor capable of connecting with an analog IC driven by a high voltage, a surge breakdown voltage and a drain breakdown voltage of the open-drain-transistor is increased, and hence the reliability is increased. An n channel-open-drain-transistor includes a ring-shaped gate electrode and a drain region. A drain region is surrounded by a gate electrode. Drain region includes an n.sup.- region and an n.sup.+ region. An n channel MOS transistor includes a gate electrode and a drain region. Drain region includes an n.sup.- region and an n.sup.+ region. An impurity concentration of n.sup.- drain region of the n channel-open-drain-transistor is higher than an impurity concentration of n.sup.- drain region of the n channel MOS transistor.
Abstract:
Disclosed is a structure of a semiconductor device in which an internal circuit including a memory device and a transistor having an LDD structure and an input protection device for protecting the internal circuit are formed on one semiconductor substrate, and a method of manufacturing such a semiconductor device. The input protection device and the memory device are formed at the same time. The input protection device as well as the memory device includes source/drain regions formed of high concentration inpurity regions and formed in the surface of the semiconductor substrate, and a gate electrode formed of a plurality of conductor films and formed on the surface of the semiconductor substrate between the source/drain regions. When an abnormal voltage is applied to an interconnection for supplying an electrical signal to the internal circuit, a charge flows from the interconnection through one source/drain region of the input protection device into the semiconductor substrate, so that the internal circuit is protected against an excessive charge.
Abstract:
An MIS FET has an off-set gate structure in which a gate electrode and a drain region. The drain region is formed of an n type impurity region of a high concentration and has a pn junction region provided between the drain region and the p type silicon substrate. Further, n type impurity regions of the low concentration are in contact with a part of a peripheral portion of the n type impurity regions of the high concentration. The n type impurity regions of the low concentration alleviate the concentration of the electric field near the drain region to increase the drain breakdown voltage. The pn junction region of the n type impurity region of the high concentration and the p type silicon substrate increases a junction capacitance of the entire drain region, increases a surge current discharged to the substrate side from the drain region for the surge breakdown to increase the surge withstanding amount.
Abstract:
Disclosed is a structure of a semiconductor device in which an internal circuit including a memory device and a transistor having an LDD structure, and an input protection device for protecting the internal circuit are formed on one semiconductor substrate, and a method of manufacturing such a semiconductor device. The input protection device and the memory device are formed at the same time. The input protection device as well as the memory device includes source/drain regions formed of high concentration impurity regions and formed in the surface of the semiconductor substrate, and a gate electrode formed of a plurality of conductor films and formed on the surface of the semiconductor substrate between the source/drain regions. When an abnormal voltage is applied to an interconnection for supplying an electrical signal to the internal circuit, a charge flows from the interconnection through one source/drain region of the input protection device into the semiconductor substrate, so that the internal circuit is protected against an excessive charge.