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公开(公告)号：US20240258449A1
公开(公告)日：2024-08-01
申请号：US18560876
申请日：2022-05-17
IPC分类号： H01L31/05 , H01L31/028 , H01L31/043 , H01L31/0747
CPC分类号： H01L31/05 , H01L31/028 , H01L31/043 , H01L31/0747
摘要： The invention relates to a multi-junction solar cell comprising at least two sub-cells based on silicon and at least one material other than silicon, wherein a first sub-cell is designed to use photons in a spectral region of a shorter wavelength than a spectral region of a longer wavelength of a second sub-cell, the second sub-cell being based on silicon and the first sub-cell being based on a material which has a larger band gap than silicon, wherein the first sub-cell and the second sub-cell are designed as a monolithic unit consisting of a layer stack, and wherein the first sub-cell and the second sub-cell are electrically connected to one another in series by means of a tunnel diode, such that the tandem solar cell is equipped with two terminals, wherein the tunnel diode has a tunnel diode n layer and a tunnel diode p layer. The problem addressed is that of proposing a multi-junction solar cell of simple construction. The problem is solved by multi-junction solar cells in which the tunnel diode n layer and/or the tunnel diode p layer is/are silicon-based layer(s).
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公开(公告)号：US11967662B2
公开(公告)日：2024-04-23
申请号：US18164779
申请日：2023-02-06
发明人： Jun Zhao , Marcel Koenig
IPC分类号： H01L31/068 , H01L31/0747 , H01L31/20
CPC分类号： H01L31/0682 , H01L31/0747 , H01L31/202
摘要： A backside emitter solar cell structure having a heterojunction, and a method and a device for producing the same. A backside intrinsic layer is first formed on the back side of the substrate, then a frontside intrinsic layer and a frontside doping layer are formed on the front side of the substrate, and finally a backside doping layer is formed on the back side of the substrate.
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公开(公告)号：US20230121979A1
公开(公告)日：2023-04-20
申请号：US17914649
申请日：2021-03-11
发明人： Damien LACHENAL
IPC分类号： H01L31/05 , H01L31/077 , H01L31/18 , H01L31/20 , H01L23/544
摘要： Disclosed is interdigitated back contact (IBC) photovoltaic devices and modules that are based on a silicon structured device which includes: a silicon-based substrate, an intrinsic amorphous silicon layer a-Si:H(i) situated on substrate a first patterned silicon layer, and a second patterned nano-crystalline silicon layer on the first patterned silicon layer. The second patterned layer is of the same type of doping than the first patterned silicon layer The first patterned layer and the second patterned layer form photovoltaic structures, of which at least one constitutes a fiducial mark having, in a predetermined wavelength range, a different optical reflectivity, than the reflectivity of the intrinsic amorphous silicon (a-Si:H(i)) layer portions interstices between the photovoltaic structures. Also disclosed are a photovoltaic device, photovoltaic modules and a method of fabrication of the photovoltaic device.
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公开(公告)号：US11444211B2
公开(公告)日：2022-09-13
申请号：US16348510
申请日：2017-11-09
IPC分类号： H01L31/0216 , H01L31/0224 , H01L31/18 , H01L31/068 , H01L21/02 , H01L21/285
摘要： A monofacial or bifacial crystalline solar cell, on the front face of which over the entire area a first surface passivation layer is arranged directly on the semiconductor interface and above this a first optically opaque, electrically conductive material is arranged in first lateral regions as a front face contact, and a first optically transparent, electrically conductive material is arranged exclusively in second lateral regions. The first optically transparent, electrically conductive material is electrically conductively connected to the front face contact and to a first region of the semiconductor material of the solar cell. The method provides for application of the first optically transparent, electrically conductive material only after the first optically opaque, electrically conductive material has been applied, in such a way that firing of the front face contact is avoided.
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公开(公告)号：US20210151302A1
公开(公告)日：2021-05-20
申请号：US16625459
申请日：2018-06-19
发明人： Hermann SCHLEMM , Mirko KEHR , Erik ANSORGE , Sebastian RASCHKE
IPC分类号： H01J37/32 , C23C16/509 , C23C16/458
摘要： The invention relates to an apparatus for transporting a substrate into or out of a treatment apparatus, to a treatment apparatus, to a method of processing a substrate and to a treatment system having a movement arrangement for moving such an apparatus for transporting a substrate. In this case, the apparatus for transporting a substrate has a substrate carrier that includes a horizontally extending holding area and one or a plurality of gripping arms. The holding area is even and uniform on a first surface facing the substrate, the shape of said holding area substantially corresponding to the shape of the substrate and the area size of said holding area being substantially the same as the area size of the substrate, the substrate being held with its rear side on the holding area merely by its weight. The treatment apparatus has a receiving plate on which the substrate is held during the treatment, the receiving plate having a recess that is suitable for receiving such a substrate carrier during the treatment of the substrate in a first surface.
