公开(公告)号：US20140056558A1

公开(公告)日：2014-02-27

申请号：US14003561

申请日：2011-03-22

申请人： Satoshi Hirono ,  Naoto Inoue ,  Manabu Ikoma ,  Kiyohiko Gondo ,  Tsuyoshi Miyata ,  Kazunari Komai

发明人： Satoshi Hirono ,  Naoto Inoue ,  Manabu Ikoma ,  Kiyohiko Gondo ,  Tsuyoshi Miyata ,  Kazunari Komai

IPC分类号： G02B6/26 ,  B23K26/38 ,  G02B6/25 ,  G02B6/032 ,  G02B6/02

CPC分类号： G02B6/262 ,  B23K26/386 ,  B23K26/389 ,  G02B6/02052 ,  G02B6/02061 ,  G02B6/02123 ,  G02B6/032 ,  G02B6/25

摘要： An optical fiber has an incident end on which light is incident, an emitting end from which the light is emitted, and an aperture provided in a core located at or near the emitting end. The aperture is formed by irradiating the core with an ultrashort pulsed laser beam having pulse widths of 10−15 seconds to 10−11 seconds.

摘要翻译： 光纤具有光入射的入射端，发射光的发射端和设置在发射端处或附近的芯中的孔。 通过用脉冲宽度为10-15秒至10-11秒的超短脉冲激光束照射芯来形成孔径。

公开(公告)号：US09523818B2

公开(公告)日：2016-12-20

申请号：US14003561

申请日：2011-03-22

申请人： Satoshi Hirono ,  Naoto Inoue ,  Manabu Ikoma ,  Kiyohiko Gondo ,  Tsuyoshi Miyata ,  Kazunari Komai

发明人： Satoshi Hirono ,  Naoto Inoue ,  Manabu Ikoma ,  Kiyohiko Gondo ,  Tsuyoshi Miyata ,  Kazunari Komai

IPC分类号： G02B6/32 ,  G02B6/26 ,  G02B6/02 ,  G02B6/032 ,  G02B6/25 ,  B23K26/38

CPC分类号： G02B6/262 ,  B23K26/386 ,  B23K26/389 ,  G02B6/02052 ,  G02B6/02061 ,  G02B6/02123 ,  G02B6/032 ,  G02B6/25

摘要： An optical fiber has an incident end on which light is incident, an emitting end from which the light is emitted, and an aperture provided in a core located at or near the emitting end. The aperture is formed by irradiating the core with an ultrashort pulsed laser beam having pulse widths of 10−15 seconds to 10−11 seconds.

摘要翻译： 光纤具有光入射的入射端，发射光的发射端和设置在发射端处或附近的芯中的孔。 通过用脉冲宽度为10-15秒至10-11秒的超短脉冲激光束照射芯来形成孔径。

公开(公告)号：US09006750B2

公开(公告)日：2015-04-14

申请号：US14004360

申请日：2011-03-22

申请人： Satoshi Hirono ,  Manabu Ikoma ,  Naoto Inoue ,  Tsuyoshi Miyata ,  Kazunari Komai

发明人： Satoshi Hirono ,  Manabu Ikoma ,  Naoto Inoue ,  Tsuyoshi Miyata ,  Kazunari Komai

IPC分类号： H01L33/54 ,  H01L33/60 ,  H01L31/0203 ,  H01L31/0232

CPC分类号： H01L33/54 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/60 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00 ,  H01L2924/00014

摘要： An optical semiconductor package has a base material that includes a principal surface, an optical semiconductor element that is located on the principal surface of the base material to project or receive light, and an optical transparency sealing layer that seals the optical semiconductor element while covering the principal surface of the base material. An air gap having a shape surrounding an optical axis of the optical semiconductor element is provided in the optical transparency sealing layer such that the light is reflected by an interface of a portion corresponding to an inner circumferential surface of the air gap in an interface formed by the air gap and the optical transparency sealing layer.

摘要翻译： 光学半导体封装具有包括主表面的基材，位于基材的主表面上以投射或接收光的光半导体元件，以及密封光半导体元件同时覆盖该光学半导体元件的光学透明性密封层 基材的主表面。 具有围绕光半导体元件的光轴的形状的气隙设置在光学透明性密封层中，使得光被由与气隙的内周面对应的部分的界面在由 气隙和光学透明度密封层。

公开(公告)号：US20140042478A1

公开(公告)日：2014-02-13

申请号：US14004360

申请日：2011-03-22

申请人： Satoshi Hirono ,  Manabu Ikoma ,  Naoto Inoue ,  Tsuyoshi Miyata ,  Kazunari Komai

发明人： Satoshi Hirono ,  Manabu Ikoma ,  Naoto Inoue ,  Tsuyoshi Miyata ,  Kazunari Komai

IPC分类号： H01L33/54 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/60

CPC分类号： H01L33/54 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/60 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00 ,  H01L2924/00014

摘要： An optical semiconductor package has a base material that includes a principal surface, an optical semiconductor element that is located on the principal surface of the base material to project or receive light, and an optical transparency sealing layer that seals the optical semiconductor element while covering the principal surface of the base material. An air gap having a shape surrounding an optical axis of the optical semiconductor element is provided in the optical transparency sealing layer such that the light is reflected by an interface of a portion corresponding to an inner circumferential surface of the air gap in an interface formed by the air gap and the optical transparency sealing layer.

摘要翻译： 光学半导体封装具有包括主表面的基材，位于基材的主表面上以投射或接收光的光半导体元件，以及密封光半导体元件同时覆盖该光学半导体元件的光学透明性密封层 基材的主表面。 具有围绕光半导体元件的光轴的形状的气隙设置在光学透明性密封层中，使得光被由与气隙的内周面对应的部分的界面在由 气隙和光学透明度密封层。