公开(公告)号：US06409582B1

公开(公告)日：2002-06-25

申请号：US09531589

申请日：2000-03-20

申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Shunichiro Kojima ,  Toyomi Nishi

发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Shunichiro Kojima ,  Toyomi Nishi

IPC分类号： B24B722

CPC分类号： B24B37/345 ,  B08B3/02 ,  B24B41/005 ,  H01L21/67051

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus, includes a turntable having a polishing surface thereon, and a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable. A pusher is disposed in a position for transferring the workpiece to and from the top ring, and has a workpiece support which can be lifted to a position close to the top ring for transferring the workpiece to and from the top ring. When the workpiece support receives a polished workpiece and is lowered, a cleaning liquid is ejected substantially simultaneously from three cleaning nozzle units that are disposed in respective three positions to clean the upper and lower surfaces of the workpiece and the lower surface of the top ring.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括其上具有抛光表面的转台和用于保持要抛光的工件的顶环，并将工件压靠在转盘上的抛光表面上。 推动器设置在用于将工件传递到顶环的位置并且具有可以被提升到靠近顶环的位置的工件支撑件，用于将工件传送到顶环和从顶环移出。 当工件支撑件接收到抛光的工件并且被降低时，基本上同时从设置在三个位置的清洁喷嘴单元喷射清洁液体，以清洁工件的上表面和下表面以及顶环的下表面。

公开(公告)号：US6050884A

公开(公告)日：2000-04-18

申请号：US807810

申请日：1997-02-26

申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Shunichiro Kojima ,  Toyomi Nishi

发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Shunichiro Kojima ,  Toyomi Nishi

IPC分类号： B08B3/02 ,  B24B37/34 ,  B24B41/00 ,  H01L21/00 ,  B24B7/22

CPC分类号： B24B37/345 ,  B08B3/02 ,  B24B41/005 ,  H01L21/67051

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, and a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable. A pusher is disposed in a position for transferring the workpiece to and from the top ring, and has a workpiece support which can be lifted to a position close to the top ring for transferring the workpiece to and from the top ring. When the workpiece support receives a polished workpiece and is lowered, a cleaning liquid is ejected substantially simultaneously from three cleaning nozzle units that are disposed in respective three positions to clean the upper and lower surfaces of the workpiece and the lower surface of the top ring.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括其上具有抛光表面的转台和用于保持要抛光的工件的顶环，并将工件压靠在转台上的抛光表面上。 推动器设置在用于将工件传递到顶环的位置并且具有可以被提升到靠近顶环的位置的工件支撑件，用于将工件传送到顶环和从顶环移出。 当工件支撑件接收到抛光的工件并且被降低时，基本上同时从设置在三个位置的清洁喷嘴单元喷射清洁液体，以清洁工件的上表面和下表面以及顶环的下表面。

公开(公告)号：US07198552B2

公开(公告)日：2007-04-03

申请号：US11294365

申请日：2005-12-06

申请人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

发明人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

IPC分类号： B24B1/00

CPC分类号： B24B37/345 ,  B08B1/04 ,  B08B15/02 ,  B24B27/0023 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67219

摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

摘要翻译： 用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台 安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。 抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

公开(公告)号：US07708618B2

公开(公告)日：2010-05-04

申请号：US11980667

申请日：2007-10-31

申请人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

发明人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

IPC分类号： B24B51/00

CPC分类号： H01L21/67161 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/345 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/67745 ,  H01L21/67778 ,  H03M13/39 ,  H04N5/4401 ,  H04N5/455

摘要： A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

摘要翻译： 抛光装置包括用于处理各种操作的多个单元的布置以及具有至少一个臂的机器人。 所述多个单元设置在所述机器人周围，并且包括用于在其上接收的加载单元。 干燥的待抛光工件，包括至少一个用于抛光工件的抛光单元的抛光系统，至少包括一个用于洗涤和干燥抛光的工件的洗涤单元的洗涤系统和干燥系统，以及用于在其上接收的卸载单元 得到清洁和干燥的抛光工件。

公开(公告)号：US20060084369A1

公开(公告)日：2006-04-20

申请号：US11294365

申请日：2005-12-06

申请人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

发明人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

IPC分类号： B24B1/00

CPC分类号： B24B37/345 ,  B08B1/04 ,  B08B15/02 ,  B24B27/0023 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67219

摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

摘要翻译： 用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台 安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。 抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

