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1.发明授权Curing agent, curable compositions, compositions for optical materials, optical materials, their production and liquid crystal displays and LED's made by using the materials 有权固化剂，可固化组合物，光学材料的组合物，光学材料，它们的生产和液晶显示器以及使用这些材料制成的LED公开(公告)号：US07560145B2
公开(公告)日：2009-07-14
申请号：US10433981
申请日：2001-12-10
CPC分类号： C08G77/50 , C08G77/485 , C08G77/52 , C08G77/54 , C08K5/34924 , H01L33/56 , H01L2924/0002 , Y10T428/10 , Y10T428/1068 , Y10T428/1082 , Y10T428/31663 , H01L2924/00
摘要： The invention aims at a curing agent, curable compositions or compositions for optical materials, capable of providing for cured artifacts having laudable heat resistance, optical transparency, and light resistance; optical materials and methods for their production; and liquid crystal displays and LED's made by using the materials. A curing agent, which comprises at least two SiH groups, is obtainable by subjecting an aliphatic organic compound (α1) and an acyclic and/or cyclic polyorganosiloxane (β1) to hydrosilylation reaction. The curing agent is also obtainable by subjecting an organic compound (α2) and a cyclic polyorganosiloxane (β2) to hydrosilylation reaction.
摘要翻译： 本发明旨在提供一种固化剂，可固化组合物或用于光学材料的组合物，其能够提供具有可评价的耐热性，光学透明性和耐光性的固化伪影; 光学材料及其生产方法; 液晶显示器和使用该材料制成的LED。 包含至少两个SiH基的固化剂可通过将脂族有机化合物（α1）和无环和/或环状聚有机硅氧烷（β1）进行氢化硅烷化反应而获得。 固化剂也可以通过使有机化合物（α2）和环状聚有机硅氧烷（β2）进行氢化硅烷化反应而获得。
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2.发明授权Curable composition, composition for optical material, optical material, liquid-crystal display device, transparent conductive film, and process for producing the same 有权可固化组合物，光学材料组合物，光学材料，液晶显示装置，透明导电膜及其制造方法公开(公告)号：US07470457B2
公开(公告)日：2008-12-30
申请号：US10239777
申请日：2001-04-20
申请人： Manabu Tsumura , Katsuya Ouchi , Kazunori Yokoyama
发明人： Manabu Tsumura , Katsuya Ouchi , Kazunori Yokoyama
IPC分类号： G02F1/1333
CPC分类号： G02F1/13439 , C08G77/50 , G02B1/04 , G02F1/1333 , G02F1/133305 , Y10T428/1068 , Y10T428/1086 , C08L83/04 , C08L83/14
摘要： A curable composition comprising: component (A), which is an aliphatic organic compound including at least two carbon-carbon double bonds within one molecule, the at least two carbon-carbon double bonds having reactivity with an SiH group; component (B), which is a compound including at least two SiH groups within one molecule; and component (C), which is a hydrosilylation catalyst. The curable composition can be made into an optical material by being previously mixed so as to allow the carbon-carbon double bonds having reactivity with an SiH group to react with some or all of the SiH groups in the composition, thereby causing curing. There is provided a curable composition having a high heat-resistance, a low birefringence, a small coefficient of photoelasticity, a high optical transparency, and toughness; an optical material; a method for producing the same; and a liquid crystal display device incorporating the same.
摘要翻译： 一种可固化组合物，其包含：组分（A），其是在一分子内包含至少两个碳 - 碳双键的脂族有机化合物，所述至少两个碳 - 碳双键与SiH基具有反应性; 组分（B），其是在一个分子内包含至少两个SiH基团的化合物; 和组分（C），其为氢化硅烷化催化剂。 可以通过预先混合使可固化组合物制成光学材料，以使具有与SiH基反应性的碳 - 碳双键与组合物中的一些或全部SiH基团反应，从而引起固化。 提供了耐热性高，双折射低，光弹性系数小，光学透明性高，韧性高的固化性组合物。 光学材料; 其制造方法; 以及包含该液晶显示装置的液晶显示装置。
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3.发明授权Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product 有权硬化组合物，硬化产品，其制造方法和用硬化产品密封的发光二极管公开(公告)号：US07371462B2
公开(公告)日：2008-05-13
申请号：US10512135
申请日：2003-04-23
申请人： Manabu Tsumura , Masahito Ide , Katsuya Ouchi , Masafumi Kuramoto , Tomohide Miki , Ikuya Nii
发明人： Manabu Tsumura , Masahito Ide , Katsuya Ouchi , Masafumi Kuramoto , Tomohide Miki , Ikuya Nii
CPC分类号： C08L63/00 , C08F8/42 , C08G77/12 , C08G77/42 , C08G77/50 , C08G77/54 , C08K5/54 , C08L83/10 , C08L83/14 , H01L33/56 , H01L2924/0002 , Y10T428/31663 , C08L83/04 , H01L2924/00
摘要： The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency.A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.
