公开(公告)号：US20140056558A1

公开(公告)日：2014-02-27

申请号：US14003561

申请日：2011-03-22

申请人： Satoshi Hirono ,  Naoto Inoue ,  Manabu Ikoma ,  Kiyohiko Gondo ,  Tsuyoshi Miyata ,  Kazunari Komai

发明人： Satoshi Hirono ,  Naoto Inoue ,  Manabu Ikoma ,  Kiyohiko Gondo ,  Tsuyoshi Miyata ,  Kazunari Komai

IPC分类号： G02B6/26 ,  B23K26/38 ,  G02B6/25 ,  G02B6/032 ,  G02B6/02

CPC分类号： G02B6/262 ,  B23K26/386 ,  B23K26/389 ,  G02B6/02052 ,  G02B6/02061 ,  G02B6/02123 ,  G02B6/032 ,  G02B6/25

摘要： An optical fiber has an incident end on which light is incident, an emitting end from which the light is emitted, and an aperture provided in a core located at or near the emitting end. The aperture is formed by irradiating the core with an ultrashort pulsed laser beam having pulse widths of 10−15 seconds to 10−11 seconds.

摘要翻译： 光纤具有光入射的入射端，发射光的发射端和设置在发射端处或附近的芯中的孔。 通过用脉冲宽度为10-15秒至10-11秒的超短脉冲激光束照射芯来形成孔径。

公开(公告)号：US09523818B2

公开(公告)日：2016-12-20

申请号：US14003561

申请日：2011-03-22

申请人： Satoshi Hirono ,  Naoto Inoue ,  Manabu Ikoma ,  Kiyohiko Gondo ,  Tsuyoshi Miyata ,  Kazunari Komai

发明人： Satoshi Hirono ,  Naoto Inoue ,  Manabu Ikoma ,  Kiyohiko Gondo ,  Tsuyoshi Miyata ,  Kazunari Komai

IPC分类号： G02B6/32 ,  G02B6/26 ,  G02B6/02 ,  G02B6/032 ,  G02B6/25 ,  B23K26/38

CPC分类号： G02B6/262 ,  B23K26/386 ,  B23K26/389 ,  G02B6/02052 ,  G02B6/02061 ,  G02B6/02123 ,  G02B6/032 ,  G02B6/25

摘要： An optical fiber has an incident end on which light is incident, an emitting end from which the light is emitted, and an aperture provided in a core located at or near the emitting end. The aperture is formed by irradiating the core with an ultrashort pulsed laser beam having pulse widths of 10−15 seconds to 10−11 seconds.

摘要翻译： 光纤具有光入射的入射端，发射光的发射端和设置在发射端处或附近的芯中的孔。 通过用脉冲宽度为10-15秒至10-11秒的超短脉冲激光束照射芯来形成孔径。

公开(公告)号：US20140042478A1

公开(公告)日：2014-02-13

申请号：US14004360

申请日：2011-03-22

申请人： Satoshi Hirono ,  Manabu Ikoma ,  Naoto Inoue ,  Tsuyoshi Miyata ,  Kazunari Komai

发明人： Satoshi Hirono ,  Manabu Ikoma ,  Naoto Inoue ,  Tsuyoshi Miyata ,  Kazunari Komai

IPC分类号： H01L33/54 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/60

CPC分类号： H01L33/54 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/60 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00 ,  H01L2924/00014

摘要： An optical semiconductor package has a base material that includes a principal surface, an optical semiconductor element that is located on the principal surface of the base material to project or receive light, and an optical transparency sealing layer that seals the optical semiconductor element while covering the principal surface of the base material. An air gap having a shape surrounding an optical axis of the optical semiconductor element is provided in the optical transparency sealing layer such that the light is reflected by an interface of a portion corresponding to an inner circumferential surface of the air gap in an interface formed by the air gap and the optical transparency sealing layer.