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公开(公告)号：US10685813B2
公开(公告)日：2020-06-16
申请号：US16341455
申请日：2017-10-10
发明人： Joachim Mai
摘要： The invention relates to a plasma treatment device with a treatment chamber, at least one pair of microwave plasma sources and at least one voltage source. Each pair of microwave plasma sources consists of a first microwave plasma source and a second microwave plasma source, wherein the first and the second microwave plasma source each have a plasma source wall and, within this, a microwave coupling-in device and a plasma electrode. The first and the second microwave plasma source are arranged within the treatment chamber on the same side of one or more substrates to be processed and adjacently to one another. The plasma electrodes of the first microwave plasma source and the second microwave plasma source are electrically insulated from one another and electrically conductively connected to the at least one voltage source. Here, the at least one voltage source is suitable for supplying the plasma electrodes of the first and the second microwave plasma source with different potentials. The invention also relates to a method for operating a plasma treatment device of this kind.
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公开(公告)号：US20190390344A1
公开(公告)日：2019-12-26
申请号：US16432548
申请日：2019-06-05
发明人： JOACHIM MAI , DANNY MUELLER , SEBASTIAN RASCHKE , ANDREAS HEINZE
IPC分类号： C23C16/50 , C23C16/46 , C23C16/458 , C23C16/455
摘要： The present invention relates to a process module comprising at least one evacuable process chamber located in the process module and at least one support device being horizontally moveable through the process module in at least one substrate transport direction for accommodating respectively at least one flat substrate which is to be processed in the process chamber. It is the object of the present invention to provide a process module of the above-mentioned type, which allows a consistent and high-quality processing of all substrates at high production speed and at the lowest device costs possible. Said object is solved by a process module of the above mentioned type in which the at least one process chamber is physically closeable with respect to the process module by means of the support device, the position of which is changeable in at least one closing direction transverse to the substrate transport direction, wherein the at least one support device forms a bottom of the at least one process chamber.
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公开(公告)号：US12009186B2
公开(公告)日：2024-06-11
申请号：US16625459
申请日：2018-06-19
发明人： Hermann Schlemm , Mirko Kehr , Erik Ansorge , Sebastian Raschke
IPC分类号： H01J37/32 , C23C16/458 , C23C16/509
CPC分类号： H01J37/32743 , C23C16/4586 , C23C16/509
摘要： The invention relates to an apparatus for transporting a substrate into or out of a treatment apparatus, to a treatment apparatus, to a method of processing a substrate and to a treatment system having a movement arrangement for moving such an apparatus for transporting a substrate. In this case, the apparatus for transporting a substrate has a substrate carrier that includes a horizontally extending holding area and one or a plurality of gripping arms. The holding area is even and uniform on a first surface facing the substrate, the shape of said holding area substantially corresponding to the shape of the substrate and the area size of said holding area being substantially the same as the area size of the substrate, the substrate being held with its rear side on the holding area merely by its weight. The treatment apparatus has a receiving plate on which the substrate is held during the treatment, the receiving plate having a recess that is suitable for receiving such a substrate carrier during the treatment of the substrate in a first surface.
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公开(公告)号：US20220149225A1
公开(公告)日：2022-05-12
申请号：US17438685
申请日：2020-04-29
发明人： Steffen FRIGGE
IPC分类号： H01L31/18 , H01L31/20 , H01L31/0747
摘要： The present invention relates to a method of production of silicon heterojunction solar cells having at least one stabilization step, wherein the stabilization step is performed after amorphous silicon layers, and preferably also transparent layers or even metallic contact materials, have already been applied beforehand to crystalline silicon solar wafers. The problem addressed by the invention consists in finding an efficient stabilization step which permits high solar cell efficiencies. The problem is solved by a method of production of silicon heterojunction solar cells in which the stabilization step comprises heating the solar cell to temperatures above 200° C. and illumination from a light source, wherein the light source emits light in a wavelength range
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公开(公告)号：US20190169744A1
公开(公告)日：2019-06-06
申请号：US15754943
申请日：2016-08-02
发明人： Sebastian RASCHKE , Erik ANSORGE , Mirko KEHR , Christian BOEHM
IPC分类号： C23C16/458 , C23C16/46 , H01L21/67 , C23C14/50
摘要： A substrate treatment apparatus for treating substrates has a plate-shaped substrate carrier and at least one plate-shaped tempering device, which is arranged parallel to the substrate carrier. The substrate carrier has a substrate carrier front side for supporting at least one laminar substrate and a substrate carrier back side, which faces the tempering device. The object of the present invention is to provide a substrate treatment apparatus which enables a heat distribution as evenly as possible in the substrate carrier. For that purpose, there is provided at least one spacer element for forming a distance between the substrate carrier and the tempering device at the substrate carrier back side and/or a surface of the tempering device facing the substrate carrier.
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