摘要翻译： 本发明提供了提供具有优异的粘合性和高透明度的固化产物的固化性组合物，或者具有高韧性和透明度的固化产物。 一种可固化组合物，其包含（A）在每个分子中含有至少两个与SiH基反应的碳 - 碳双键的有机化合物，（B）在每个分子中具有至少两个SiH基团的硅化合物，（C）氢化硅烷化 催化剂，（D）硅烷偶联剂和/或含环氧基的化合物，和（E）硅烷醇缩合催化剂。 一种用可固化的可固化组合物获得的固化产品密封的发光二极管。
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4.发明申请Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product 有权硬化组合物，硬化产品，其制造方法和用硬化产品密封的发光二极管公开(公告)号：US20050209400A1
公开(公告)日：2005-09-22
申请号：US10512135
申请日：2003-04-23
申请人： Manabu Tsumura , Masahito Ide , Katsuya Ouchi , Masufumi Kuramoto , Tomohide Miki , Ikuya Nii
发明人： Manabu Tsumura , Masahito Ide , Katsuya Ouchi , Masufumi Kuramoto , Tomohide Miki , Ikuya Nii
IPC分类号： C08F8/00 , C08F8/42 , C08G77/42 , C08G77/50 , C08G77/54 , C08K5/54 , C08L63/00 , C08L83/00 , C08L83/05 , C08L83/10 , C08L83/14 , H01L33/56
CPC分类号： C08L63/00 , C08F8/42 , C08G77/12 , C08G77/42 , C08G77/50 , C08G77/54 , C08K5/54 , C08L83/10 , C08L83/14 , H01L33/56 , H01L2924/0002 , Y10T428/31663 , C08L83/04 , H01L2924/00
摘要： The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency. A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.
摘要翻译： 本发明提供了提供具有优异的粘合性和高透明度的固化产物的固化性组合物，或具有高韧性和透明度的固化产物。 一种可固化组合物，其包含（A）在每个分子中含有至少两个与SiH基反应的碳 - 碳双键的有机化合物，（B）在每个分子中具有至少两个SiH基团的硅化合物，（C）氢化硅烷化 催化剂，（D）硅烷偶联剂和/或含环氧基的化合物，和（E）硅烷醇缩合催化剂。 一种用可固化的可固化组合物获得的固化产品密封的发光二极管。
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公开(公告)号：US20060243947A1
公开(公告)日：2006-11-02
申请号：US10546905
申请日：2004-02-25
IPC分类号： C09K19/52
CPC分类号： C08G77/452 , C08F283/00 , C08F290/06 , C08F290/14 , C08G77/485 , C08G77/54 , C08K3/22 , C08L51/003 , C08L53/00 , C08L83/04 , C08L101/00 , H01L23/295 , H01L33/44 , H01L2924/0002 , H01L2924/12044 , Y10T428/31663 , Y10T428/31786 , C08L2666/02 , H01L2924/00
摘要： The invention aims at providing A light-shielding paste which contains a thermoplastic resin and an inorganic member as essential components; A light-shielding paste which contains a thermosetting resin and an inorganic member as essential components; A curable composition which contains, as essential components, (A) an organic compound comprising an organic main chain containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, (E) a silanol condensation catalyst, and (F) an inorganic member; The above curable composition which further contains (G) silica; The above curable composition which shows such a flow leveling property that when the composition is allowed to stand on a glass substrate inclined at an angle of 80 degrees at 100° C. for 1 hour, the flow-out distance is not longer than 2 cm; A light-shielding paste which comprises the above curable composition; or, A method of forming a light-shielding resin layer on a LED package having an aperture comprising a bottom and sidewalls and formed of a molding resin by a monolithic process with the respective ends of an external positive electrode and an external negative electrode being exposed at a predetermined distance on the aperture bottom which method comprises (1) applying a light-shielding paste to a substrate; (2) bringing the LED package aperture into close contact therewith; and (3) heating the LED package with the aperture facing upward; and thereby the light-shielding paste is allowed to spread along the package sidewalls alone. The curable composition of the invention is excellent in light-shielding ability and is highly resistant to light and, therefore, can be used as a light-shielding paste. Further, the curable composition of the invention is low in fluidity and, therefore, light-emitting diodes with the curing product formed on the LED package sidewalls alone can be obtained by using that curable composition. Furthermore, according to the method of light-shielding resin layer formation according to the invention, it is possible to efficiently apply a light-shielding paste to the LED package sidewalls alone for light-shielding resin layer formation, whereby the productivity is markedly improved.