公开(公告)号：US6074276A

公开(公告)日：2000-06-13

申请号：US215147

申请日：1998-12-18

申请人： Miki Shibata ,  Toyomi Nishi ,  Hidetaka Nakao ,  Tetsuji Togawa

发明人： Miki Shibata ,  Toyomi Nishi ,  Hidetaka Nakao ,  Tetsuji Togawa

IPC分类号： B24B37/04 ,  B24B49/00 ,  B24B55/00 ,  B24B55/12 ,  B24B57/02 ,  H01L21/302 ,  B24B7/24

CPC分类号： B24B57/02 ,  B24B37/005 ,  B24B37/04 ,  B24B49/00 ,  B24B55/00 ,  B24B55/12 ,  H01L21/302 ,  Y10T137/5762

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first liquid leakage sensor provided in the polishing section for detecting a liquid leakage which occurs in the polishing section, and a second liquid leakage sensor provided in the cleaning section for detecting a liquid leakage which occurs in the cleaning section. The polishing apparatus further includes a controlling device for stopping the supply of liquid to the polishing section or the cleaning section in which the liquid leakage occurs when either one of the first and second liquid leakage sensors detects the liquid leakage.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括用于抛光工件表面的抛光部分，用于清洁已经被抛光的工件的清洁部分，设置在用于检测在抛光部分中发生的液体泄漏的抛光部分中的第一液体泄漏传感器，以及 第二液体泄漏传感器，设置在清洁部分中，用于检测在清洁部分中发生的液体泄漏。 抛光装置还包括一个控制装置，用于当第一和第二液体泄漏传感器中的任何一个检测到液体泄漏时，停止向抛光部分或清洁部分供应液体泄漏。

公开(公告)号：USRE38215E1

公开(公告)日：2003-08-12

申请号：US09814060

申请日：2001-03-22

申请人： Miki Shibata ,  Toyomi Nishi ,  Hidetaka Nakao ,  Tetsuji Togawa

发明人： Miki Shibata ,  Toyomi Nishi ,  Hidetaka Nakao ,  Tetsuji Togawa

IPC分类号： B24B724

CPC分类号： B24B57/02 ,  B24B37/005 ,  B24B37/04 ,  B24B49/00 ,  B24B55/00 ,  B24B55/12 ,  H01L21/302 ,  Y10T137/5762

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first liquid leakage sensor provided in the polishing section for detecting a liquid leakage which occurs in the polishing section, and a second liquid leakage sensor provided in the cleaning section for detecting a liquid leakage which occurs in the cleaning section. The polishing apparatus further includes a controlling device for stopping the supply of liquid to the polishing section or the cleaning section in which the liquid leakage occurs when either one of the first and second liquid leakage sensors detects the liquid leakage.

公开(公告)号：US06500051B1

公开(公告)日：2002-12-31

申请号：US08884410

申请日：1997-06-27

申请人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

发明人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

IPC分类号： B24B100

CPC分类号： B24B37/345 ,  B08B1/04 ,  B08B15/02 ,  B24B27/0023 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67219

摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

摘要翻译： 用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台 安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。 抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

公开(公告)号：US20080166949A1

公开(公告)日：2008-07-10

申请号：US11980667

申请日：2007-10-31

申请人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

发明人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

IPC分类号： B24B1/00 ,  B24B27/00

CPC分类号： H01L21/67161 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/345 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/67745 ,  H01L21/67778 ,  H03M13/39 ,  H04N5/4401 ,  H04N5/455

摘要： A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

摘要翻译： 抛光装置包括用于处理各种操作的多个单元的布置以及具有至少一个臂的机器人。 所述多个单元设置在所述机器人周围，并且包括用于在其上接收的加载单元。 干燥的待抛光工件，包括至少一个用于抛光工件的抛光单元的抛光系统，至少包括一个用于洗涤和干燥抛光的工件的洗涤单元的洗涤系统和干燥系统，以及用于在其上接收的卸载单元 得到清洁和干燥的抛光工件。

公开(公告)号：US06413357B1

公开(公告)日：2002-07-02

申请号：US09666855

申请日：2000-09-21

申请人： Tetsuji Togawa ,  Seiji Katsuoka ,  Norio Kimura ,  Toyomi Nishi

发明人： Tetsuji Togawa ,  Seiji Katsuoka ,  Norio Kimura ,  Toyomi Nishi

IPC分类号： C23F102

CPC分类号： B24B53/017 ,  B24B55/045

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus includes a turntable with a polishing cloth mounted on an upper surface thereof, a top ring for supporting the workpiece to be polished and pressing the workpiece against the polishing cloth, and a dressing tool for dressing the polishing cloth on the turntable. The polishing apparatus further includes a cover which covers an upper surface of the turntable for preventing liquid on the turntable from being scattered, and inserting holes formed in an upper wall of the cover for inserting the top ring and the dressing tool therethrough.

摘要翻译： 抛光装置用于通过化学抛光和机械抛光的组合将诸如半导体晶片的工件抛光到平整镜面。 抛光装置包括：具有安装在其上表面上的抛光布的转台，用于支撑待抛光工件的顶环，并将工件压靠在抛光布上;以及修整工具，用于将抛光布修整在转台上。 抛光装置还包括覆盖转盘上表面以防止转台上的液体散落的盖，以及形成在盖的上壁中的插孔，用于插入顶环和修整工具。