摘要翻译： 光学半导体封装具有包括主表面的基材，位于基材的主表面上以投射或接收光的光半导体元件，以及密封光半导体元件同时覆盖该光学半导体元件的光学透明性密封层 基材的主表面。 具有围绕光半导体元件的光轴的形状的气隙设置在光学透明性密封层中，使得光被由与气隙的内周面对应的部分的界面在由 气隙和光学透明度密封层。

公开(公告)号：US09006750B2

公开(公告)日：2015-04-14

申请号：US14004360

申请日：2011-03-22

申请人： Satoshi Hirono ,  Manabu Ikoma ,  Naoto Inoue ,  Tsuyoshi Miyata ,  Kazunari Komai

发明人： Satoshi Hirono ,  Manabu Ikoma ,  Naoto Inoue ,  Tsuyoshi Miyata ,  Kazunari Komai

IPC分类号： H01L33/54 ,  H01L33/60 ,  H01L31/0203 ,  H01L31/0232

CPC分类号： H01L33/54 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/60 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00 ,  H01L2924/00014

摘要： An optical semiconductor package has a base material that includes a principal surface, an optical semiconductor element that is located on the principal surface of the base material to project or receive light, and an optical transparency sealing layer that seals the optical semiconductor element while covering the principal surface of the base material. An air gap having a shape surrounding an optical axis of the optical semiconductor element is provided in the optical transparency sealing layer such that the light is reflected by an interface of a portion corresponding to an inner circumferential surface of the air gap in an interface formed by the air gap and the optical transparency sealing layer.

摘要翻译： 光学半导体封装具有包括主表面的基材，位于基材的主表面上以投射或接收光的光半导体元件，以及密封光半导体元件同时覆盖该光学半导体元件的光学透明性密封层 基材的主表面。 具有围绕光半导体元件的光轴的形状的气隙设置在光学透明性密封层中，使得光被由与气隙的内周面对应的部分的界面在由 气隙和光学透明度密封层。

公开(公告)号：US07288287B2

公开(公告)日：2007-10-30

申请号：US10467338

申请日：2001-03-02

申请人： Hirokazu Tanaka ,  Satoshi Hirono

发明人： Hirokazu Tanaka ,  Satoshi Hirono

IPC分类号： B05D3/06

CPC分类号： H05K3/4661 ,  C23C18/1608 ,  C23C18/204 ,  C23C18/30 ,  C25D5/02 ,  C25D5/56 ,  H05K3/0035 ,  H05K3/188 ,  H05K2201/0209 ,  H05K2201/0323 ,  H05K2203/0759 ,  H05K2203/107 ,  H05K2203/1136 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The insulating layer formation step of forming an insulating layer 24-1 on a base for resin application 20 by applying polymeric material, which has been diluted with a solvent, filled with inorganic filler to the base for resin application and by drying the base for resin application; the circuit formation portion forming step of creating a circuit formation portion and a via hole 25 in insulating layer 24-1 that has been formed in the above described insulating layer formation step by means of a laser treatment; and the circuit formation step of forming a circuit 23-1 by plating the circuit formation portion and via hole 25 that have been created in the above described circuit formation portion forming step are provided and the insulating layer formation step, the circuit formation portion forming step and the circuit formation step are repeated a plurality of times in this order and, thereby, a circuit formation part (multi-layered substrate) is manufactured. Accordingly, a multi-layered circuit, even of more than three layers, having an arbitrary circuit formation can easily be manufactured at a low cost.

摘要翻译： 绝缘层形成步骤，通过将已经用溶剂稀释的填充有无机填料的聚合物材料涂覆在树脂涂覆用基材上，并通过干燥树脂基材而在树脂涂布用基材20上形成绝缘层24-1 应用; 电路形成部分形成步骤，通过激光处理在上述绝缘层形成步骤中形成绝缘层24-1中的电路形成部分和通孔25; 并且设置通过电镀在上述电路形成部分形成步骤中产生的电路形成部分和通孔25形成电路23-1的电路形成步骤，并且绝缘层形成步骤，电路形成部分形成步骤 并且电路形成步骤依次重复多次，从而制造电路形成部分（多层基板）。 因此，可以容易地以低成本制造具有任意电路形成的多层三层以上的多层电路。