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6.发明授权Curable composition and method of preparing same, light-shielding paste, light-shielding resin and method of forming same, light-emitting diode package and semiconductor device 有权可固化组合物及其制备方法，遮光膏，遮光树脂及其形成方法，发光二极管封装和半导体器件公开(公告)号：US07785715B2
公开(公告)日：2010-08-31
申请号：US10546905
申请日：2004-02-25
CPC分类号： C08G77/452 , C08F283/00 , C08F290/06 , C08F290/14 , C08G77/485 , C08G77/54 , C08K3/22 , C08L51/003 , C08L53/00 , C08L83/04 , C08L101/00 , H01L23/295 , H01L33/44 , H01L2924/0002 , H01L2924/12044 , Y10T428/31663 , Y10T428/31786 , C08L2666/02 , H01L2924/00
摘要： A light-shielding paste which contains a thermoplastic resin and an inorganic member as essential components or which contains a thermosetting resin and an inorganic member as essential components is provided. A curable composition and light-shielding paste comprising the composition are provided which contains, as essential components, (A) an organic compound comprising an organic main chain containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, (E) a silanol condensation catalyst, and (F) an inorganic member. The curable composition can further contain (G) silica. Also provided is a method of forming a light-shielding resin layer on a LED package having an aperture comprising a bottom and sidewalls. The curable composition is excellent in light-shielding ability.
摘要翻译： 提供了含有热塑性树脂和无机部件作为必要成分或含有热固性树脂和无机部件作为必要成分的遮光膏。 提供了包含该组合物的可固化组合物和遮光膏，其包含作为必要组分的（A）包含在每个分子中含有至少两个与SiH基反应的碳 - 碳双键的有机主链的有机化合物（ B）在每个分子中具有至少两个SiH基团的硅化合物，（C）氢化硅烷化催化剂，（D）硅烷偶联剂和/或含环氧基化合物，（E）硅烷醇缩合催化剂，和（F ）无机成员。 可固化组合物还可含有（G）二氧化硅。 还提供了在具有包括底部和侧壁的孔的LED封装上形成遮光树脂层的方法。 该固化性组合物的遮光能力优异。
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公开(公告)号：US08263725B2
公开(公告)日：2012-09-11
申请号：US12159137
申请日：2006-12-26
申请人： Yoshikatsu Ichiryu , Katsuya Ouchi
发明人： Yoshikatsu Ichiryu , Katsuya Ouchi
IPC分类号： C08G77/04 , C08G77/42 , C08G65/22 , C08F283/12
CPC分类号： C08G59/306 , B33Y70/00 , C08G59/3254 , C08G65/18 , C08G65/22 , C08G77/045 , C08G77/12 , C08G77/14 , C08G77/38 , C08G77/458 , C08G77/485 , C08G77/54 , C08K5/1515 , C08K5/1525 , C08L83/14
摘要： Cured products constituted with conventional epoxy compounds have been disadvantageous in heat-resistant and light-resistant transparency, and crack resistance. An object of the present invention is to provide: a modified polyorganosiloxane compound having an epoxy group and/or an oxetanyl group which provides a cured product that is excellent in heat-resistant and light-resistant transparency, and crack resistance; a curable composition thereof; and a cured product obtained by curing the same. Disclosed is a modified polyorganosiloxane compound having two or more epoxy group and/or oxetanyl group in a molecule, the compound being a hydrosilylation reaction product of the following compounds: (α1) an organic compound having 2 to 6 carbon-carbon double bonds reactive with a SiH group in a molecule; (β1) a linear and/or cyclic polyorganosiloxane compound having at least two SiH groups in a molecule; and (γ1) an organic compound having at least one epoxy group or oxetanyl group and one carbon-carbon double bond reactive with a SiH group in a molecule.
