KIT FOR OPTICAL SEMICONDUCTOR ENCAPSULATION
    2.
    发明申请
    KIT FOR OPTICAL SEMICONDUCTOR ENCAPSULATION 审中-公开
    光学半导体封装套件

    公开(公告)号:US20110079929A1

    公开(公告)日:2011-04-07

    申请号:US12898897

    申请日:2010-10-06

    IPC分类号: H01L23/28 C09K11/02

    摘要: The present invention relates to a kit for optical semiconductor encapsulation including a liquid first encapsulating material containing inorganic particles and a liquid second encapsulating material containing a phosphor; a kit for optical semiconductor encapsulation including a sheet-shaped first encapsulating material containing inorganic particles and a liquid second encapsulating material containing a phosphor; and a kit for optical semiconductor encapsulation including a liquid first encapsulating material containing inorganic particles and a sheet-shaped second encapsulating material containing a phosphor.

    摘要翻译: 本发明涉及一种用于光学半导体封装的套件,其包括含有无机颗粒的液体第一包封材料和含有磷光体的液体第二封装材料; 一种用于光学半导体封装的套件,包括含有无机颗粒的片状第一包封材料和含有磷光体的液体第二封装材料; 以及用于光学半导体封装的套件,其包括含有无机颗粒的液体第一包封材料和含有磷光体的片状第二包封材料。

    OPTICAL-SEMICONDUCTOR ENCAPSULATING MATERIAL
    7.
    发明申请
    OPTICAL-SEMICONDUCTOR ENCAPSULATING MATERIAL 审中-公开
    光学半导体封装材料

    公开(公告)号:US20110079816A1

    公开(公告)日:2011-04-07

    申请号:US12898949

    申请日:2010-10-06

    IPC分类号: H01L33/52 H01L23/28

    摘要: The present invention relates to a sheet-shaped optical-semiconductor encapsulating material including: a first resin layer containing inorganic particles; and a second resin layer containing a phosphor and being superposed directly or indirectly on the first resin layer, and relates to a kit for optical-semiconductor encapsulation including: a sheet-shaped molded body including a first resin layer containing inorganic particles; and a sheet-shaped molded body including a second resin layer containing a phosphor.

    摘要翻译: 本发明涉及一种片状光半导体封装材料,其包括:含有无机颗粒的第一树脂层; 以及包含荧光体并且直接或间接叠置在第一树脂层上的第二树脂层,并且涉及一种用于光学半导体封装的套件,包括:包括含有无机颗粒的第一树脂层的片状成型体; 以及包含含有荧光体的第二树脂层的片状成型体。