Abstract:
A non-volatile memory device integrated in a chip of semiconductor material. An embodiment of a memory device includes a plurality of memory cells. Each memory cell includes a first well and a second well of a first type of conductivity that are formed in an insulating region of a second type of conductivity. The memory cell further includes a first, a second, and a third region of the second type of conductivity that are formed in the first well; these regions define a selection transistor of MOS type and a storage transistor of floating gate MOS type that are coupled in series. Moreover, the memory device includes a selection gate of the selection transistor, a floating gate of the storage transistor, and a control gate of the storage transistor formed in the second well; the control gate is capacitively coupled with the floating gate.
Abstract:
An embodiment of a non-volatile memory device integrated in a chip of semiconductor material is proposed. The memory device includes a plurality of memory cells. Each memory cell includes a first well and a second well of first type of conductivity that are formed in an insulating region of a second type of conductivity. The memory cell further includes a first, a second, a third and a fourth region of the second type of conductivity that are formed in the first well; these regions define a sequence of a first selection transistor of MOS type, a storage transistor of floating gate MOS type, and a second selection transistor of MOS type that are coupled in series. The first region is short-circuited to the first well. Moreover, the memory device includes a first gate of the first selection transistor, a second gate of the second selection transistor, and a floating gate of the storage transistor. A control gate of the storage transistor is formed in the second well; the control gate is capacitively coupled with the floating gate.
Abstract:
An embodiment of a non-volatile memory device integrated in a chip of semiconductor material is proposed. The memory device includes a plurality of memory cells. Each memory cell includes a first well and a second well of first type of conductivity that are formed in an insulating region of a second type of conductivity. The memory cell further includes a first, a second, a third and a fourth region of the second type of conductivity that are formed in the first well; these regions define a sequence of a first selection transistor of MOS type, a storage transistor of floating gate MOS type, and a second selection transistor of MOS type that are connected in series. The first region is short-circuited to the first well. Moreover, the memory device includes a first gate of the first selection transistor, a second gate of the second selection transistor, and a floating gate of the storage transistor. A control gate of the storage transistor is formed in the second well; the control gate is capacitively coupled with the floating gate.
Abstract:
An embodiment of non-volatile memory device integrated in a chip of semiconductor material is proposed. The memory includes at least one sector of a plurality of memory cells; each sector includes a storage region of a first type of conductivity and a further storage region of a second type of conductivity. Each memory cell includes a first region and a second region of the second type of conductivity, which are formed in the storage region for defining a storage transistor of floating gate MOS type of the first type of conductivity; the memory cell likewise includes a further first region and a further second region of the first type of conductivity, which are formed in the further storage region for defining a further storage transistor of floating gate MOS type of the second type of conductivity. The memory cell also includes a common floating gate of the storage transistor and the further storage transistor. The memory device further includes programming means for programming each memory cell individually by programming the corresponding floating gate through the corresponding storage transistor, and erasing means for erasing each memory cell individually by erasing the corresponding floating gate through the corresponding further storage transistor.
Abstract:
An application-specific embeddable flash memory having three content-specific I/O ports and delivering a peak read throughput of 1.2 GB/s. The memory is combined with a special automatic programming gate voltage ramp generator circuit having a programming rate of 1 Mbyte/s for non-volatile storage of code, data, and embedded FPGA bit stream configurations. The test chip uses a NOR-type 0.18 μm flash embedded technology with 1.8V power supply, two poly, six metal and memory cell size of 0.35 μm2.
Abstract:
Level shifter translator of the type comprising at least one first transistor and one second MOS transistor belonging to respective circuit branches connected with a first common conduction terminal and connected towards a first potential reference and receiving, on the respective conduction terminals, input differential voltages, the first and the second transistor have respective circuit branches referring to a biasing circuit with current mirror, a third transistor allows to couple the second transistor to said biasing circuit, an inverter connected to an output of said the circuit with the output driving the third transistor.
Abstract:
A circuit having a current mirror circuit with a first node and a second node connected, respectively, to a controllable current source and to a common node connected to the drain terminals of selected memory cells. A first operational amplifier has inputs connected to the first node and the second node, and an output connected to a control terminal of the selected memory cells and forming the circuit output. A second operational amplifier has a first input connected to a ramp generator, a second input connected to the circuit output, and an output connected to a control input of the controllable current source. Thereby, two negative feedback loops keep the drain terminals of the selected memory cells at a voltage value sufficient for programming, and feed the control terminal of the memory cells with a ramp voltage that causes writing of the selected memory cells. The presence of a bias source between the second node and the common node enables use of the same circuit also during reading.
Abstract:
A programming method for a nonvolatile memory includes the steps of: a) determining a current value of the threshold voltage; b) acquiring a target value of the threshold voltage; c) calculating a first number of gate voltage pulses necessary to take the threshold voltage from the current value to the target value; d) applying a second number of consecutive voltage pulses to the gate terminal of the cell, the second number being correlated to the first number and having a uniformly increasing amplitude; e) then measuring a current value of the threshold voltage; and repeating steps c) to e) until a final threshold value is obtained.
Abstract:
The speed of a capacitive cell RAAM used for storing an optical image as electric charge is greatly enhanced by presampling the serial analog input signal on two rows or lines of presampling capacitors, each composed of the same number of capacitors as the number of columns of the capacitive cell RAAM and by "writing" in a parallel mode the selected row of said memory. The values stored in the capacitors of one of said two presampling rows are transferred (written) in the corresponding cells of the selected row of the memory while presampling continues on the other row of presampling capacitors.
Abstract:
A column decoder is for a phase-change memory device provided with an array of memory cells, a reading stage for reading data contained in the memory cells, and a programming stage for programming the data. The column decoder selects and enables biasing of a bitline of the array and generates a current path between the bitline and the reading stage or, alternatively, the programming stage, respectively during a reading or a programming operation of the contents of the memory cells. In the column decoder, a first decoder circuit generates a first current path between the bitline and the reading stage, and a second decoder circuit, distinct and separate from the first decoder circuit, generates a second current path, distinct from the first current path, between the bitline and the programming stage.