摘要翻译： 由常规环氧化合物构成的固化产品在耐热和耐光透明性，耐裂纹性方面都是不利的。 本发明的目的是提供：具有环氧基和/或氧杂环丁烷基的改性聚有机硅氧烷化合物，其提供耐热和耐光透明性优异，耐裂纹性优异的固化物; 其可固化组合物; 和通过固化而得到的固化物。 公开了分子中具有两个以上环氧基和/或氧杂环丁烷基的改性聚有机硅氧烷化合物，该化合物为下述化合物的氢化硅烷化反应产物：（α1）具有2〜6个碳 - 碳双键的有机化合物与 分子中的SiH基团; （＆bgr; 1）分子中具有至少两个SiH基团的线性和/或环状聚有机硅氧烷化合物; 和（γ1）在分子中具有至少一个环氧基或氧杂环丁烷基的有机化合物和与SiH基反应的一个碳 - 碳双键。
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公开(公告)号：US20100041810A1
公开(公告)日：2010-02-18
申请号：US12514417
申请日：2007-11-22
CPC分类号： C09K3/10 , C08G77/08 , C08K3/16 , C08K3/26 , C08K3/36 , C08K5/16 , C08L21/00 , C08L101/10 , C08L71/02
摘要： An object of the present invention is to provide a curable composition made mainly of an organic polymer having a reactive silicon group, exhibits a good curability without using any organic tin compound substantially, and gives a cured product having a sufficient strength; and to provide a catalyst composition. The object is solved by a curable composition, comprising a polymer (A) having a silicon-containing group which can be crosslinked by forming a siloxane bond, and a fluoride salt compound (B).
摘要翻译： 本发明的目的是提供一种主要由具有反应性硅基团的有机聚合物制成的可固化组合物，而基本上不使用任何有机锡化合物显示出良好的固化性，并且得到具有足够强度的固化产物; 并提供催化剂组合物。 该目的是通过可固化组合物来解决的，该组合物包含具有可通过形成硅氧烷键而交联的含硅基团的聚合物（A）和氟化物盐化合物（B）。
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9.发明授权Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode 有权可固化树脂组合物，可固化树脂组合物片，模塑体，半导体封装，半导体组件和发光二极管公开(公告)号：US09178120B2
公开(公告)日：2015-11-03
申请号：US13638992
申请日：2011-03-30
申请人： Tadashi Kokubo , Katsuya Ouchi , Takahisa Iwahara , Kazuhiko Hirabayashi , Hiroshi Okoshi , Tomokazu Tozawa , Shuhei Ozaki
发明人： Tadashi Kokubo , Katsuya Ouchi , Takahisa Iwahara , Kazuhiko Hirabayashi , Hiroshi Okoshi , Tomokazu Tozawa , Shuhei Ozaki
IPC分类号： H01L33/56 , H01L23/29 , H01L33/60 , H01L23/31 , C08K3/22 , C08K3/36 , C08K5/098 , H01L23/495 , H01L33/62
CPC分类号： H01L33/56 , C08K3/22 , C08K3/36 , C08K5/098 , C08K2003/2241 , H01L23/295 , H01L23/296 , H01L23/3171 , H01L23/49586 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.
摘要翻译： 本发明的目的在于提供一种固化性树脂组合物，其具有低的线性膨胀系数的固化物。 本发明的固化性树脂组合物含有作为必要成分的（A）每分子具有至少两个与SiH基反应的碳 - 碳双键的有机化合物，（B）每分子含有至少两个SiH基的化合物， （C）氢化硅烷化催化剂，（D）每分子具有至少一个与SiH基反应的碳 - 碳双键的硅氧烷化合物和（E）无机填料。
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公开(公告)号：US08815985B2
公开(公告)日：2014-08-26
申请号：US12526751
申请日：2008-02-13
申请人： Katsuyu Wakabayashi , Katsuya Ouchi
发明人： Katsuyu Wakabayashi , Katsuya Ouchi
CPC分类号： C08L83/04 , C08G65/2609 , C08G65/2663 , C08G65/336 , C08G65/337 , C08K5/16 , C08K5/31 , C08K5/5419 , C08K5/5425 , C08L101/10 , C08L2312/08 , C09D133/08 , C09J171/02 , C09K3/10 , C09K2200/0239 , C09K2200/0657
摘要： An object of the present invention is to provide a curable composition which is made mainly of a polymer having one or more reactive silicon groups, has good curability even when filler is used while a non-organotin catalyst is used, and is further high in industrial practicability. The object is solved by a curable composition, comprising, as constituents, a polymer (A) having one or more reactive silicon groups on average per molecule thereof, the reactive silicon group(s) being (each) a group which can be crosslinked by forming a siloxane bond, a Lewis acid and/or derivative thereof (B), an amine compound (C), a compound (D) having a reactive silicon group, and filler (E), and obtained by mixing the constituents with each other.
摘要翻译： 本发明的目的是提供一种主要由具有一个或多个反应性硅基团的聚合物制成的可固化组合物，即使使用非有机锡催化剂，即使使用填料也具有良好的固化性，并且工业上更高 实用性。 该目的通过一种可固化组合物来解决，该组合物包含平均每分子具有一个或多个反应性硅基团的聚合物（A），反应性硅基团为（各自）可以被 形成硅氧烷键，路易斯酸和/或其衍生物（B），胺化合物（C），具有反应性硅基团的化合物（D）和填料（E），并且通过将组分彼此混合 。
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