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公开(公告)号：US07742313B2
公开(公告)日：2010-06-22
申请号：US11416740
申请日：2006-05-03
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/85 , H01L25/50 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/13147 , H01L2224/16148 , H01L2224/32225 , H01L2224/48091 , H01L2224/48149 , H01L2224/48227 , H01L2224/48235 , H01L2224/4846 , H01L2224/48464 , H01L2224/48471 , H01L2224/48479 , H01L2224/48496 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/85051 , H01L2224/85951 , H01L2224/85986 , H01L2225/0651 , H01L2225/06513 , H01L2225/0652 , H01L2225/06527 , H01L2225/06541 , H01L2225/06548 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , Y10T29/49144 , Y10T29/49149 , H01L2224/85186 , H01L2924/00 , H01L2224/05599 , H01L2224/4554 , H01L2224/45099 , H01L2924/00012 , H01L2224/85399
摘要： Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.
摘要翻译： 公开了堆叠的微特征装置和相关的制造方法。 根据一个实施例的封装包括具有彼此面对的相应的第一和第二接合焊盘表面的第一和第二微特征器件。 第一接合焊盘可以至少靠近第一接合焊盘表面定位，并且第二接合焊盘可以至少靠近第二接合焊盘表面定位。 包装连接部位可以在第一微型装置和包装外部的部件之间提供电连通。 引线键可以耦合在第一接合焊盘和封装连接位置中的至少一个上，并且导电链路可以耦合在第一微功能设备和第二微功能设备的至少一个第二接合焊盘之间。 因此，第一微功能设备可以形成到第二微功能设备的电连接的一部分。
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公开(公告)号：US07071421B2
公开(公告)日：2006-07-04
申请号：US10651912
申请日：2003-08-29
IPC分类号： H05K7/06 , H01L23/488 , H01L23/49
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/85 , H01L25/50 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/13147 , H01L2224/16148 , H01L2224/32225 , H01L2224/48091 , H01L2224/48149 , H01L2224/48227 , H01L2224/48235 , H01L2224/4846 , H01L2224/48464 , H01L2224/48471 , H01L2224/48479 , H01L2224/48496 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/85051 , H01L2224/85951 , H01L2224/85986 , H01L2225/0651 , H01L2225/06513 , H01L2225/0652 , H01L2225/06527 , H01L2225/06541 , H01L2225/06548 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , Y10T29/49144 , Y10T29/49149 , H01L2224/85186 , H01L2924/00 , H01L2224/05599 , H01L2224/4554 , H01L2224/45099 , H01L2924/00012 , H01L2224/85399
摘要： Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.
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公开(公告)号：US08400780B2
公开(公告)日：2013-03-19
申请号：US12820704
申请日：2010-06-22
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/85 , H01L25/50 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/13147 , H01L2224/16148 , H01L2224/32225 , H01L2224/48091 , H01L2224/48149 , H01L2224/48227 , H01L2224/48235 , H01L2224/4846 , H01L2224/48464 , H01L2224/48471 , H01L2224/48479 , H01L2224/48496 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/85051 , H01L2224/85951 , H01L2224/85986 , H01L2225/0651 , H01L2225/06513 , H01L2225/0652 , H01L2225/06527 , H01L2225/06541 , H01L2225/06548 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , Y10T29/49144 , Y10T29/49149 , H01L2224/85186 , H01L2924/00 , H01L2224/05599 , H01L2224/4554 , H01L2224/45099 , H01L2924/00012 , H01L2224/85399
摘要： Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.
摘要翻译： 公开了堆叠的微特征装置和相关的制造方法。 根据一个实施例的封装包括具有彼此面对的相应的第一和第二接合焊盘表面的第一和第二微特征器件。 第一接合焊盘可以至少靠近第一接合焊盘表面定位，并且第二接合焊盘可以至少靠近第二接合焊盘表面定位。 包装连接部位可以在第一微型装置和包装外部的部件之间提供电连通。 引线键可以耦合在第一接合焊盘和封装连接位置中的至少一个上，并且导电链路可以耦合在第一微功能设备和第二微功能设备的至少一个第二接合焊盘之间。 因此，第一微功能设备可以形成到第二微功能设备的电连接的一部分。
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公开(公告)号：US20100258939A1
公开(公告)日：2010-10-14
申请号：US12820704
申请日：2010-06-22
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/85 , H01L25/50 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/13147 , H01L2224/16148 , H01L2224/32225 , H01L2224/48091 , H01L2224/48149 , H01L2224/48227 , H01L2224/48235 , H01L2224/4846 , H01L2224/48464 , H01L2224/48471 , H01L2224/48479 , H01L2224/48496 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/85051 , H01L2224/85951 , H01L2224/85986 , H01L2225/0651 , H01L2225/06513 , H01L2225/0652 , H01L2225/06527 , H01L2225/06541 , H01L2225/06548 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , Y10T29/49144 , Y10T29/49149 , H01L2224/85186 , H01L2924/00 , H01L2224/05599 , H01L2224/4554 , H01L2224/45099 , H01L2924/00012 , H01L2224/85399
摘要： Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.
摘要翻译： 公开了堆叠的微特征装置和相关的制造方法。 根据一个实施例的封装包括具有彼此面对的相应的第一和第二接合焊盘表面的第一和第二微特征器件。 第一接合焊盘可以至少靠近第一接合焊盘表面定位，并且第二接合焊盘可以至少靠近第二接合焊盘表面定位。 包装连接部位可以在第一微型装置和包装外部的部件之间提供电连通。 引线键可以耦合在第一接合焊盘和封装连接位置中的至少一个上，并且导电链路可以耦合在第一微特征器件和第二微特征器件的至少一个第二接合焊盘之间。 因此，第一微功能设备可以形成到第二微功能设备的电连接的一部分。
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