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公开(公告)号：US08413324B2
公开(公告)日：2013-04-09
申请号：US12757157
申请日：2010-04-09
申请人： Kota Noda , Tsutomu Yamauchi , Satoru Kawai
发明人： Kota Noda , Tsutomu Yamauchi , Satoru Kawai
IPC分类号： H01K3/10
CPC分类号： H05K1/115 , H05K1/0269 , H05K3/0032 , H05K3/0038 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K2201/09254 , H05K2201/09563 , H05K2201/09827 , H05K2201/09845 , H05K2201/09918 , H05K2203/0554 , H05K2203/1572 , H05K2203/166
摘要： A method for manufacturing a double-sided circuit board includes preparing a substrate having the first and second surfaces, forming a first hole having a first opening with a diameter R1 on the first surface of the substrate, forming a second hole having a second opening with a diameter R2 on the second surface of the substrate, forming a third hole having a diameter smaller than R1 and/or R2 and connecting the first and second holes such that a penetrating hole formed of the first hole, the second hole and the third hole is formed in the substrate, forming a first conductive circuit on the first surface of the substrate, forming a second conductive circuit on the second surface of the substrate, and filling the penetrating hole with conductive material such that a through-hole conductor electrically connecting the first conductive circuit and the second conductive circuit is formed.
摘要翻译： 一种制造双面电路板的方法包括制备具有第一和第二表面的基板，在基板的第一表面上形成具有直径为R1的第一开口的第一孔，形成具有第二开口的第二孔， 在所述基板的第二表面上的直径R2，形成直径小于R1和/或R2的第三孔，并且连接所述第一孔和所述第二孔，使得由所述第一孔，所述第二孔和所述第三孔形成的穿透孔 形成在基板上，在基板的第一表面上形成第一导电电路，在基板的第二表面上形成第二导电电路，并用导电材料填充该贯穿孔，使得通孔导体将 形成第一导电电路和第二导电电路。
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公开(公告)号：US20100307809A1
公开(公告)日：2010-12-09
申请号：US12757163
申请日：2010-04-09
申请人： Kota NODA , Tsutomu YAMAUCHI
发明人： Kota NODA , Tsutomu YAMAUCHI
CPC分类号： H05K1/115 , H05K1/0269 , H05K3/0032 , H05K3/0038 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K2201/09563 , H05K2201/09827 , H05K2201/09845 , H05K2201/09918 , H05K2203/0554 , H05K2203/1572 , H05K2203/166 , Y10T29/49124 , Y10T29/49155 , Y10T29/49165
摘要： A wiring board having a penetrating hole formed by forming holes with different shapes from both surfaces of a substrate. In such a penetrating hole, the depth of a first opening portion formed in the first-surface side of the substrate is shallower than the depth of a second opening portion formed in the second-surface side, and the diameter of a first opening is greater than the diameter of a second opening. Even if the gravity line of the first opening portion and the gravity line of the second opening portion are shifted from each other, the region of the second opening portion inserted into the inner space of the first opening portion may be made larger.
摘要翻译： 一种布线板，具有通过从基板的两个表面形成具有不同形状的孔而形成的贯通孔。 在这样的贯通孔中，形成在基板的第一表面侧的第一开口部的深度比形成在第二表面侧的第二开口部的深度浅，第一开口的直径更大 比第二开口的直径。 即使第一开口部分的重力线和第二开口部分的重力线彼此偏移，可以使插入第一开口部分的内部空间的第二开口部分的区域更大。
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公开(公告)号：US08925192B2
公开(公告)日：2015-01-06
申请号：US12757163
申请日：2010-04-09
申请人： Kota Noda , Tsutomu Yamauchi
发明人： Kota Noda , Tsutomu Yamauchi
CPC分类号： H05K1/115 , H05K1/0269 , H05K3/0032 , H05K3/0038 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K2201/09563 , H05K2201/09827 , H05K2201/09845 , H05K2201/09918 , H05K2203/0554 , H05K2203/1572 , H05K2203/166 , Y10T29/49124 , Y10T29/49155 , Y10T29/49165
摘要： A method for manufacturing printed wiring board includes irradiating laser on first surface of substrate such that first opening portion having first opening on the first surface and inner diameter decreasing toward the second surface is formed, irradiating laser on second surface of the substrate such that second opening portion having second opening on the second surface and inner diameter decreasing toward the first surface is formed and that the second portion joins the first portion and forms a penetrating hole penetrating through the substrate, forming a first circuit on the first surface, forming a second circuit on the second surface, and filling the hole with plating such that a through-hole conductor which electrically connects the first and second circuits is formed. The first opening has diameter same as or greater than diameter of the second opening, and the first portion has depth less than depth of the second portion.
