公开(公告)号：US07601286B2

公开(公告)日：2009-10-13

申请号：US10107933

申请日：2002-03-26

Applicant: William Benett ,  Peter Krulevitch ,  Mariam Maghribi ,  Julie Hamilton ,  Klint Rose ,  Amy W. Wang

Inventor： William Benett ,  Peter Krulevitch ,  Mariam Maghribi ,  Julie Hamilton ,  Klint Rose ,  Amy W. Wang

IPC: B29C33/76

CPC classification number: B29C39/10 ,  B29C33/3842 ,  B29C39/34 ,  B29K2083/00 ,  B29K2083/005 ,  B29L2031/24 ,  B29L2031/756

Abstract: A method of forming a polymer-based microfluidic system platform using network building blocks selected from a set of interconnectable network building blocks, such as wire, pins, blocks, and interconnects. The selected building blocks are interconnectably assembled and fixedly positioned in precise positions in a mold cavity of a mold frame to construct a three-dimensional model construction of a microfluidic flow path network preferably having meso-scale dimensions. A hardenable liquid, such as poly (dimethylsiloxane) is then introduced into the mold cavity and hardened to form a platform structure as well as to mold the microfluidic flow path network having channels, reservoirs and ports. Pre-fabricated elbows, T's and other joints are used to interconnect various building block elements together. After hardening the liquid the building blocks are removed from the platform structure to make available the channels, cavities and ports within the platform structure. Microdevices may be embedded within the cast polymer-based platform, or bonded to the platform structure subsequent to molding, to create an integrated microfluidic system. In this manner, the new microfluidic platform is versatile and capable of quickly generating prototype systems, and could easily be adapted to a manufacturing setting.

公开(公告)号：US20120273359A1

公开(公告)日：2012-11-01

申请号：US13405088

申请日：2012-02-24

Applicant: Matthew E. Suss ,  Theodore F. Baumann ,  William L. Bourcier ,  Christopher Spadaccini ,  Michael Stadermann ,  Klint Rose ,  Juan G. Santiago

Inventor： Matthew E. Suss ,  Theodore F. Baumann ,  William L. Bourcier ,  Christopher Spadaccini ,  Michael Stadermann ,  Klint Rose ,  Juan G. Santiago

IPC: B03C9/00

CPC classification number: B03C9/00 ,  B03C2201/10 ,  C02F1/4691 ,  C02F2001/46138 ,  C02F2103/08

Abstract: An electrode “flow-through” capacitive desalination system wherein feed water is pumped through the pores of a pair of monolithic porous electrodes separated by an ultrathin non-conducting porous film. The pair of monolithic porous electrodes are porous conductors made of a material such as activated carbon aerogel. The feed water flows through the electrodes and the spacing between electrodes is on the order 10 microns.

Abstract translation: 一种电极流通电容式脱盐系统，其中给水被泵送通过由超薄非导电多孔膜隔开的一对单片多孔电极的孔隙。 一对整体多孔电极是由诸如活性炭气凝胶的材料制成的多孔导体。 供水流过电极，电极间的间距为10微米。

公开(公告)号：US20060113537A1

公开(公告)日：2006-06-01

申请号：US11326967

申请日：2006-01-05

Applicant: Peter Krulevitch ,  Mariam Maghribi ,  William Benett ,  Julie Hamilton ,  Klint Rose ,  James Davidson ,  Mark Strauch

Inventor： Peter Krulevitch ,  Mariam Maghribi ,  William Benett ,  Julie Hamilton ,  Klint Rose ,  James Davidson ,  Mark Strauch

IPC: H01L31/0376

CPC classification number: H01L25/165 ,  B81C1/0023 ,  H01L21/6835 ,  H01L31/048 ,  H01L31/0543 ,  H01L2221/68345 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/19105 ,  Y02E10/52 ,  H01L2924/00

Abstract: A peel and stick electronic system comprises a silicone body, and at least one electronic unit operatively connected to the silicone body. The electronic system is produce by providing a silicone layer on a substrate, providing a metal layer on the silicone layer, and providing at least one electronic unit connected to the metal layer.

公开(公告)号：US20050030698A1

公开(公告)日：2005-02-10

申请号：US10939771

申请日：2004-09-13

Applicant: Peter Krulevitch ,  Mariam Maghribi ,  William Benett ,  Julie Hamilton ,  Klint Rose ,  James Davidson ,  Mark Strauch

Inventor： Peter Krulevitch ,  Mariam Maghribi ,  William Benett ,  Julie Hamilton ,  Klint Rose ,  James Davidson ,  Mark Strauch

IPC: A61N1/04 ,  A61N1/05 ,  H01L23/538 ,  H01L25/065 ,  H05K1/00 ,  H05K1/03 ,  H01G4/30

CPC classification number: A61N1/0456 ,  A61B2560/0412 ,  A61N1/0452 ,  A61N1/0476 ,  A61N1/0492 ,  A61N1/05 ,  A61N1/0534 ,  H01L23/5387 ,  H01L25/065 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0313 ,  H05K1/0393 ,  H05K2201/0162 ,  H05K2201/09118 ,  H01L2924/00

Abstract: A peel and stick electronic system comprises a silicone body, and at least one electronic unit operatively connected to the silicone body. The electronic system is produce by providing a silicone layer on a substrate, providing a metal layer on the silicone layer, and providing at least one electronic unit connected to the metal layer.

Abstract translation: 剥离和粘贴电子系统包括硅树脂体和至少一个可操作地连接到硅氧烷体的电子单元。 该电子系统是通过在衬底上提供硅树脂层，在硅树脂层上提供金属层，并提供至少一个与金属层连接的电子单元来制造的。