摘要翻译： 一种制造印刷电路板的方法，包括：在基板的第一表面上照射激光，使得形成在第一表面上具有第一开口的第一开口部分和朝向第二表面减小的内径;在基板的第二表面上照射激光使得第二开口 形成在第二表面上具有第二开口的部分和朝向第一表面减小的内径，并且第二部分接合第一部分并形成穿透基板的穿透孔，在第一表面上形成第一电路，形成第二电路 在第二表面上，并且用电镀填充孔，从而形成电连接第一和第二电路的通孔导体。 第一开口具有与第二开口的直径相同或更大的直径，并且第一部分的深度小于第二部分的深度。
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公开(公告)号：US08698009B2
公开(公告)日：2014-04-15
申请号：US13435450
申请日：2012-03-30
申请人： Kota Noda , Tsutomu Yamauchi
发明人： Kota Noda , Tsutomu Yamauchi
IPC分类号： H05K1/11
CPC分类号： H05K1/115 , H05K1/0269 , H05K3/0032 , H05K3/0038 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K2201/09563 , H05K2201/09827 , H05K2201/09845 , H05K2201/09918 , H05K2203/0554 , H05K2203/1572 , H05K2203/166 , Y10T29/49124 , Y10T29/49155 , Y10T29/49165
摘要： A wiring board having a penetrating hole formed by forming holes with different shapes from both surfaces of a substrate. In such a penetrating hole, the depth of a first opening portion formed in the first-surface side of the substrate is shallower than the depth of a second opening portion formed in the second-surface side, and the diameter of a first opening is greater than the diameter of a second opening. Even if the gravity line of the first opening portion and the gravity line of the second opening portion are shifted from each other, the region of the second opening portion inserted into the inner space of the first opening portion may be made larger.
摘要翻译： 一种布线板，具有通过从基板的两个表面形成具有不同形状的孔而形成的贯通孔。 在这样的贯通孔中，形成在基板的第一表面侧的第一开口部的深度比形成在第二表面侧的第二开口部的深度浅，第一开口的直径更大 比第二开口的直径。 即使第一开口部分的重力线和第二开口部分的重力线彼此偏移，可以使插入第一开口部分的内部空间的第二开口部分的区域更大。
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公开(公告)号：US20120186868A1
公开(公告)日：2012-07-26
申请号：US13435450
申请日：2012-03-30
申请人： Kota Noda , Tsutomu Yamauchi
发明人： Kota Noda , Tsutomu Yamauchi
IPC分类号： H05K1/11
CPC分类号： H05K1/115 , H05K1/0269 , H05K3/0032 , H05K3/0038 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K2201/09563 , H05K2201/09827 , H05K2201/09845 , H05K2201/09918 , H05K2203/0554 , H05K2203/1572 , H05K2203/166 , Y10T29/49124 , Y10T29/49155 , Y10T29/49165
摘要： A wiring board having a penetrating hole formed by forming holes with different shapes from both surfaces of a substrate. In such a penetrating hole, the depth of a first opening portion formed in the first-surface side of the substrate is shallower than the depth of a second opening portion formed in the second-surface side, and the diameter of a first opening is greater than the diameter of a second opening. Even if the gravity line of the first opening portion and the gravity line of the second opening portion are shifted from each other, the region of the second opening portion inserted into the inner space of the first opening portion may be made larger.
摘要翻译： 一种布线板，具有通过从基板的两个表面形成具有不同形状的孔而形成的贯通孔。 在这样的贯通孔中，形成在基板的第一表面侧的第一开口部的深度比形成在第二表面侧的第二开口部的深度浅，第一开口的直径更大 比第二开口的直径。 即使第一开口部分的重力线和第二开口部分的重力线彼此偏移，可以使插入第一开口部分的内部空间的第二开口部分的区域更大。
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公开(公告)号：US08766106B2
公开(公告)日：2014-07-01
申请号：US13434162
申请日：2012-03-29
申请人： Kota Noda , Tsutomu Yamauchi , Satoru Kawai
发明人： Kota Noda , Tsutomu Yamauchi , Satoru Kawai
IPC分类号： H05K1/00
CPC分类号： H05K1/115 , H05K1/0269 , H05K3/0032 , H05K3/0038 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K2201/09254 , H05K2201/09563 , H05K2201/09827 , H05K2201/09845 , H05K2201/09918 , H05K2203/0554 , H05K2203/1572 , H05K2203/166
摘要： A double-sided circuit board including a substrate having a first surface and a second surface on an opposite side of the first surface and having a penetrating hole extending between the first surface and the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor formed in the penetrating hole of the substrate and electrically connecting the first conductive circuit and the second conductive circuit. The penetrating hole comprises a first hole having a first opening with a diameter R1 on the first surface of the substrate, a second hole having a second opening with a diameter R2 on the second surface of the substrate, and a third hole connecting the first hole and the second hole and having a diameter smaller than at least one of R1 and R2.
摘要翻译： 一种双面电路板，包括具有在所述第一表面的相对侧上的第一表面和第二表面的基底，并且具有在所述第一表面和所述第二表面之间延伸的穿透孔，形成在所述第一表面的第一表面上的第一导电电路 所述基板，形成在所述基板的第二表面上的第二导电电路和形成在所述基板的所述贯通孔中的通孔导体，并且电连接所述第一导电电路和所述第二导电电路。 所述贯通孔包括第一孔，所述第一孔具有在所述基底的第一表面上具有直径R1的第一开口，在所述基底的第二表面上具有直径为R2的第二开口的第二孔，以及连接所述第一孔 和第二孔，其直径小于R1和R2中的至少一个。
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公开(公告)号：US20120181076A1
公开(公告)日：2012-07-19
申请号：US13434162
申请日：2012-03-29
申请人： Kota NODA , Tsutomu Yamauchi , Satoru Kawai
发明人： Kota NODA , Tsutomu Yamauchi , Satoru Kawai
IPC分类号： H05K1/11
CPC分类号： H05K1/115 , H05K1/0269 , H05K3/0032 , H05K3/0038 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K2201/09254 , H05K2201/09563 , H05K2201/09827 , H05K2201/09845 , H05K2201/09918 , H05K2203/0554 , H05K2203/1572 , H05K2203/166
摘要： A double-sided circuit board including a substrate having a first surface and a second surface on an opposite side of the first surface and having a penetrating hole extending between the first surface and the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor formed in the penetrating hole of the substrate and electrically connecting the first conductive circuit and the second conductive circuit. The penetrating hole comprises a first hole having a first opening with a diameter R1 on the first surface of the substrate, a second hole having a second opening with a diameter R2 on the second surface of the substrate, and a third hole connecting the first hole and the second hole and having a diameter smaller than at least one of R1 and R2.
摘要翻译： 一种双面电路板，包括具有在所述第一表面的相对侧上的第一表面和第二表面的基底，并且具有在所述第一表面和所述第二表面之间延伸的穿透孔，形成在所述第一表面的第一表面上的第一导电电路 所述基板，形成在所述基板的第二表面上的第二导电电路和形成在所述基板的所述贯通孔中的通孔导体，并且电连接所述第一导电电路和所述第二导电电路。 所述贯通孔包括第一孔，所述第一孔具有在所述基底的第一表面上具有直径R1的第一开口，在所述基底的第二表面上具有直径为R2的第二开口的第二孔，以及连接所述第一孔 和第二孔，其直径小于R1和R2中的至少一个。
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公开(公告)号：US20100307807A1
公开(公告)日：2010-12-09
申请号：US12757157
申请日：2010-04-09
申请人： Kota NODA , Tsutomu Yamauchi , Satoru Kawai
发明人： Kota NODA , Tsutomu Yamauchi , Satoru Kawai
CPC分类号： H05K1/115 , H05K1/0269 , H05K3/0032 , H05K3/0038 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K2201/09254 , H05K2201/09563 , H05K2201/09827 , H05K2201/09845 , H05K2201/09918 , H05K2203/0554 , H05K2203/1572 , H05K2203/166
摘要： A method for manufacturing a double-sided circuit board includes preparing a substrate having the first and second surfaces, forming a first hole having a first opening with a diameter R1 on the first surface of the substrate, forming a second hole having a second opening with a diameter R2 on the second surface of the substrate, forming a third hole having a diameter smaller than R1 and/or R2 and connecting the first and second holes such that a penetrating hole formed of the first hole, the second hole and the third hole is formed in the substrate, forming a first conductive circuit on the first surface of the substrate, forming a second conductive circuit on the second surface of the substrate, and filling the penetrating hole with conductive material such that a through-hole conductor electrically connecting the first conductive circuit and the second conductive circuit is formed.
摘要翻译： 一种制造双面电路板的方法包括制备具有第一和第二表面的基板，在基板的第一表面上形成具有直径为R1的第一开口的第一孔，形成具有第二开口的第二孔， 在所述基板的第二表面上的直径R2，形成直径小于R1和/或R2的第三孔，并且连接所述第一孔和所述第二孔，使得由所述第一孔，所述第二孔和所述第三孔形成的穿透孔 形成在基板上，在基板的第一表面上形成第一导电电路，在基板的第二表面上形成第二导电电路，并用导电材料填充该贯穿孔，使得通孔导体将 形成第一导电电路和第二导电电路。
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